Physical Properties | Metric | English | Comments |
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Viscosity | 200000 cP @Temperature 400 °C |
200000 cP @Temperature 752 °F |
melt; ISO 11443 |
Victrex® PEEK 150GL15 Polyetheretherketone, 15% Glass Fibre Reinforced Product Description:High performance thermoplastic material, 15% glass fibre reinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding, very easy flow, FDA food conta.. |
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Viscosity | 200000 cP @Temperature 400 °C |
200000 cP @Temperature 752 °F |
melt; ISO 11443 |
Victrex® PEEK 90GL30 BLACK EU 30% Glass Fiber Filled, PolyEtherEtherKetone High performance thermoplastic material, 30% glass fiber reinforced PolyEtherEtherKetone (PEEK), semi crystalline, granules for injection molding, very easy flow, FDA and EU food contact compliant, .. |
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Viscosity | 200000 cP @Temperature 400 °C |
200000 cP @Temperature 752 °F |
melt; ISO 11443 |
Victrex® PEEK 90GL30 Polyetheretherketone, 30% Glass Fiber Reinforced Product Description:High performance thermoplastic material, 30% glass fibre reinforced Polyetheretherketone (PEEK), semi crystalline, granules for injection moulding, very easy flow, FDA food conta.. |
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Viscosity | 200000 cP @Temperature 400 °C |
200000 cP @Temperature 752 °F |
melt; ISO 11443 |
Victrex® PEEK -HT™ G22 PolyEtherKetone, Unreinforced Product Description:High performance thermoplastic material, unreinforced PolyEtherKetone (PEK), semi crystalline, depth filtered granules for injection moulding, easy flow, FDA food contact complia.. |
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Viscosity | 200000 cP | 200000 cP | Part B, Spindle TD, 2.5 rpm; Uncured |
Resinlab® AR 4400 HP Metal & Composite Bonding Methacrylate Adhesive Resinlab™ AR 4400 HP is a 1:1 mix methacrylate-based structural adhesive formulated to bond almost all engineered thermoplastics, thermosets, composites, and metal structural elements together in a.. |
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Viscosity | 200000 cP | 200000 cP | Spindle TD, 2.5 rpm; Curing |
Resinlab® AR 4400 HP Metal & Composite Bonding Methacrylate Adhesive Resinlab™ AR 4400 HP is a 1:1 mix methacrylate-based structural adhesive formulated to bond almost all engineered thermoplastics, thermosets, composites, and metal structural elements together in a.. |
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Viscosity | 200000 - 260000 cP | 200000 - 260000 cP | |
Lord Adhesives Metech 3501 Palladium Silver Conductor Composition Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide proc.. |
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Viscosity | 200000 - 260000 cP | 200000 - 260000 cP | |
Lord Adhesives Metech 3502 Palladium Silver Conductor Composition Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide proc.. |
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Viscosity | 200000 - 260000 cP | 200000 - 260000 cP | |
Lord Adhesives Metech 3503 Palladium Silver Conductor Composition Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide proc.. |
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Viscosity | 200000 - 260000 cP | 200000 - 260000 cP | |
Lord Adhesives Metech 3504 Palladium Silver Conductor Composition Designed for use in the manufacture of hybrid circuitry, resistor networks, potentiometers as well as general purpose microcircuitry. It employs a conventional glass bonding mechanism, has wide proc.. |
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Viscosity | 200000 cP | 200000 cP | Melt Viscosity, 260°C, 1500 sec-1; ISO 11443 |
SABIC Innovative Plastics Valox® 553 PBT (Europe-Africa-Middle East) VALOX 553 is a 30% glass fibre reinforced, flame retardant PBT+PC blend with good warpage characteristics. Applications: appliance handles, spotlights, electric motors, pumphousings. |
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Viscosity | >= 200000 cP | >= 200000 cP | |
Master Bond EP65ND Fast Curing, High Shear Strength Epoxy This two component adhesive system is formulated to cure quickly at ambient temperatures e.g. 8-10 minutes, shorter lives at higher temperatures for maximum bond strength. Tensile lap shear strength.. |
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Viscosity | >= 200000 cP | >= 200000 cP | Part B |
Master Bond MasterSil 153Med Silicone Paste for Medical Applications Description: Master Bond MasterSil 153Med is a two component silicone compound with a paste consistency for high performance bonding and sealing. It can be used for medical device applications as it.. |
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Viscosity | 200000 cP @Temperature 25.0 °C |
200000 cP @Temperature 77.0 °F |
Mixed |
Trelleborg Emerson & Cuming Eccobond® 51 Two-Component General Purpose Epoxy Adhesive Emerson & Cuming 51 Eccobond® Two-Component General Purpose Epoxy AdhesiveFilled, general purpose epoxy adhesive. Used with a variety of catalysts. Excellent adhesion to a variety of metal, plastic.. |
