Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Modulus of Elasticity | 20.7 GPa | 3000 ksi | X; ASTM D3039 |
Park Electrochemical Nelco® N8000 Cyanate Ester Epoxy Laminate and Prepreg The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines a.. |
|||
Modulus of Elasticity | 20.7 GPa | 3000 ksi | Y; ASTM D3039 |
Park Electrochemical Nelco® N8000 Cyanate Ester Epoxy Laminate and Prepreg The Nelco N8000 is a high-Tg cyanate ester laminate and prepreg system that provides superior performance and product integrity and is ideal for board designs with higher layer counts, finer lines a.. |
|||
Modulus of Elasticity | 20.7 GPa | 3000 ksi | Perpendicular |
Momentive Performance Materials BNC2 Boron Nitride (BN) Refractory Composite Boron Nitride is a unique engineering material. It is a soft, machinable ceramic which can be combined with other refractory ceramics including Aluminum Oxide, Silicon Nitride, Aluminum Nitride, Mu.. |
|||
Modulus of Elasticity | 20.7 GPa | 3000 ksi | |
SGL Carbon Group EK 305 Graphite Good mechanical strength, good sliding properties, high temperature resistance, high thermal shock resistance, low wettability, high corrosion resistance, high thermal conductivity, high purity, and.. |
|||
Modulus of Elasticity | 20.7 GPa | 3000 ksi | ASTM D638 |
Techmer ES Electrafil® J-1/CF/30 Nylon 66, 30% Carbon Fiber Reinforced Carbon Fiber Reinforced |
|||
Modulus of Elasticity | 20.7 GPa | 3000 ksi | IPC TM-650 2.4.18.3 |
Arlon 84N Polyimide Laminate and Prepreg 84N is a high performance ceramic-filled polyimide prepreg based on Arlon's 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper lay.. |
|||
Modulus of Elasticity | 20.7 GPa | 3000 ksi | IPC TM-650 2.4.4 |
Arlon MULTICLAD™ HF Halogen-Free Low-Loss Laminate and Prepreg System MULTICLAD™ HF represents the next generation low-loss thermoset and prepreg system for high-speed and high-frequency printed circuit boards. This technology combines a low-loss, high reliability t.. |