Polymer Property : Shear Strength = 3400 psi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Shear Strength	23.4 MPa @Temperature 260 Â°C	3400 psi @Temperature 500 Â°F
Greene Tweed ArlonÂ® 1555 PEEK, Carbon, Graphite Filled ArlonÂ® is a tough, high-temperature, semi-crystalline, thermoplastic presenting a unique combination of mechanical, thermal, chemical and electrical properties. Greene, Tweed uses several proprie..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 305 Spectrally Transparent Epoxy Product Description: EPO-TEK® 305 is a two component, semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, optoelectronics and medical devices. It is an electrically and th..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advan..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 337H Graphite-Filled, High Temperature Epoxy Product Description: EPO-TEK® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic ind..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 360ST High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a slightly th..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 360T High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 377 High Temperature Epoxy Product Description: EPO TEK®377 is a two component, high Tg, fiber optic grade epoxy adhesive. It is well suited for semiconductor, medical and optical applications.Advantages & Application Notes:..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® 730 Unfilled Black General and Structural Grade Epoxy Material Description: A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in medical, xray device, fil..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® E3001-HV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® EJ2189-LV Electrically Conductive Epoxy Low Viscosity, two component room temp curing conductive epoxyInformation Provided by Epoxy Technology
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die Initial
Epoxy Technology EPO-TEK® EK2000 Epoxy Preliminary Product Information SheetMaterial Description: A two component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance ..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H20-FC Electrically Conductive Epoxy Product Description: EPO-TEK®H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly.Adv..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H35-175MPLV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H35-175MPLV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-el..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H37-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also av..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.Advantages & Application Notes: High visco..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® N20E Electrically Conductive Paste Product Description: EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditi..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid..
Shear Strength	23.4 MPa	3400 psi	Die
Epoxy Technology EPO-TEK® OG116-31 UV Cure Optical Epoxy Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® OG178 UV Cure Optical Epoxy Material Description: A single component, UV/visible shifted light curable epoxy, designed for adhesive, sealing, coating and encapsulating applications found in semiconductor, electro-optics, fiber..
Shear Strength	>= 23.4 MPa	>= 3400 psi	Die
Epoxy Technology EPO-TEK® H37-MPT Epoxy Material Description: A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certi..
Shear Strength	23.4 MPa	3400 psi	Overlap, Brass MEK/abrade/MEK
3M Scotch-Weld™ DP460 NS Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP460 Off-White and DP460 NS are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion and very high levels of durability.Informat..
Shear Strength	23.4 MPa	3400 psi	Overlap, Toluene for 14 days, Cohesive Failure
3M Scotch-Weld™ DP810NS Structural Adhesive 3M™ Scotch-Weld™ Low-Odor Acrylic Adhesives are two-part, 1:1 mix ratio, toughened structural adhesives with less odor than most acrylic adhesives. The adhesives have excellent shear and peel stre..
Shear Strength	23.4 MPa @Temperature -55.0 °C	3400 psi @Temperature -67.0 °F	Aluminum, etched, Overlap, Cohesive Failure
3M Scotch-Weld™ LSB60 Toughened Epoxy Adhesives 3M™ Scotch-Weld™ Toughened Epoxy Adhesive LBS60 is a high performance, two-part, toughened epoxy adhesives offering outstanding shear adhesion and very high levels of durability with a choice of f..
Shear Strength	23.4 MPa	3400 psi	Overlap, Galvanized Steel-MEK/Abrade/MEK, Cohesive/Adhesive Failure
3M Scotch-Weld™ LSB60NS Toughened Epoxy Adhesives 3M™ Scotch-Weld™ Toughened Epoxy Adhesive LBS60NS is a high performance, two-part, toughened epoxy adhesives offering outstanding shear adhesion and very high levels of durability with a choice of..