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Viscosity | 200000 cP | 200000 cP | at 20 RPM |
Loctite® 332 Severe Environment Structural Adhesive Acrylic Bonding AdhesivesLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impact, stress and shock resistance. .. |
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Viscosity | >= 200000 cP @Temperature 23.0 °C |
>= 200000 cP @Temperature 73.4 °F |
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Master Bond EP3HTMED One Component, Biocompatible Epoxy System Master Bond Polymer System EP3HTMed combines the ease of a one part, no mix, fast curing adhesive with high shear strength. This special formulation fully meets USP Class VI requirements. EP3HTMed p.. |
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Viscosity | 200000 cP | 200000 cP | dynamic |
Dow Corning 7-3099 DIMETHICONE HIP EMULSION A concentrated emulsion of Dimethicone (100 cSt) that is designed to facilitate the rapid development of skin care formulations which contain this emollient. Typical applications include: suncare, b.. |
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Viscosity | 200000 cP | 200000 cP | dynamic |
Dow Corning 7-3100 GUM BLEND HIP EMULSION A concentrated emulsion of ultra-high viscosity dimethiconol in cyclopentasiloxane that is designed to facilitate the rapid development of skin care formulations which contain this emollient. Typica.. |
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Viscosity | 200000 cP | 200000 cP | dynamic |
Dow Corning SE 4422 SILICONE RTV One-part, grey, moisture cure RTV, flowable, thermally conductive, UL V-1.Information provided by Dow Corning |
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Viscosity | 200000 cP @Shear Rate 1000 1/s, Temperature 260 °C |
200000 cP @Shear Rate 1000 1/s, Temperature 500 °F |
melt viscosity; b.o. ISO 11443-A |
Covestro Bayblend® T65 HG PC/ABS Blend Main characteristics:• High toughness even at low temperatures• High dimensional accuracy and stability• Good paintability• Good flowabilityGrade characteristics:• Injection molding, easy .. |
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Viscosity | 200000 cP @Shear Rate 1000 1/s, Temperature 280 °C |
200000 cP @Shear Rate 1000 1/s, Temperature 536 °F |
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DSM Akulon® F127 PA6 Low/Medium Viscosity, Film Extrusion |
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Viscosity | 200000 cP @Shear Rate 1000 1/s, Temperature 280 °C |
200000 cP @Shear Rate 1000 1/s, Temperature 536 °F |
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DSM Akulon® XP36-C1 PA6 Film Extrusion, Medium Viscosity, Lubricated |
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Viscosity | 200000 cP @Shear Rate 1000 1/s, Temperature 260 °C |
200000 cP @Shear Rate 1000 1/s, Temperature 500 °F |
melt viscosity; b.o. ISO 11443-A |
Covestro Bayblend® FR630 GR PC/ABS Blend Main characteristics:• High toughness even at low temperatures• High dimensional accuracy and stability• Good paintability• Good flowabilityGrade characteristics:• Flame-retardant• Injec.. |
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Viscosity | 200000 cP @Shear Rate 1000 1/s, Temperature 260 °C |
200000 cP @Shear Rate 1000 1/s, Temperature 500 °F |
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DSM Akulon® F128 PA6 Film Extrusion, Medium Viscosity |
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Viscosity | 200000 cP @Shear Rate 1000 1/s, Temperature 280 °C |
200000 cP @Shear Rate 1000 1/s, Temperature 536 °F |
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DSM Akulon® XP32-C1 PA6 Film Extrusion, Medium Viscosity, Lubricated |
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Viscosity | 200000 cP | 200000 cP | uncured |
Atom Adhesives AA-DUCT 904 Epoxy Adhesive AA-DUCT 904 is a single component, heat curing, conductive epoxy that was designed for ease in handling. This high performance conductive epoxy cures quickly at elevated temperatures making it ideal.. |
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Viscosity | 200000 cP | 200000 cP | B Component; Spindle #7; speed 10 rpm; ASTM D1824 |
Aptek 6550-A/B Epoxy Encapsulant High thermal conductivity, microelectronic grade blob-top encapsulant. Ultra high purity. Excellent heat and moisture protection for sensitive chips/circuitry. Premixed frozen syringes available for.. |
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Viscosity | 200000 - 5.00e+6 cP @Shear Rate 0.100 - 1000 1/s |
200000 - 5.00e+6 cP @Shear Rate 0.100 - 1000 1/s |
Average value: 1.26e+6 cP Grade Count:6 |
Overview of materials for Nylon 6, Film Grade This property data is a summary of similar materials in the MatWeb database for the category "Nylon 6, Film Grade". Each property range of values reported is minimum and maximum values of appropriat.. |