Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Polymer Property : Tensile Strength, Ultimate = 12900 psi Product List

Mechanical Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.
Mechanical Properties Metric English Comments
Tensile Strength, Ultimate 89.2 MPa
12900 psi
DAM
Aardvark Polymers Aarlon® 4055FR PA 6/6 Rotational Molding Resin
Aarlon 4055FR is a premium flame retardant type 6/6 nylon.Aarlon 4055FR is halogen, heavy metal, and red phosphorus free.Aarlon 4055FR is UL94 V-0 rated.Aarlon 4055FR is semi-crystalline, nucleated,..
Tensile Strength, Ultimate 89.0 MPa
12900 psi
Dow SiLK™ D Semiconductor Dielectric Resin
SiLK™ D resin provides a more controlled coefficient of thermal expansion (CTE) profile at elevated temperatures as compared to earlier versions of SiLK™ resin.Information provided by Dow
Tensile Strength, Ultimate 89.0 MPa
12900 psi
Dow SiLK™ I 1070 Semiconductor Dielectric Resin
SiLK™ I 1070 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1070 is compatible wi..
Tensile Strength, Ultimate 89.0 MPa
12900 psi
Dow SiLK™ I 130 Semiconductor Dielectric Resin
SiLK™ I 130 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 130 is compatible with..
Tensile Strength, Ultimate 89.0 MPa
12900 psi
Dow SiLK™ I 1500 Semiconductor Dielectric Resin
SiLK™ I 1500 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1500 is compatible wi..
Tensile Strength, Ultimate 89.0 MPa
12900 psi
Dow SiLK™ I 360 Semiconductor Dielectric Resin
SiLK™ I 360 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 360 is compatible with..
Tensile Strength, Ultimate 89.0 MPa
12900 psi
Dow SiLK™ I 550 Semiconductor Dielectric Resin
SiLK™ I 550 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 550 is compatible with..
Tensile Strength, Ultimate 89.0 MPa
12900 psi
Dow SiLK™ I 620 Semiconductor Dielectric Resin
SiLK™ I 620 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 620 is compatible with..
Tensile Strength, Ultimate 89.0 MPa
12900 psi
Dow SiLK™ I 820 Semiconductor Dielectric Resin
SiLK™ I 820 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 820 is compatible with..
Tensile Strength, Ultimate 89.0 MPa
12900 psi
Dow SiLK™ I300 280 Semiconductor Dielectric Resin
SiLK™ I300 280 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 280 is compatibl..
Tensile Strength, Ultimate 89.0 MPa
12900 psi
Dow SiLK™ I300 380 Semiconductor Dielectric Resin
SiLK™ I300 380 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 380 is compatibl..
Tensile Strength, Ultimate 89.0 MPa
12900 psi
Dow SiLK™ I300 560 Semiconductor Dielectric Resin
SiLK™ I300 560 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 560 is compatibl..
Tensile Strength, Ultimate 89.0 MPa
12900 psi
Dow SiLK™ I 260 Semiconductor Dielectric Resin
SiLK™ I 260 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 260 is compatible with..
Tensile Strength, Ultimate 89.0 MPa
12900 psi
Dow SiLK™ I300 140 Semiconductor Dielectric Resin
SiLK™ I300 140 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 140 is compatibl..
Tensile Strength, Ultimate 89.0 MPa
12900 psi
ASTM D638
A. Schulman ComAlloy Hiloy® 616 Nylon 6, Mineral Reinforced
Data provided by the manufacturer, ComAlloy International Company.40% Mineral Reinforced.The ComAlloy product line has been integrated into the A Schulman product line.
Tensile Strength, Ultimate 89.0 MPa

@Temperature 1093 °C
12900 psi

@Temperature 1999 °F
Haynes 230® alloy, as cast vacuum investment casting
Excellent high-temperature strength, outstanding resistance to oxidizing environments up to 1149°C, premier resistance to nitriding environments, and excellent long-term thermal stability. Applicat..
Copyright © lookpolymers.com All Rights Reserved