Physical Properties | Metric | English | Comments |
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Viscosity | 2000 cP | 2000 cP | |
Resinlab® CYNERGY CA6011 Adhesive Description: The CYNERGY 6000 SERIES are for use in demanding applications where very fast cure speeds are required. These are single component solvent free materials manufactured in a wide variety.. |
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Viscosity | 2000 cP | 2000 cP | |
Resinlab® CYNERGY CA6105 Adhesive Description: The CYNERGY 6100 SERIES products are used to bond metal to itself or other substrates. It is available in five standard viscosities.Application: The CYNERGY SERIES of the cyanoacrylates.. |
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Viscosity | 2000 - 3000 cP @Temperature 25.0 °C |
2000 - 3000 cP @Temperature 77.0 °F |
Uncured |
Permabond UV620 UV-curable Adhesive PERMABOND UV620 is a single part, fast curing, UV curable adhesive. Its excellent optical clarity and resistance to yellowing make it ideal for bonding glass and crystal for a high quality finish. I.. |
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Viscosity | 2000 cP | 2000 cP | Mixed; TM R050-12 |
Resinlab® UR3001HP Black Urethane Encapsulant Resinlab™ UR3001HP Black is a black, two component, room temperature curing urethane encapsulating system. It is designed to cure completely at room temperature. UR3001HP Black provides excellent e.. |
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Viscosity | 2000 cP @Temperature 25.0 °C |
2000 cP @Temperature 77.0 °F |
Uncured |
Permabond 798 Cyanoacrylate, Surface insensitive PERMABOND 798 is a high viscosity cyanoacrylate that combines fast cure with the ability to cure through a large gap. Plastics, Metals, Ceramics and elastomers are also rapidly bonded. The fast cu.. |
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Viscosity | 2000 cP | 2000 cP | |
Resinlab® CYNERGY CA6207 Adhesive Description: The CYNERGY 6200 SERIES products are for use in demanding applications where very fast cure speeds are required. Also used when difficult to bond and acidic surfaces are used such as EP.. |
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Viscosity | 2000 - 13000 cP | 2000 - 13000 cP | |
Huntsman Araldite XU 3909 Water-Based Adhesive/Coating Base Resin is GT 6609 (Type 9). Typical Solids Content 55%. Mean Particle Size |
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Viscosity | 2000 - 5000 cP | 2000 - 5000 cP | |
Huntsman MY 0500 Multifunctional Resin Weight per Epoxide (EEW, g/eq) 105 to 115. Max color is 11.Comments/Applications: Trifunctional low viscosity epoxy resin based on para amino phenol. Performance upgrader for bisphenol A resins. .. |
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Viscosity | 2000 cP | 2000 cP | |
Lord Adhesives 9900 Normal Setting, High Viscosity, Odorless, Non-Frosting Methyl Cyanoacrylate Adhesive Lord Cyanoacrylate AdhesivesLord® Cyanoacrylate Adhesives were developed for production situations requiring instant bonds and immediate handling strength, particularly when bonding rubber, metal.. |
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Viscosity | 2000 cP | 2000 cP | |
Shin-Etsu Silicones KE-1204 BL Silicone, Potting/Encapsulation RTV Information Provided by Shin-Etsu Silicones of America, Inc. |
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Viscosity | 2000 cP @Temperature 25.0 °C |
2000 cP @Temperature 77.0 °F |
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Silikony Polskie Polsil OM 2000 Methyl Silicone Fluid The methyl silicone fluids are liquid organic silicone polymers, including inorganic elements (Si-O bond, as in quartz, glass or sand) and inorganic elements (methyl groups) in one molecule. This gi.. |
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Viscosity | 2000 - 5000 cP | 2000 - 5000 cP | 20% Viscosity, 1-2% NaCl |
Solvay MACKADET® DR-100M Surfactant Product Description: Mackadet® DR-100M is a concentrated blend of surfactants, which simply requires dilution and the addition of minor additives to produce a ready to package high foaming produc.. |
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Viscosity | 2000 - 3000 cP @Temperature 23.0 °C |
2000 - 3000 cP @Temperature 73.4 °F |
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Master Bond EP39-2 Fast Curing Optically Clear Two Component Epoxy System Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does.. |
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Viscosity | 2000 - 4000 cP | 2000 - 4000 cP | Part A |
