Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Compressive Modulus | 61.4 GPa @Temperature 23.9 °C |
8900 ksi @Temperature 75.0 °F |
Dry; 270°F Oven Cure, 350°F Postcure; SACMA 1R-94 |
Park Electrochemical Nelcote® E-752 Epoxy Prepreg, 6K 5HS T300 Reinforced Nelcote® E-752 is a toughened, 185°C cure epoxy system designed for demanding structural applications up to 130°C. E-752 offers a good balance of toughness, high service temperature and good mois.. |
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Compressive Modulus | 61.4 GPa @Temperature 121 °C |
8900 ksi @Temperature 250 °F |
Dry; 270°F Oven Cure, 350°F Postcure; SACMA 1R-94 |
Park Electrochemical Nelcote® E-752 Epoxy Prepreg, 6K 5HS T300 Reinforced Nelcote® E-752 is a toughened, 185°C cure epoxy system designed for demanding structural applications up to 130°C. E-752 offers a good balance of toughness, high service temperature and good mois.. |
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Compressive Modulus | 61.4 GPa @Temperature 82.2 °C |
8900 ksi @Temperature 180 °F |
Dry; Vacuum/Oven Cured; SACMA 1-94 |
Park Electrochemical Nelcote® E-765 Epoxy Prepreg, T300 6K 5HS Reinforced Nelcote® E-765 is a tough 250°F cure prepreg system designed to replace 350°F cure systems in aircraft structural applications. FAA-approved Design Allowable Databases are available upon request... |
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Compressive Modulus | 61.4 GPa @Temperature 21.1 °C |
8900 ksi @Temperature 70.0 °F |
Dry; Autoclave Cured; SACMA 1-94 |
Park Electrochemical Nelcote® E-765 Epoxy Prepreg, T300 6K 5HS Reinforced Nelcote® E-765 is a tough 250°F cure prepreg system designed to replace 350°F cure systems in aircraft structural applications. FAA-approved Design Allowable Databases are available upon request... |
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Compressive Modulus | 61.4 GPa @Temperature 21.1 °C |
8900 ksi @Temperature 70.0 °F |
Dry; ASTM D6641 |
Renegade Materials Corporation MVK-14 Polyimide FreeForm™ T650-35 8HS Carbon Fabric MVK-14 polyimide prepregs are a more affordable and easier-to-process, non-carcinogenic alternative to PMR-15 and other older polyimide chemistries. MVK-14 offers a more durable alternative to high-.. |