Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Polymer Property : Density = 1.92 g/cc Product List

Physical Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.
Physical Properties Metric English Comments
Density 1.92 g/cc
0.0694 lb/in³
ASTM D792
Rogers Corporation RO4835 Hydrocarbon Ceramic Laminate, Improved Oxidation Resistance
Features and Benefits:Significantly improved oxidation resistance compared to typical thermoset microwave materialsDesigned for performance sensitive, high volume applicationsLow loss - Excellent el..
Density 1.92 g/cc
0.0694 lb/in³
50% Resin Content; Internal Method
Park Electrochemical Nelco® N4000-2 Multifunctional Epoxy Laminate and Prepreg
The Nelco® N4000-2 is the most established material of Nelco’s product line. This multifunctional epoxy laminate and prepreg system has a long history of use and one of the broadest operating and ..
Density 1.92 g/cc
0.0694 lb/in³
50% Resin Content; Internal Method
Park Electrochemical Nelco® N4000-7 EF® Halogen-Free Epoxy
The Nelco® N4000-7 EF® series of laminates and prepregs is a total environmental solution. This advanced halogen-free resin system provides superior CAF resistance for high temperature, lead-free ..
Density 1.92 g/cc
0.0694 lb/in³
Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound for the encapsulation of semiconductor devices and fiber optics. Excellent moldability (good release, ..
Density 1.92 g/cc
0.0694 lb/in³
Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A flame retardant, novolac-hardened epoxy molding compound recommended for semiconductor packages that are not stress sensitive.
Density 1.92 g/cc
0.0694 lb/in³
Cookson Group Plaskon® AMC2 (132.203) Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound specifically formulated for packaging stress-sensitive devices in DIPs, SOICs, PLCCs and small QFPs. F..
Density 1.92 g/cc
0.0694 lb/in³
Budd DSM-971 Smooth Surface, Class "A" SMC  (discontinued **)
Parts requiring high strength and dimensional stability, excellent surface smoothness without sink marks; parts to be painted requiring an automotive-type finish.Data provided by the manufacturer.
Density 1.92 g/cc
0.0694 lb/in³
ISO 1183
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free
Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U..
Density 1.92 g/cc
0.0694 lb/in³
DIN 53 47
Albis Plastics Tedur® L 9530 PPS, 55% Mineral  (discontinued **)
Good-flow Embedding Compound, Isotropic Properties. Incandescent wire resistance (2 mm) is 960°C per VDE 0471 T1.2.Applications: Embedding of Microchips and Electronic ComponentsProcessing: Inject..
Density 1.92 g/cc
0.0694 lb/in³
LATI Latigray 75/4-01 CX/45 PBT
Radiopaque compound based on Polybutylene Terephthalate (PBT). Special mineral filler. Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformation provided by L..
Density 1.92 g/cc
0.0694 lb/in³
ASTM D792
Techmer ES Electrablend® PA6/6 05012
Availability: North AmericaForms: PelletsFiller/Reinforcement: Unspecified Filler/Reinfor.Features: ConductiveInformation provided by TP Composites, Inc.
Density 1.92 g/cc
0.0694 lb/in³
ASTM D891
Solvay Specialty Polymers FOMBLIN® Y H-VAC 140/13 PFPE Pump Oil
FOMBLIN Y fluids are a mixture of fluorinated polymers obtained by a photochemical process that begins with hexafluoropropylene. Since the FOMBLIN chemical chain contains only carbon, fluorine, and..
Density 1.92 g/cc
0.0694 lb/in³
ASTM D792
Sumitomo Bakelite North America Epiall® 1908-1 Short Glass Fiber Reinforced Epoxy
Epiall 1908-1 is a short fiberglass reinforced epoxy molding compound, with excellent dimensional stability, good strength properties and good electrical insulation proper-ties that meets the requir..
Density 1.92 g/cc
0.0694 lb/in³
ASTM D 792
SABIC Innovative Plastics LNP Thermocomp OFM66 PPS
LNP* Thermocomp* OFM66 is a compound based on Polyphenylene Sulfide resin containing Glass Fiber, Mineral. Added features of this material include: Low Warpage.This data was supplied by SABIC-IP fo..
Density 1.92 g/cc
0.0694 lb/in³
ASTM D792
Sumitomo Bakelite North America SI 9041A Silicone Compound
SI 9041A is a long fiberglass reinforced silicone molding compound, which exhibits excellent high temperature properties in addition to good molding characteristics for transfer and compression mold..
Density 1.92 g/cc
0.0694 lb/in³
ASTM D792
Plenco 1586 Polyester, Pellet, Transfer Molded
PLENCO 01586 is a glass and mineral reinforced pelletized polyester molding compound offering excellent heat resistance and mechanical strength properties. This product is typically used for injecti..
Density 1.92 g/cc
0.0694 lb/in³
Toho Tenax Besfight® G80-600 12K UMA-5C F301 Continuous Filament Carbon Fiber
High Modulus; Collimated; Polyacrylonitrile (PAN) based fiberTypical values; measured by Toho Strand Test Method based on JIS R7601 for fiber selection purposes. Information provided by Toho Carbon ..
Density 1.92 g/cc
0.0694 lb/in³
Zircar Ceramics AX-200 Refractory Supported Heater
ZIRCAR Refractory Supported Heater Type AX-200 consists of high temperature, helically-wound, iron-chrome-aluminum metallic alloy resistance heating elements fully embedded in a strong, highly stabl..
Density 1.92 - 1.96 g/cc
0.0694 - 0.0708 lb/in³
ISO R 1183
Fainplast Compounds CRKA 91 Flexible PVC, Flame Retardant Electrical Bedding Lead Free
Flame retardant bedding
Density 1.92 g/cc
0.0694 lb/in³
BNZ Materials Blazecrete 2300 ARG Dense Castable
Blazecrete 2300 ARG is an alumina-silica castable with high strength and abrasion resistance. For service to 2300°F (1260°C). May be gunned or slap-troweled over Blaz 2000G to obtain a high streng..
Density 1.92 - 2.12 g/cc
0.0694 - 0.0766 lb/in³
Molded
Bulk Molding Compounds BMC T10(GP) General Purpose Molding Compound
BMC T10(GP) is a general purpose molding compound. Due to the excellent flow and controlled reactivity, BMC T10(GP) is well suited for injection, transfer or compression molding of intricate parts...
Density 1.92 g/cc
0.0694 lb/in³
50% Resin Content; Internal Method
Park Electrochemical Nelco® N4000-6 FC Multifunctional Epoxy Laminate and Prepreg
The Nelco® N4000-6 FC is a high-Tg epoxy laminate and prepreg system that provides a wide range of performance versatility and ease of processing for demanding high-layer count applications.Key Fea..
Density 1.92 g/cc
0.0694 lb/in³
Wet Density
Mid-Mountain Materials THERMOSEAL® FIBERPAK® M77HS Moldable
Description: A family of high temperature moldables designed for a wide variety of uses. THERMOSEAL® FIBERPAK® MOLDABLES may be formed into shapes or linings, pushed into cracks and holes, or spre..
Copyright © lookpolymers.com All Rights Reserved