Physical Properties | Metric | English | Comments |
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Viscosity | 1500 cP | 1500 cP | |
Resinlab® CYNERGY CA6906 Adhesive Description: The CYNERGY 6900 SERIES are for use in demanding applications where very fast cure speeds and high temperature resistance are required. These are single component solvent free materials.. |
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Viscosity | 1500 cP @Temperature 190 °C |
1500 cP @Temperature 374 °F |
melt viscosity; ASTM D 3236 |
REXtac Rextac® RT 2315 Amorphous Polyalphaolefin (APAO) Adhesive and Sealant Grade.Description: Ethylene copolymer and FDA compliantFeatures: Balance of heat resistance, flexibility and stiffness, good wetting, and medium open timeApplications: Component.. |
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Viscosity | 1500 - 2500 cP | 1500 - 2500 cP | |
ND Industries 542 Shaft & Bearing Retainer Retaining Compound Very high strength retainer for gears, wheels, pulleys, fans, cams, collars, flywheels, rotors to shaftMeets military spec Mil-R-46082B Type III |
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Viscosity | 1500 cP @Temperature 82.2 °C |
1500 cP @Temperature 180 °F |
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Northstar Polymers MSA-063 Polyester Prepolymer Information provided by Northstar Polymers. |
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Viscosity | 1500 cP | 1500 cP | |
Reltek BONDiT™ B-45 Adhesive, Sealant & Coating System Key Properties: Excellent adhesive for low surface energy plastics without primer.Used in potting, painting and protective coating applications.Excellent thermal and mechanical shock resistance.Ease.. |
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Viscosity | 1500 cP @Temperature 25.0 °C |
1500 cP @Temperature 77.0 °F |
Uncured |
Permabond 170 Cyanoacrylate, gap filling PERMABOND® 170 is a methyl cyanoacrylate adhesive. It is a single part, high viscosity liquid that will cure rapidly at room temperature when pressed into a thin film between parts. Permabond 170 w.. |
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Viscosity | 1500 cP | 1500 cP | |
Reltek BONDiT™ B-46 Adhesive, Sealant & Coating System Key Properties: Excellent adhesion to low surface energy plastics without primer or surface preparation.Applications: Very high flexibility, 500% elongation, emphasizing high tack for un-abraded sub.. |
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Viscosity | 1500 cP | 1500 cP | |
Reltek BONDiT™ B-52 Adhesive, Sealant & Potting System Key Properties: Outstanding for bonding dissimilar materials with high thermal expansion differential applications.Fast thermal cure, long pot life.Ease of use.Applications: Excellent for fast assem.. |
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Viscosity | 1500 cP @Temperature 190 °C |
1500 cP @Temperature 374 °F |
melt viscosity; ASTM D 3236 |
REXtac Rextac® RT 2115 Amorphous Polyalphaolefin (APAO) Adhesive and Sealant Grade.Description: Propylene homopolymer and FDA compliantFeatures: High softening point and short open timeApplications: Component of hot melt adhesives, sealants and specialty.. |
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Viscosity | 1500 cP | 1500 cP | |
Resinlab® CYNERGY CA6810 Adhesive Description: The CYNERGY 6800 SERIES are clear, high strength products ideal for bonding dissimilar materials with excellent performance on a wide range of surfaces. This series of products has USP .. |
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Viscosity | 1500 - 1800 cP | 1500 - 1800 cP | B |
ITW Plexus Plexusâ„¢ MA350 Methacrylate Adhesive Two-part adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.Low viscosity adhesive, high strength, especially suitable for battery case applications.Informati.. |
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Viscosity | 1500 - 2500 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
1500 - 2500 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2070209P5 High Brightness Phosphor Ink (Green) This product is part of a range of Heat Curable Inks designed specifically for use in Electro Luminescent systems. These products are based on a unique curing process that results in the low tempera.. |
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Viscosity | 1500 - 7500 cP @Temperature 25.0 °C |
1500 - 7500 cP @Temperature 77.0 °F |
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Lucite International Colacryl ® TS1875 Acrylic Solution Resin Colacryl TS 1875 is a self cross-linking acrylic copolymer designed for high performance solvent resistant adhesive applications. Once dried, a film cast from this product remains permanently tacky... |
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Viscosity | 1500 - 2000 cP | 1500 - 2000 cP | RP-0596 |
