Physical Properties | Metric | English | Comments |
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Thickness | 0.110 - 0.170 microns | 0.00433 - 0.00669 mil | 2000-4000 rpm |
Dow SiLK™ I 130 Semiconductor Dielectric Resin SiLK™ I 130 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 130 is compatible with.. |
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Thickness | 0.110 - 0.170 microns | 0.00433 - 0.00669 mil | 2000-4000 rpm |
Dow SiLK™ I300 140 Semiconductor Dielectric Resin SiLK™ I300 140 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 140 is compatibl.. |