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Polymer Property : Thickness = 0.00669 mil Product List

Physical Properties

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Physical Properties Metric English Comments
Thickness 0.110 - 0.170 microns
0.00433 - 0.00669 mil
2000-4000 rpm
Dow SiLK™ I 130 Semiconductor Dielectric Resin
SiLK™ I 130 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 130 is compatible with..
Thickness 0.110 - 0.170 microns
0.00433 - 0.00669 mil
2000-4000 rpm
Dow SiLK™ I300 140 Semiconductor Dielectric Resin
SiLK™ I300 140 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 140 is compatibl..
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