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Polymer Property : Viscosity = 9000 cP Product List

Physical Properties

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Physical Properties Metric English Comments
Viscosity 9000 cP
9000 cP
Part A, RVT, #6, 20 rpm; TM R050-12
Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System
Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U..
Viscosity 9000 cP
9000 cP
Part A, RVT, #6, 20 rpm; TM R050-12
Resinlab® EP1390 Medium Viscosity, Self Extinguishing Flame Retardant Epoxy Casting Resin System
Resinlab™ EP1390 is a RoHS compliant, medium viscosity, self extinguishing flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Labor..
Viscosity 9000 cP
9000 cP
Mixed
Resinlab® EP691 Black Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP 691 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting..
Viscosity 9000 cP

@Shear Rate 230 1/s,
Temperature 25.0 °C
9000 cP

@Shear Rate 230 1/s,
Temperature 77.0 °F
Haake VT550 cone and plate viscometer (PK1.1°)
Gwent Electronic Materials C2000808D2 Silver Backlight Ink
Silver Ink C2000808D2 is a high resistance ink designed for use as the heating bars and tracks on automobile backlights and other circuits on glass. It has dark color when printed and fired on floa..
Viscosity 9000 - 12000 cP
9000 - 12000 cP
As Supplied
Heraeus Cleviosâ„¢ S V3 HV Antistatic/Conductive Polymer Coating for Screen Printing
Poly(3,4-ethylenedioxythiophene)poly(styrenesulfonate), provided as a paste designed for application by silk screen printing to be used for transparent conductive devices. Cleviosâ„¢ S V3 HV gra..
Viscosity 9000 - 14000 cP

@Temperature 40.0 °C
9000 - 14000 cP

@Temperature 104 °F
Taiwan PU Corporation PPG CPU-2079 Polyurethane Casting Elastomer
A urethane elastomer that can be cured by reacting with a polyamine or a polyolhardener. The molding process is composed of pre-heating, degassing, maxing with a hardener, pouring into the mold, cu..
Viscosity 9000 cP

@Shear Rate 10994 1/s,
Temperature 210 °C
9000 cP

@Shear Rate 10994 1/s,
Temperature 410 °F
ASTM D3835
STAR Thermoplastic Alloys & Rubbers StarMediflex P 7057-1000 TPE
Product Description: StarMediflex P 7057-1000 is an easy processing TPE designed for injection molding. This particular class of TPE material for medical products and tubing applications. Features:S..
Viscosity 9000 - 14000 cP
9000 - 14000 cP
Part A
Master Bond EP21TDC-4 Two Component, Highly Flexible Epoxy System
Master Bond Polymer System EP21TDC-4 is a two component, flexible epoxy resin system for high performance bonding, sealing and coating. It is formulated to cure at ambient temperatures or more quick..
Viscosity 9000 cP
9000 cP
Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2
Formosa Plastics Formolon® 40 PVC
PVC Copolymer Dispersion Resin F-40 is a vinyl chloride vinyl acetate copolymer dispersion resin with low paste viscosities, excellent heat stability, and rapid fusion characteristics. F-40 has been..
Viscosity 9000 cP
9000 cP
Severs, 100 psig aged 2 hrs, See note 1; SPI-VD-T2
Formosa Plastics Formolon® 45 PVC
PVC Copolymer Dispersion Resin F-45 is a vinyl chloride vinyl acetate copolymer dispersion resin with low paste viscosities, excellent heat stability, and rapid fusion characteristics. F-45 has been..
Viscosity 9000 cP
9000 cP
Resin
Tra-Con Tra-Bond F125 Fast Gel Clear Epoxy Adhesive
TRA-BOND F125 is a 10 minute gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. This clear, two part system is easily mixed and used at room te..
Viscosity 9000 cP

@Temperature 25.0 °C
9000 cP

@Temperature 77.0 °F
Mixed (sp #4, 3 rpm)
Tra-Con Tra-Bond FDA12 Food and Drug Application Epoxy Adhesive
TRA-BOND FDA12 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admin..
Viscosity 9000 cP

