Polymer Property : Compressive Modulus = 0.0414 GPa Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Compressive Modulus	0.0414 - 200 GPa	6.00 - 29000 ksi	Average value: 17.9 GPa Grade Count:49
Overview of materials for Epoxy Adhesive This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Adhesive". Each property range of values reported is minimum and maximum values of appropriate Mat..
Compressive Modulus	0.0414 GPa	6.00 ksi	Stabilized, typ
Hexcel® HexWeb® HRH-10 - 1/4 - 1.5 Aramid Fiber/Phenolic Resin Honeycomb Designation: Material-Cell Size-Density.Hexweb HRH-10 is manufactured from NOMEX aramid fiber sheets. A thermosetting adhesive is used to bond these sheets at the nodes, and after expanding to the h..
Compressive Modulus	0.0414 GPa	6.00 ksi	Stabilized, typ
Hexcel® HexWeb® HRH-10 - 3/16 - 1.5 Aramid Fiber/Phenolic Resin Honeycomb Designation: Material-Cell Size-Density.Hexweb HRH-10 is manufactured from NOMEX aramid fiber sheets. A thermosetting adhesive is used to bond these sheets at the nodes, and after expanding to the h..
Compressive Modulus	0.0414 GPa	6.00 ksi	Stabilized, preliminary value obtained from limited testing
Hexcel® HexWeb® HRH-78 - 3/8 - 1.5 Commercial Grade Nomex Honeycomb/Phenolic Resin Designation: Material-Cell Size (inches)-DensityHexWeb HRH-78 is manufactured from commercial grade aramid paper sheets. A thermosetting adhesive is used to bond these sheets at the nodes, and after..
Compressive Modulus	0.0414 GPa	6.00 ksi	Stabilized, typ
Hexcel® HexWeb® HRH-10 - 3/8 - 1.5 Aramid Fiber/Phenolic Resin Honeycomb Designation: Material-Cell Size-Density.Hexweb HRH-10 is manufactured from NOMEX aramid fiber sheets. A thermosetting adhesive is used to bond these sheets at the nodes, and after expanding to the h..
Compressive Modulus	0.0414 - 0.0483 GPa	6.00 - 7.00 ksi	TM R050-38
Resinlab® EP1026R Rubber Modified Epoxy Adhesive Resinlab™ EP1026R is a two part unfilled rubber modified epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free ..