Physical Properties | Metric | English | Comments |
---|---|---|---|
Viscosity | 9000 cP | 9000 cP | Part A, RVT, #6, 20 rpm; TM R050-12 |
Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U.. |
|||
Viscosity | 9000 cP | 9000 cP | Part A, RVT, #6, 20 rpm; TM R050-12 |
Resinlab® EP1390 Medium Viscosity, Self Extinguishing Flame Retardant Epoxy Casting Resin System Resinlab™ EP1390 is a RoHS compliant, medium viscosity, self extinguishing flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Labor.. |
|||
Viscosity | 9000 cP | 9000 cP | Mixed |
Resinlab® EP691 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP 691 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting.. |
|||
Viscosity | 9000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
9000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT550 cone and plate viscometer (PK1.1°) |
Gwent Electronic Materials C2000808D2 Silver Backlight Ink Silver Ink C2000808D2 is a high resistance ink designed for use as the heating bars and tracks on automobile backlights and other circuits on glass. It has dark color when printed and fired on floa.. |
|||
Viscosity | 9000 - 12000 cP | 9000 - 12000 cP | As Supplied |
Heraeus Cleviosâ„¢ S V3 HV Antistatic/Conductive Polymer Coating for Screen Printing Poly(3,4-ethylenedioxythiophene)poly(styrenesulfonate), provided as a paste designed for application by silk screen printing to be used for transparent conductive devices. Cleviosâ„¢ S V3 HV gra.. |
|||
Viscosity | 9000 - 14000 cP @Temperature 40.0 °C |
9000 - 14000 cP @Temperature 104 °F |
|
Taiwan PU Corporation PPG CPU-2079 Polyurethane Casting Elastomer A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu.. |
|||
Viscosity | 9000 cP @Shear Rate 10994 1/s, Temperature 210 °C |
9000 cP @Shear Rate 10994 1/s, Temperature 410 °F |
ASTM D3835 |
STAR Thermoplastic Alloys & Rubbers StarMediflex P 7057-1000 TPE Product Description: StarMediflex P 7057-1000 is an easy processing TPE designed for injection molding. This particular class of TPE material for medical products and tubing applications. Features:S.. |
|||
Viscosity | 9000 - 14000 cP | 9000 - 14000 cP | Part A |
Master Bond EP21TDC-4 Two Component, Highly Flexible Epoxy System Master Bond Polymer System EP21TDC-4 is a two component, flexible epoxy resin system for high performance bonding, sealing and coating. It is formulated to cure at ambient temperatures or more quick.. |
|||
Viscosity | 9000 cP | 9000 cP | Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2 |
Formosa Plastics Formolon® 40 PVC PVC Copolymer Dispersion Resin F-40 is a vinyl chloride vinyl acetate copolymer dispersion resin with low paste viscosities, excellent heat stability, and rapid fusion characteristics. F-40 has been.. |
|||
Viscosity | 9000 cP | 9000 cP | Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2 |
Formosa Plastics Formolon® 45 PVC PVC Copolymer Dispersion Resin F-45 is a vinyl chloride vinyl acetate copolymer dispersion resin with low paste viscosities, excellent heat stability, and rapid fusion characteristics. F-45 has been.. |
|||
Viscosity | 9000 cP | 9000 cP | Resin |
Tra-Con Tra-Bond F125 Fast Gel Clear Epoxy Adhesive TRA-BOND F125 is a 10 minute gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. This clear, two part system is easily mixed and used at room te.. |
|||
Viscosity | 9000 cP @Temperature 25.0 °C |
9000 cP @Temperature 77.0 °F |
Mixed (sp #4, 3 rpm) |
Tra-Con Tra-Bond FDA12 Food and Drug Application Epoxy Adhesive TRA-BOND FDA12 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admin.. |
|||
Viscosity | 9000 cP @Temperature 25.0 °C |
9000 cP @Temperature 77.0 °F |
Mixed (sp #4, 3 rpm) |
Tra-Con Tra-Bond FDA12WH01 Food and Drug Application Epoxy Adhesive TRA-BOND FDA12 WH01 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug .. |
|||
Viscosity | 9000 cP | 9000 cP | mixing, dynamic |
Dow Corning SILASTIC® S-2 RTV SILICONE RUBBER BASE & CURING AGENT High strength, lower durometer silicone rubber suited for many moldmaking applications. Silastic S-2 is recommended for use with plaster, cement and rigid polyurethane and can be used with polyester.. |
|||
Viscosity | 9000 cP @Temperature 25.0 °C |
9000 cP @Temperature 77.0 °F |
|
Cytec (Conap) RN-1210 / EA-028 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
|||
Viscosity | 9000 - 15000 cP @Temperature 23.0 °C |
9000 - 15000 cP @Temperature 73.4 °F |
20 rpm |
Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ.. |
|||
Viscosity | 9000 - 15000 cP @Temperature 23.0 °C |
9000 - 15000 cP @Temperature 73.4 °F |
20 rpm |
Epoxy Technology EPO-TEK® 353ND-T High Temperature Thixotropic Epoxy Product Description: EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. Advantages & Application Notes: Suitable for fiber op.. |
|||
Viscosity | 9000 - 15000 cP @Temperature 23.0 °C |
9000 - 15000 cP @Temperature 73.4 °F |
20 rpm |
Epoxy Technology EPO-TEK® H54 High Temperature Epoxy Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica.. |
|||
Viscosity | 9000 cP | 9000 cP | |
ACC MM903 Condensation Cure 2-Part Molding Rubber Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: high tear strength, picks up extremely fine details, low viscosity, good resistance to styrene attack, easy degassing.. |
|||
Viscosity | 9000 cP | 9000 cP | Mixed. Powder:liquid ratio is 100: 12-14 |
Aremco Ceramacast™ 576-N High Temperature Potting & Casting Alumina Medium grain castable ceramic for large high temperature potting and tooling. Aremco offers a range of ceramic-based materials used for the assembly of high temperature, high power electrical devic.. |
|||
Viscosity | 9000 cP | 9000 cP | |
Aremco Ceramacast™ 646-N High Temperature Potting & Casting Material Zirconia Castable ceramic with high dielectric and physical strength. |
|||
Viscosity | 9000 cP | 9000 cP | Resin, uncured |
Atom Adhesives AA-BOND F125 Epoxy Adhesive AA-BOND F125 is a 8 minutes gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. AA-BOND F125 is clear, two part system is easily mixed and used .. |
|||
Viscosity | 9000 cP | 9000 cP | |
ACC QSil 58 QSI Quantum Silicones 50 Durometer Condensation Cure for Potting QSil 58 is a red, high temperature, self-leveling, two-component silicone material primarily used for potting applications. The two applicable catalysts are 0.5% DBT by weight and 10% Deep Section C.. |
|||
Viscosity | 9000 cP | 9000 cP | Mixed; TM R050-12 |
Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP691 is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and ad.. |
|||
Viscosity | 9000 - 12000 cP @Shear Rate 230 1/s, Temperature 25.0 °C |
9000 - 12000 cP @Shear Rate 230 1/s, Temperature 77.0 °F |
Haake VT 550 PK1.1° |
Gwent Electronic Materials C2100316D1 Nickel Ink This product has been designed as a nickel ink for use in internal electrodes and for use with Solid Oxide Fuel Cells. This electrode ink is designed for use with ML Ceramic Tapes. The ink should .. |