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Polymer Property : Glass Transition Temp, Tg = 374 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Glass Transition Temp, Tg 190 °C
374 °F
Dry; DMA
Park Electrochemical Nelcote® E-752 Epoxy Prepreg, 12K PW HTS Reinforced
Nelcote® E-752 is a toughened, 185°C cure epoxy system designed for demanding structural applications up to 130°C. E-752 offers a good balance of toughness, high service temperature and good mois..
Glass Transition Temp, Tg 190 °C
374 °F
Dry; DMA
Park Electrochemical Nelcote® E-752 Epoxy Prepreg, 3K PW G30-500 Reinforced
Nelcote® E-752 is a toughened, 185°C cure epoxy system designed for demanding structural applications up to 130°C. E-752 offers a good balance of toughness, high service temperature and good mois..
Glass Transition Temp, Tg 190 °C
374 °F
Dry; DMA
Park Electrochemical Nelcote® E-752 Epoxy Prepreg, 6K 5HS 630-500 Reinforced
Nelcote® E-752 is a toughened, 185°C cure epoxy system designed for demanding structural applications up to 130°C. E-752 offers a good balance of toughness, high service temperature and good mois..
Glass Transition Temp, Tg 190 °C
374 °F
Dry; DMA
Park Electrochemical Nelcote® E-752 Epoxy Prepreg, IM7 Unitape Reinforced
Nelcote® E-752 is a toughened, 185°C cure epoxy system designed for demanding structural applications up to 130°C. E-752 offers a good balance of toughness, high service temperature and good mois..
Glass Transition Temp, Tg 190 °C
374 °F
Prepreg, Measured from Storage Modulus, Dry
Renegade Materials Corporation RM-5003 Cyanate Ester Prepreg 4581 Quartz Fabric
Low dielectric and loss, high performance prepreg. 350°F Cure Developed with consistent handling and superior performance Designed for demanding electrical, radome and antennae applications Del..
Glass Transition Temp, Tg 190 °C
374 °F
DSC; IPC-TM-650.2.4.25c
Park Electrochemical Nelco® N4000-12 SI® High Speed/Low Loss, CAF Resistant Laminate and Prepreg
The Nelco® N4000-12 series is an enhanced epoxy resin system designed for use in high speed, low loss applications requiring thermal stability, excellent signal speed and CAF resistance.Key Feature..
Glass Transition Temp, Tg 190 °C
374 °F
DMA; IPC-TM-650.2.4.24.3
Park Electrochemical Nelco® N4000-7 EF® Halogen-Free Epoxy
The Nelco® N4000-7 EF® series of laminates and prepregs is a total environmental solution. This advanced halogen-free resin system provides superior CAF resistance for high temperature, lead-free ..
Glass Transition Temp, Tg 190 °C
374 °F
ASTM D3418
Quadrant EPP Quadrant LSG PSU, Extruded, Unfilled, Polysulfone (ASTM Product Data Sheet)
Glass Transition Temp, Tg 190 °C
374 °F
Master Bond EP46HT Epoxy Adhesive for Structural Bonding
Description: Master Bond System EP46HT is a newly formulated two component high performance heat resistant epoxy resin system with excellent mechanical strength and chemically resistant properties f..
Glass Transition Temp, Tg 190 °C
374 °F
DMTA
Hexcel® HexPly® 914 175°C Curing Epoxy Matrix
HexPly® 914 is a highly successful modified epoxy matrix which is used extensively in high temperature resistant primary aircraft structures. The controlled melt viscosity and excellent matrix rheo..
Glass Transition Temp, Tg 190 °C
374 °F
DMTA
Hexcel® HexPly® 924 180°C Curing Epoxy Matrix
HexPly® 924 is a controlled flow epoxy matrix developed for the fabrication of high temperature resistant primary structures. When cured, HexPly® 924 becomes a tough composite with high impact res..
Glass Transition Temp, Tg 190 - 210 °C
374 - 410 °F
DMA
Hexcel® HexPly® 108 180°C Curing Epoxy Matrix
HexPly® 108 is a high temperature resistant epoxy resin system developed for the fabrication of primary aircraft and space structures. 108 has excellent hot wet properties and exhibits low viscosit..
Glass Transition Temp, Tg 190 - 220 °C
374 - 428 °F
DMTA
Hexcel® HexPly® 922-1 180°C Curing Epoxy Matrix
HexPly® 922-1 is a structural epoxy resin for general industrial applications and aerospace applications. HexPly® 922-1 has an exceptionally good hot/wet performance and a very high glass temperat..
Glass Transition Temp, Tg 190 °C
374 °F
TMA; IPC TM-650 2.4.24
Arlon MULTICLAD™ HF Halogen-Free Low-Loss Laminate and Prepreg System
MULTICLAD™ HF represents the next generation low-loss thermoset and prepreg system for high-speed and high-frequency printed circuit boards. This technology combines a low-loss, high reliability t..
Glass Transition Temp, Tg 190 °C
374 °F
DSC; IPC-TM-650.2.4.25c
Park Electrochemical Nelco® N4000-12 High Speed/Low Loss, CAF Resistant Laminate and Prepreg
The Nelco® N4000-12 series is an enhanced epoxy resin system designed for use in high speed, low loss applications requiring thermal stability, excellent signal speed and CAF resistance.Key Feature..
Glass Transition Temp, Tg 190 °C
374 °F
ASTM D3418
Quadrant EPP Quadrant PSU Estruded Unfilled Polysulfone (ASTM Product Data Sheet)
Glass Transition Temp, Tg 190 °C
374 °F
DSC, 20°C/min.; ISO 11357-1/-2
Quadrant EPP Quadrant PSU unfilled, extruded (ISO Data)
Quadrant 1000 PSU is a slightly yellow, translucent (non-optical quality) amorphous thermoplastic material, offering a combination of excellent mechanical, thermal and electrical properties. It ofte..
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