Mechanical Properties | Metric | English | Comments |
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Shear Strength | 24.1 MPa @Temperature 82.2 °C |
3500 psi @Temperature 180 °F |
2 hrs @ 250°F, Metal Clamp Pressure, 6061 T6 FPL Etched |
Zyvex Performance Materials Aroply™ 250 Nano-Engineered Composite Film Adhesive Aroply™ 250 Film Adhesive is a versatile, heat curing carbon-nanotube modified epoxy structural film adhesive available in a variety of film weights on a supported knitted nylon carrier. Cured adhe.. |
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Shear Strength | 24.1 MPa @Temperature 23.9 °C |
3500 psi @Temperature 75.0 °F |
Cure cycle: 5 days @ RT, with Aced Etched 6061-T6 Aluminum |
Zyvex Performance Materials Epovex™ Nano-Engineered Composite Epoxy Adhesive Liquid Epovex® Adhesive is a carbon nanotube enhanced ambient or elevated temperature cure two-part epoxy adhesive. Used for bonding, laminating, filling or potting, Epovex is ideal for many metals, woods.. |
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Shear Strength | 24.1 MPa @Temperature 23.9 °C |
3500 psi @Temperature 75.0 °F |
Aluminum (abraded), with Arovex Carbon Fiber Epoxy Laminate |
Zyvex Performance Materials Epovex™ Nano-Engineered Composite Epoxy Adhesive Paste Epovex® Adhesive Paste is a carbon nanotube enhanced two part epoxy adhesive thixotropic paste. Used for bonding or filling, Epovex Paste is ideal for many metals, woods, masonry products, and some.. |
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Shear Strength | 24.1 MPa @Temperature 21.1 °C |
3500 psi @Temperature 70.0 °F |
Lap Shear, Environmental Conditioning: 160°F 95% RH (1000 hrs) |
Hexcel® Redux® 609 (0.06 psf) Adhesive film for bonding metallic and composite components Redux 609 is a 250°F curing modified epoxy film adhesive containing a cottom scrim for easy handling and glue-line thickness control. It is available at standard areal weights of 0.06 psf and 0.04 .. |
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Shear Strength | 24.1 MPa @Temperature 82.2 °C |
3500 psi @Temperature 180 °F |
Lap Shear |
Hexcel® Redux® 609 (0.06 psf) Adhesive film for bonding metallic and composite components Redux 609 is a 250°F curing modified epoxy film adhesive containing a cottom scrim for easy handling and glue-line thickness control. It is available at standard areal weights of 0.06 psf and 0.04 .. |
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Shear Strength | 24.1 MPa @Temperature 60.0 °C |
3500 psi @Temperature 140 °F |
Lap Shear |
Hexcel® Redux® 335M Adhesive film for bonding metallic and composite components (0.03 psf) Redux 335 is a film adhesive curing at 250F. It is available in a range of standard areal weights from 0.015 to 0.06 psf. It is available either unsupported or with knitted and/or matt carrier for a.. |