Solvay RHODOLINE® DF-988 Surfactant Description: Silicone free and mineral oil free defoamer for high gloss paints.Identification: DEFOAMERAvailable in: North AmericaApplications: RHODOLINE© DF-988 is a silicone-free, mineral oil-f.. |
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Viscosity | 1500 - 1800 cP @Temperature 23.0 °C |
1500 - 1800 cP @Temperature 73.4 °F |
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Master Bond EP37-3FLF Low Exotherm Highly Flexible Two Component Epoxy Master Bond Polymer System EP37-3FLF is a very flexible, low viscosity, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. The .. |
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Viscosity | 1500 cP | 1500 cP | |
Von Roll Isola IMI Varnish 271 Spirit Gum Varnish for Electrical Insulation Data provided by Von Roll Isola USA.Flash Point: |
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Viscosity | 1500 cP | 1500 cP | |
Dow Corning A Compound Antifoam 100% active silicone fluid containing a suspension of finely powdered silica to enhance its defoaming efficiency.Information provided by Dow Corning |
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Viscosity | 1500 cP | 1500 cP | |
Elmer's Products Aron Alpha® 803 Cyanoacrylate Adhesive (Industrial Krazy Glue™) Low odor, low chlorosis (bloom) when a transparent bond, appearance and strength are required.High gap fill. Ethoxyethyl monomer. Excellent on rubber/plastic substrates. Fair on metal substrates... |
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Viscosity | 1500 - 3000 cP @Temperature 23.0 °C |
1500 - 3000 cP @Temperature 73.4 °F |
100 rpm |
Epoxy Technology EPO-TEK® 320NC-2 Optically Opaque Epoxy Material Description: A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modific.. |
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Viscosity | 1500 - 3000 cP @Temperature 23.0 °C |
1500 - 3000 cP @Temperature 73.4 °F |
100 rpm |
Epoxy Technology EPO-TEK® H20F Electrically Conductive, Flexible Epoxy Product Description: EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large di.. |
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Viscosity | 1500 cP | 1500 cP | |
Dow ISONATE™ 240 MDI Prepolymer ISONATE™ 240 MDI prepolymer is a modified MDI compound produced by reacting high-purity diphenylmethane diisocyanate with a high molecular weight polyester polyol, resulting in a material with good.. |
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Viscosity | 1500 - 2500 cP | 1500 - 2500 cP | MA143LFE |
C.O.I.M. FILCO® 309 Film Former for Glass Fiber Sizes Description: Film Former for Glass Fiber SizesGeneral Information: COIM has developed a range of polyesters for the treatment of glass fiber. These polyesters come in powder and emulsion form and ar.. |
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Viscosity | 1500 - 2500 cP @Temperature 35.0 °C |
1500 - 2500 cP @Temperature 95.0 °F |
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C.O.I.M. UREXTER® T 404 Polyurethane Two-Component Compound Description: Polyester PU System for shoe sole manufacturingInformation provided by P.A.T. Products, Inc. |
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Viscosity | 1500 cP | 1500 cP | Mixed |
Armstrong C-4/D Epoxy Adhesive A low viscosity, clear amber, unfilled adhesive, recommended for use with activators D or W. C-4 with Activator W offers maximum versatility in that differing degrees of flexibility can be achieved .. |
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Viscosity | 1500 cP | 1500 cP | Resin |
ACC EP QSZ EPI Engineered Polymers Quick Set Epoxy with Zinc EP QSZ Quick Set Epoxy with Zinc, “Powered by Reactamine® Technology”, is a two component 100% solids, no VOC’s (Volatile Organic Compound), self-leveling modified epoxy. This versatile new gene.. |
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Viscosity | 1500 cP | 1500 cP | |
Abatron AboCast 8504-5 One-Component Epoxy AboCast 8504-5 is a clear, plasticized one-component epoxy system with very high strength and impact. It provides exceptional physical properties and thermal shock resistance from sub-zero to modera.. |
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Viscosity | 1500 cP | 1500 cP | Mixed |
Resinlab® UR3001 Clear Two Part Urethane Encapsulant Resinlab™ UR 3001 is a clear, two component, room temperature curing urethane encapsulating system. It is designed to cure completely at room temperature. UR 3001 provides excellent environmental p.. |
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Viscosity | 1500 cP | 1500 cP | Part B, RVT, #2, 20 rpm; TM R050-12 |
Resinlab® EP1310 Medium Reactivity Epoxy Encapsulant Resinlab™ EP1310 is a two part medium reactivity epoxy encapsulant capable of being quickly gelled prior to full cure by exposing to a UV light source. Usually 5- 10 seconds is sufficient to gel th.. |