Mechanical Properties | Metric | English | Comments |
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Peel Strength | >= 9.00 kN/m | >= 51.4 pli | |
Parker Chomerics Tecknit Teckfip™ FIP-A Formed in Place Conductive Elastomer Description: This compound is ideally suited to corrosion-concerned applications where the gasket is applied to an aluminum casting. The corrosion resistance is enhanced due to the galvanic compatib.. |
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Peel Strength | >= 9.00 kN/m | >= 51.4 pli | |
Parker Chomerics Tecknit Teckfip™ FIP-C (SP) Formed in Place Conductive Elastomer Description: This is the small particle version of the FIP-C compound. It was specifically designed for mobile cell phone applications, which require a high degree of EMI shielding. While the compou.. |
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Peel Strength | >= 9.00 kN/m | >= 51.4 pli | |
Parker Chomerics Tecknit Teckfip™ FIP-C Formed in Place Conductive Elastomer Description: This compound is an all round high performance compound, and is very similar to a Consil C molded or extruded elastomer. It has been traditionally used for telecommunications base stati.. |
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Peel Strength | >= 9.00 kN/m | >= 51.4 pli | |
Parker Chomerics Tecknit Teckfip™ FIP-E (SP)` Formed in Place Conductive Elastomer This is the small particle version of the Ag/glass (FIP E) compound that was specifically designed for the mobile cell phone applications. It should be noted that this compound offers a low compress.. |
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Peel Strength | >= 9.00 kN/m | >= 51.4 pli | |
Parker Chomerics Tecknit Teckfip™ FIP-N (LD) Formed in Place Conductive Elastomer Description: FIP-N is similar in performance to FIP-A elastomer and hence offers a good non-corrosive EMI shield in harsh conditions. This material is one of our more cost effective FIP compoundsInf.. |
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Peel Strength | >= 9.00 kN/m | >= 51.4 pli | |
Parker Chomerics Tecknit Teckfip™ FIP-N Formed in Place Conductive Elastomer Description: FIP-N is similar in performance to FIP-A elastomer and hence offers a good non-corrosive EMI shield in harsh conditions. This material is one of our more cost effective FIP compoundsInf.. |
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Peel Strength | >= 9.00 kN/m | >= 51.4 pli | |
Parker Chomerics Tecknit Teckfip™ FIP-R Formed in Place Conductive Elastomer Description: FIP-R is based on a very rugged pure silver particle. By using silver as the conductive medium, this compound offers great performance in terms of heat aged electrical conductive stabil.. |
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Peel Strength | >= 9.00 kN/m | >= 51.4 pli | |
Parker Chomerics Tecknit Teckfip™ FIP-X Formed in Place Conductive Elastomer Description: FIP-X is Tecknit’s newest compound and features a conductive powder that is a unique particle combining tungsten carbide and aluminum. The premium advantage of this compound is its ab.. |
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Peel Strength | >= 9.00 kN/m | >= 51.4 pli | |
Parker Chomerics Tecknit Teckfip™ HC FIP-C Formed in Place Conductive Elastomer Description: Heat cure compound. This compound is an all round high performance compound, and is very similar to a Consil C molded or extruded elastomer. It has been traditionally used for telecommu.. |
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Peel Strength | >= 9.00 kN/m | >= 51.4 pli | |
Parker Chomerics Tecknit Teckfip™ HC FIP-E Formed in Place Conductive Elastomer Heat cure compound. Commercial grade FIP compound designed for moderate shielding performance. The Ag/glass particles are very smooth which leads to very low compression set value.Information provid.. |
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Peel Strength | 9.00 kN/m | 51.4 pli | Bell Peel |
Henkel Hysol EA 9313 Paste Adhesive System Very low viscosity adhesive yielding tough, flexible bonds. Injectable. |
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Peel Strength | 9.00 kN/m | 51.4 pli | Bell Peel |
Henkel Hysol EA 9380 Paste Adhesive System Cures at low temperature. Offers strength, toughness and high temperature resistance of heat-curing film adhesives, with greater flexibility and ease of use. Can be applied to large parts with contr.. |