Master Bond MasterSil 151Med Medical Grade Silicone Potting Compound Description: Master Bond MasterSil 151Med is a two component, low viscosity silicone compound for high performance potting and encapsulation. MasterSil 151Med is an addition cured system and does no.. |
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Viscosity | 2000 cP @Temperature 25.0 °C |
2000 cP @Temperature 77.0 °F |
After mixing |
Tra-Con Tra-Bond F123NC High Temperature Fiber Optic Epoxy Adhesive TRA-BOND F123 NC is a fast cure, low viscosity, two-component epoxy formulation for bonding fiber optic bundles, potting glass fibers, and/or terminating single or multi-channel fiber optic connecto.. |
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Viscosity | 2000 - 10000 cP | 2000 - 10000 cP | Unmilled Cement; Zeon Test #328 |
Zeon Chemicals Nipol® 1432T Nitrile Powder and Crumb Elastomer Nipol 1432T is a copolymer of butadiene and acrylonitrile of medium-high acrylonitrile content. Sufficient antioxidant is added during manufacture for normal storage conditions.Used in adhesives and.. |
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Viscosity | 2000 cP | 2000 cP | "B" component |
ACC QGel 301 QSI Quantum Silicones High Strength Gel QGel 301 is a clear, very soft, tough, moderately cross-linked, silicone polymer. Silicone gels are used to provide protection from vibration, thermal or mechanical shock. Silicone gels also provide.. |
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Viscosity | 2000 cP | 2000 cP | |
Abatron AboCast 8502-7/AboCure 8502-7 Colorless, Low-Exotherm Epoxy Casting Compound AboCast 8502-7/AboCure 8502-7 is a rigid, heat cured, colorless, low-exotherm epoxy casting compound for larger masses. It is a 2-component structural and dielectric liquid system with extremely low.. |
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Viscosity | 2000 cP @Temperature 177 °C |
2000 cP @Temperature 350 °F |
Typical |
Bostik 6333 Medium Open Time, Low Viscosity, High Temp EVA Glue Stick Bostik 6333 Medium Open Time, Low Viscosity, High Temp EVA Glue StickMedium open time. Low viscosity. Easy to gun. Withstands elevated temperatures. |
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Viscosity | 2000 - 3000 cP | 2000 - 3000 cP | |
3M Pronto™ CA-5 Instant Adhesive One-part, room-temperature curing adhesive that is ready-to-use without metering or mixing. Bonded parts reach handling strength in 5-10 seconds on many applications.A high viscosity, slower settin.. |
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Viscosity | 2000 cP | 2000 cP | A Component; Spindle #3; speed 10 rpm; ASTM D1824 |
Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound Optoelectronic grade encapsulant/potting compound – will not attack/cloud polysulphone casings. Lower Tg version, APTEK 6110-A/B, available for ceramic blob-top applications.Part A is hazy blue. Pa.. |
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Viscosity | 2000 - 2500 cP | 2000 - 2500 cP | Brooksfield LV Viscometer |
Aremco Cerama-Dip™ 538-N-GRN High Temperature Specialty Ceramic-Inorganic Coating Low viscosity, light gray coating for powder resistors and rheostats to 2600°F (1427°C). black and green pigments also available. |
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Viscosity | 2000 cP | 2000 cP | Part B, RVT, #3, 20 rpm; TM R050-12 |
Resinlab® EP1282 Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP1282 Clear is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It is recognized under the Component Recognition Program of Underwriters Laborat.. |
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Viscosity | 2000 - 3000 cP | 2000 - 3000 cP | mixed |
Master Bond EP39MHT Two Component, Room Temperature Curing Epoxy Resin System Master Bond Polymer System EP39MHT is a low viscosity, two component, epoxy resin system for high performance potting, encapsulation, sealing and bonding. It cures readily at ambient temperatures to.. |
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Viscosity | 2000 - 6000 cP | 2000 - 6000 cP | RP-0596 |
Solvay RHODAPEX® ES-2 Surfactant Description: Primary surfactant used in shampoos, bubble baths, shin cleansers and related cosmetic products.Chemical Name: Sodium Laureth(2) SulfateCAS: 68585-34-2Available in: Asia Pacific, Europe.. |
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Viscosity | 2000 - 3500 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
2000 - 3500 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2000802P2 Carbon Graphite Ink This product is designed to be used for screen-printing working electrodes. This ink has been optimized to give superior electrochemical performance. It combines good line definition and good electr.. |