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Polymer Property : Glass Transition Temp, Tg = 176 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Glass Transition Temp, Tg | 80.0 °C | 176 °F | ISO 11357-1 |
| Murtfeldt Murylon® HT Nylon 46 The use of this highly temperature resistant polyamide enables reliable operation up to a constant service temperature of 155°C . The material retains its rigidity and creep strength over the entir.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
| Eastman EASTALLOY Polymer DA003-8999K, Clear Alloy
(discontinued **) Properties below based on a film thickness of 250 microns. CO2 Permeability is 49 cm3·mm/m2·24h·atm per ASTM D 1434.Product Description: EASTALLOY DA003-8999K Polymer is a clear copolyester/pol.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | 10°C/min; DAM; ISO 11357-1/-2 |
| DuPont Performance Polymers Zytel® 70G25HSLR NC010 Nylon 66
(Unverified Data**) Zytel® 70G25HSLR NC010 is a 25% glass fiber reinforced, heat stabilized, hydrolysis resistant polyamide 66 resin for injection molding.Information provided by DuPont Performance Polymers |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC method |
| Honeywell Aegis™ OX High Barrier Nylon
(discontinued **) Description: Aegis OX is an oxygen-scavenging nylon. Oxygen barrier is comparable to a glass bottle with metal crown closure. In addition Aegis OX provides CO2 barrier and possesses glass-like cla.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | ASTM E1640-99 (by DMA) |
| Lord Adhesives 320 / 322 Epoxy Adhesive LORD® 320/322 adhesive is a general purpose, two component epoxy adhesive system formulated for primerless adhesion to automotive sheet molded compounds (SMC). This adhesive system also provides .. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | MCI Method |
| Mitsui APELâ„¢ APL6509T Cyclo Olefin Copolymer (COC) This material possesses many characteristics inherent in polyolefins such as excellent electrical insulating properties and outstanding moisture resistance. In addition, it features good melt proces.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | |
| Polyplastics TOPAS® 8007 Cyclic Olefin Copolymer (COC) (Asia/Pacific Grade) Water adsorption is small and barrier properties are good, making this grade particularly suitable for package applications for products that dislike moisture. Grade 8007 has lower coefficient of el.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | |
| Zeus FEP Tubing FEP, fluorinated ethylene propylene, is a melt processable fluoropolymer that allows for long, continuous lengths and has several distinct advantages over PTFE. Applications where FEP tubing is usua.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | Ultimate Tg |
| Tra-Con Tra-Bond 77-2LTC Low Temperature Cure SMD Adhesive TRA-BOND 77-2LTC one component, solvent-free, insulative epoxy adhesive is designed to cure at temperatures as low as 80°C. This adhesive is specifically designed for attaching surface mounted devi.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | Ultimate Tg |
| Tra-Con Tra-Cast 3103 General Purpose Epoxy Casting Compound TRA-CAST 3103 is a low viscosity two-part formulation recommended for general purpose electrical potting and encapsulating application where the combination of good mechanical thermal and electrical.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | Ultimate Tg, 10°C/min; TMA |
| Tra-Con Tra-Bond 526M05 Rapid Low Temperature Cure Adhesive TRA-BOND 526M05 is a low viscosity, fast cure at low temperature, long pot-life adhesive. Information provided by Tra-Con Inc. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DSC |
| Eastman Cadence™ GS3 Copolyester for film calendering Eastman Cadence™ copolyester, for calendered films, is a specialty plastic developed to meet the demand for an environmentally responsible material for the calendering industry. Available in diffe.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | ETM 300-90 |
| ExxonMobil ESCOREZ™ 5637 Petroleum Hydrocarbon Resin Light colored aromatic modified, cycloaliphatic hydrocarbon resin. Designed to tackify a variety of adhesive polymers including EVA, SIS and SEBS block copolymers and metallocene polyolefines. Avail.. |
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| Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 301-2 Optically Transparent Epoxy Product Description: EPO-TEK® 301-2 is a two component optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics.Advantages & Appli.. |
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| Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® 360T High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic.. |
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| Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® EK1000 Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding .. |
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| Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® EK1000-MP Epoxy Material Description: A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding .. |
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| Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H20E-MP Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-MP is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al.. |
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| Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H20-LC Electrically Conductive, Silver Epoxy Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used exte.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | |
| Epoxy Technology EPO-TEK® M10-D Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
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| Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® OM125 Optical Epoxy Product Description: EPO-TEK® OM125 is two component, high Tg, optical epoxy designed for bonding multi-mode fiber optic connectors. Advantages & Application Notes: Color coded blue for easy operat.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DAM; 10°C/min; ISO 11357-1/-2 |
| DuPont Performance Polymers Zytel® FG70G30HSR3 BK309 Nylon 66
(Unverified Data**) Information provided by DuPont Performance Polymers |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DAM; 10°C/min; ISO 11357-1/-2 |
| DuPont Performance Polymers Zytel® FG70G50HSLA BK309 Nylon 66
(Unverified Data**) 50% Glass Reinforced Heat Stabilized Polyamide 66 with Developed for Food Contact Applications Information provided by DuPont Performance Polymers |
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| Glass Transition Temp, Tg | >= 80.0 °C | >= 176 °F | Dynamic Cure 20—250°C /ISO 25 Min; Ramp -10—250°C @ 20°C/Min |
| Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | DAM; 10°C/min; ISO 11357-1/-2 |
| DuPont Performance Polymers Zytel® 70G25HSLR NC010 Nylon 66
(Unverified Data**) 25% Glass Reinforced Heat Stabilized Hydrolysis Resistant Polyamide 66 Zytel 70G25HSLR NC010 is a 25% glass fiber reinforced heat stabilized hydrolysis resistant polyamide 66 resin for injection mol.. |
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| Glass Transition Temp, Tg | 80.0 °C | 176 °F | 10°C/min; DAM; ISO 11357-1/-2 |
| DuPont Performance Polymers Zytel® 70G35HSLX BK357 Nylon 66
(Unverified Data**) Zytel® 70G35HSLX BK357 is a 35% glass fiber reinforced, heat stabilized, black polyamide 66 for injection molding.Information provided by DuPont Performance Polymers |
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