Polymer Property : Compressive Strength = 51.7 MPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Compressive Strength	51.7 MPa	7500 psi	Ultimate; TM R050-38
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Compressive Strength	51.7 MPa	7500 psi	Break; TM R050-38
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Compressive Strength	51.7 MPa	7500 psi	Perpendicular to pressing direction
Momentive Performance Materials HBC Hot-Pressed Boron Nitride Hot-pressed BN is compacted at temperatures up to 2000Â°C and pressures up to 2000 psi to form a dense, strong engineering material that is easily machined. It is available in standard and custom..
Compressive Strength	51.7 MPa	7500 psi
Henkel Hysol EA 9309.3NA Paste Adhesive System Toughened adhesive with excellent peel strength. Contains glass beads for bond line control.Applications: Structural Repair Composite Bonding
Compressive Strength	51.7 MPa	7500 psi	Break; TM R050-38
Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit..
Compressive Strength	51.7 MPa	7500 psi	Ultimate; TM R050-38
Resinlab® SEC1233 Silver Filled Epoxy Adhesive Resinlab™ SEC1233 is a silver filled, two component, room temperature curing epoxy adhesive. It is designed to cure completely at room temperature. SEC1233 provides excellent electrical conductivit..
Compressive Strength	51.7 MPa	7500 psi	Ultimate; TM R050-38
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Compressive Strength	51.7 MPa	7500 psi	Break; TM R050-38
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..