@Temperature 25.0 °C
9000 cP

@Temperature 77.0 °F
Mixed (sp #4, 3 rpm)
Tra-Con Tra-Bond FDA12WH01 Food and Drug Application Epoxy Adhesive
TRA-BOND FDA12 WH01 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug ..
Viscosity 9000 cP
9000 cP
mixing, dynamic
Dow Corning SILASTIC® S-2 RTV SILICONE RUBBER BASE & CURING AGENT
High strength, lower durometer silicone rubber suited for many moldmaking applications. Silastic S-2 is recommended for use with plaster, cement and rigid polyurethane and can be used with polyester..
Viscosity 9000 cP

@Temperature 25.0 °C
9000 cP

@Temperature 77.0 °F
Cytec (Conap) RN-1210 / EA-028 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Viscosity 9000 - 15000 cP

@Temperature 23.0 °C
9000 - 15000 cP

@Temperature 73.4 °F
20 rpm
Epoxy Technology EPO-TEK® 353ND-T Black High Temperature Thixotropic Epoxy
Product Description: EPO-TEK® 353ND-T Black is a two component, high temperature, thixotropic epoxy for fiber optic, PCB and various medical applications. Advantages & Application Notes: This produ..
Viscosity 9000 - 15000 cP

@Temperature 23.0 °C
9000 - 15000 cP

@Temperature 73.4 °F
20 rpm
Epoxy Technology EPO-TEK® 353ND-T High Temperature Thixotropic Epoxy
Product Description: EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. Advantages & Application Notes: Suitable for fiber op..
Viscosity 9000 - 15000 cP

@Temperature 23.0 °C
9000 - 15000 cP

@Temperature 73.4 °F
20 rpm
Epoxy Technology EPO-TEK® H54 High Temperature Epoxy
Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica..
Viscosity 9000 cP
9000 cP
ACC MM903 Condensation Cure 2-Part Molding Rubber
Part of the Amber Chemical Group. Data provided by manufacturer.Characteristics: high tear strength, picks up extremely fine details, low viscosity, good resistance to styrene attack, easy degassing..
Viscosity 9000 cP
9000 cP
Mixed. Powder:liquid ratio is 100: 12-14
Aremco Ceramacast™ 576-N High Temperature Potting & Casting Alumina
Medium grain castable ceramic for large high temperature potting and tooling. Aremco offers a range of ceramic-based materials used for the assembly of high temperature, high power electrical devic..
Viscosity 9000 cP
9000 cP
Aremco Ceramacast™ 646-N High Temperature Potting & Casting Material Zirconia
Castable ceramic with high dielectric and physical strength.
Viscosity 9000 cP
9000 cP
Resin, uncured
Atom Adhesives AA-BOND F125 Epoxy Adhesive
AA-BOND F125 is a 8 minutes gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. AA-BOND F125 is clear, two part system is easily mixed and used ..
Viscosity 9000 cP
9000 cP
ACC QSil 58 QSI Quantum Silicones 50 Durometer Condensation Cure for Potting
QSil 58 is a red, high temperature, self-leveling, two-component silicone material primarily used for potting applications. The two applicable catalysts are 0.5% DBT by weight and 10% Deep Section C..
Viscosity 9000 cP
9000 cP
Mixed; TM R050-12
Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant
Resinlab™ EP691 is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and ad..
Viscosity 9000 - 12000 cP

@Shear Rate 230 1/s,
Temperature 25.0 °C
9000 - 12000 cP

@Shear Rate 230 1/s,
Temperature 77.0 °F
Haake VT 550 PK1.1°
Gwent Electronic Materials C2100316D1 Nickel Ink
This product has been designed as a nickel ink for use in internal electrodes and for use with Solid Oxide Fuel Cells. This electrode ink is designed for use with ML Ceramic Tapes. The ink should ..
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