Polymer Property : Density = 9.60 g/cc Product List

Physical Properties

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Physical Properties	Metric	English
Density	9.60 - 9.80 g/cc	0.347 - 0.354 lb/inÂ³
MarkeTech Cu/Mo/Cu 1:3:1 Laminated Sheet Cu/MoCu sheets have very high in-plane thermal conductivity provide by layers of Cu and low CTEs provided by the inner layer of molybdenum. These laminated sheets spread heat from a concentrated hea..
Density	9.60 - 9.80 g/cc	0.347 - 0.354 lb/inÂ³
MarkeTech Mo70Cu Moly/Copper Heat Sink Material MoCu alloys are made by sintering molybdenum and copper together. This results in a heat sink of lower density than tungsten-based materials, low thermal expansion, and excellent thermal conductivit..
Density	9.60 g/cc	0.347 lb/inÂ³
Lucas-Milhaupt BRAZE 650 (Easy) Silver Based Cadmium Free Filler Metal Characteristics: This alloy is a intermediate silver brazing filler metals with a slight tendency to liquate (i.e. separate into low and high melting constituents) if heated slowly through their mel..
Density	9.60 - 10.0 g/cc	0.347 - 0.361 lb/inÂ³
H.C. Starck MoCu 70/30 Molybdenum-Copper Composite Material Description of Product: Molybdenum-copper composite materials are produced by copper infiltration of porous sintered molybdenum. They are available with different copper contents (15 - 35 %). A t..
Density	9.60 g/cc	0.347 lb/inÂ³
Indium Corp. Indalloy 23 Bismuth Solder Alloy Non-electrical solder for low-ambient temperatureInformation Provided by Indium Corporation
Density	9.60 g/cc	0.347 lb/inÂ³
Indium Corp. Indalloy 49 Bismuth Solder Alloy Information Provided by Indium Corporation
Density	9.60 g/cc	0.347 lb/in³
Indium Corp. Indalloy 39 Bismuth Solder Alloy Low temperature eutectic solder. Can be used on the same metallization as SnPb based solders. Lowest temperature solder pasteInformation Provided by Indium Corporation