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Polymer Property : Modulus of Elasticity = 20.7 GPa Product List

Mechanical Properties

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Mechanical Properties Metric English Comments
Modulus of Elasticity 20.7 GPa
3000 ksi
X; ASTM D3039
Park Electrochemical Nelco® N8000 Cyanate Ester Epoxy Laminate and Prepreg
The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines a..
Modulus of Elasticity 20.7 GPa
3000 ksi
Y; ASTM D3039
Park Electrochemical Nelco® N8000 Cyanate Ester Epoxy Laminate and Prepreg
The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines a..
Modulus of Elasticity 20.7 GPa
3000 ksi
Perpendicular
Momentive Performance Materials BNC2 Boron Nitride (BN) Refractory Composite
Boron Nitride is a unique engineering material. It is a soft, machinable ceramic which can be combined with other refractory ceramics including Aluminum Oxide, Silicon Nitride, Aluminum Nitride, Mu..
Modulus of Elasticity 20.7 GPa
3000 ksi
SGL Carbon Group EK 305 Graphite
Good mechanical strength, good sliding properties, high temperature resistance, high thermal shock resistance, low wettability, high corrosion resistance, high thermal conductivity, high purity, and..
Modulus of Elasticity 20.7 GPa
3000 ksi
ASTM D638
Techmer ES Electrafil® J-1/CF/30 Nylon 66, 30% Carbon Fiber Reinforced
Carbon Fiber Reinforced
Modulus of Elasticity 20.7 GPa
3000 ksi
IPC TM-650 2.4.18.3
Arlon 84N Polyimide Laminate and Prepreg
84N is a high performance ceramic-filled polyimide prepreg based on Arlon's 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper lay..
Modulus of Elasticity 20.7 GPa
3000 ksi
IPC TM-650 2.4.4
Arlon MULTICLAD™ HF Halogen-Free Low-Loss Laminate and Prepreg System
MULTICLAD™ HF represents the next generation low-loss thermoset and prepreg system for high-speed and high-frequency printed circuit boards. This technology combines a low-loss, high reliability t..
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