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Polymer Property : Particle Size = 45 µm Product List

Physical Properties

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Physical Properties Metric English Comments
Particle Size 45 µm
45 µm
D50
Nyco NYAD® G Special Wollastonite
Wollastonite (calcium metasilicate, or CaSiO3) is a naturally occurring white, non-metallic mineral with an acicular or needle-shaped crystal structure. This distinctive property makes wollastonite ..
Particle Size <= 45 µm
<= 45 µm
0.2
Nabaltec NABALOX® NO 105-71 Calcined Aluminum Oxide
NABALOX® aluminum oxide has a number of advantages including low sintering temperaturewide sintering rangeflexible processinghigh sintered densities high wear and impact resistanceelectrical insula..
Particle Size 45 - 70 µm
45 - 70 µm
d50
Magyar Aluminum ALH-W90 Aluminum Hydroxide
Wet type
Particle Size 45 µm
45 µm
3% max, wet sieve
Magyar Aluminum ALO-DN-4F Alumina
Ground Alumina
Particle Size 45 µm
45 µm
0.1% max, wet sieve
Magyar Aluminum ALO-DN-4S Alumina
Ground Alumina
Particle Size 45 µm
45 µm
3% max, wet sieve
Magyar Aluminum ALO-EL-4F Alumina
Ground Alumina
Particle Size 45 - 85 µm
45 - 85 µm
d50
Magyar Aluminum ALO-Ex325 Alumina
Calcined Alumina
Particle Size 45 µm
45 µm
1% max, wet sieve
Magyar Aluminum ALO-G22-10 Alumina
Ground Alumina
Particle Size 45 - 85 µm
45 - 85 µm
d50
Magyar Aluminum ALO-P90 Alumina
Alumina for Polishing
Particle Size 45 µm
45 µm
Maximum of 10% less than
H.C. Starck Amperit® 105.2 Agglomerated Sintered Molybdenum (Mo)
Particle Size 45 µm
45 µm
Maximum of 20% less than
H.C. Starck Amperit® 109.063 Agglomerated Sintered Molybdenum (Mo)
Particle Size 45 µm
45 µm
Maximum of 30%, Mo
H.C. Starck Amperit® 119.075 Molybdenum-Nickel SF RC 60 75-25 (Mo / NiSF)
Composition is of NiSF RC 60 only
Particle Size 45 µm
45 µm
Maximum of 7% greater than
H.C. Starck Amperit® 250.3 Water Atomized (NiCr 80-20)
Particle Size 45 µm
45 µm
Maximum of 7% greater than
H.C. Starck Amperit® 251.1 Gas Atomized (NiCr 80-20)
Particle Size 45 µm
45 µm
Maximum of 13% less than
H.C. Starck Amperit® 281.2 Gas Atomized (NiAl 95-5)
Particle Size 45 µm
45 µm
Maximum of 13% less than
H.C. Starck Amperit® 415.2 CoNiCrAlY (MCrAlY)
Particle Size 45 µm
45 µm
Maximum of 5% less than
H.C. Starck Amperit® 515.2 Sintered Tungsten Carbide - Cobalt (WC-Co) 88-12
HS Number: 28499030
Particle Size 45 - 65 µm
45 - 65 µm
Lucite International Colacryl ® D120 Acrylic Dental Resin
A range of Methyl Methacrylate polymers designed for use as standard heat-curing denture base resins.Features: Fine free-flowing bead polymers containing residual peroxide initiator; Curing cycles f..
Particle Size >= 45 µm
>= 45 µm
Solvay Chemicals Rigmah® BV353
Information provided by Solvay
Particle Size 45 µm
45 µm
>50% greater than value; ISO 1624
SolVin 173GB Polyvinyl Chloride Emulsion Polymer
Made by emulsion polymerization. APPLICATIONS Calendering : plasticized films and sheets Extrusion : rigid or plasticized pipes and profiles In most cases, SolVin 173GB resin is used in blends with ..
Particle Size 45 µm
45 µm
average; ISO 1624
SolVin 266SF Polyvinyl Chloride Pastes - filler Polymers
Made by suspension polymerisation. APPLICATIONS Filler polymer for plastisols - Floor covering : hard-wearing top coats, chemically blown and mechanical foams, impregnation layers - Wall coverings -..
Particle Size 45 - 76 µm
45 - 76 µm
d90, Guaranteed
TIMCAL TIMREX® T15-75 Primary Synthetic Graphite
TIMREX Primary Synthetic Graphite is produced in a unique highly controlled graphitization process which assures narrow specifications and unequalled consistent quality due to: monitoring of all pro..
Particle Size <= 45 µm
<= 45 µm
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Particle Size <= 45 µm
<= 45 µm
Epoxy Technology EPO-TEK® E4110 Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other..
Particle Size <= 45 µm
<= 45 µm
Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy
Product Description: EPO-TEK®H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.Adv..
Particle Size <= 45 µm
<= 45 µm
Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy
Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A..
Particle Size 45 µm
45 µm
50th%
3M K37 Glass Bubbles
3M™ Glass Bubbles are engineered hollow glass microspheres that are alternatives to conventional fillers and additives such as silicas, calcium carbonate, talc, clay, etc., for many demanding appli..
Particle Size <= 45 µm
<= 45 µm
D90
Momentive Performance Materials PolarTherm® PTX25 Boron Nitride (BN) Powder
Spherical BN Agglomeration Powder. Spherical nature may improve thermal conductivity at moderate loading levels when used as a filler in polymers or lubricants, and produce less anisotropic propert..
Particle Size 45 µm
45 µm
Maximum of 7% greater than
H.C. Starck Amperit® 415.1 CoNiCrAlY (MCrAlY)
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