Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 190 °C | 374 °F | Dry; DMA |
Park Electrochemical Nelcote® E-752 Epoxy Prepreg, 12K PW HTS Reinforced Nelcote® E-752 is a toughened, 185°C cure epoxy system designed for demanding structural applications up to 130°C. E-752 offers a good balance of toughness, high service temperature and good mois.. |
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Glass Transition Temp, Tg | 190 °C | 374 °F | Dry; DMA |
Park Electrochemical Nelcote® E-752 Epoxy Prepreg, 3K PW G30-500 Reinforced Nelcote® E-752 is a toughened, 185°C cure epoxy system designed for demanding structural applications up to 130°C. E-752 offers a good balance of toughness, high service temperature and good mois.. |
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Glass Transition Temp, Tg | 190 °C | 374 °F | Dry; DMA |
Park Electrochemical Nelcote® E-752 Epoxy Prepreg, 6K 5HS 630-500 Reinforced Nelcote® E-752 is a toughened, 185°C cure epoxy system designed for demanding structural applications up to 130°C. E-752 offers a good balance of toughness, high service temperature and good mois.. |
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Glass Transition Temp, Tg | 190 °C | 374 °F | Dry; DMA |
Park Electrochemical Nelcote® E-752 Epoxy Prepreg, IM7 Unitape Reinforced Nelcote® E-752 is a toughened, 185°C cure epoxy system designed for demanding structural applications up to 130°C. E-752 offers a good balance of toughness, high service temperature and good mois.. |
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Glass Transition Temp, Tg | 190 °C | 374 °F | Prepreg, Measured from Storage Modulus, Dry |
Renegade Materials Corporation RM-5003 Cyanate Ester Prepreg 4581 Quartz Fabric Low dielectric and loss, high performance prepreg. 350°F Cure Developed with consistent handling and superior performance Designed for demanding electrical, radome and antennae applications Del.. |
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Glass Transition Temp, Tg | 190 °C | 374 °F | DSC; IPC-TM-650.2.4.25c |
Park Electrochemical Nelco® N4000-12 SI® High Speed/Low Loss, CAF Resistant Laminate and Prepreg The Nelco® N4000-12 series is an enhanced epoxy resin system designed for use in high speed, low loss applications requiring thermal stability, excellent signal speed and CAF resistance.Key Feature.. |
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Glass Transition Temp, Tg | 190 °C | 374 °F | DMA; IPC-TM-650.2.4.24.3 |
Park Electrochemical Nelco® N4000-7 EF® Halogen-Free Epoxy The Nelco® N4000-7 EF® series of laminates and prepregs is a total environmental solution. This advanced halogen-free resin system provides superior CAF resistance for high temperature, lead-free .. |
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Glass Transition Temp, Tg | 190 °C | 374 °F | ASTM D3418 |
Quadrant EPP Quadrant LSG PSU, Extruded, Unfilled, Polysulfone (ASTM Product Data Sheet) |
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Glass Transition Temp, Tg | 190 °C | 374 °F | |
Master Bond EP46HT Epoxy Adhesive for Structural Bonding Description: Master Bond System EP46HT is a newly formulated two component high performance heat resistant epoxy resin system with excellent mechanical strength and chemically resistant properties f.. |
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Glass Transition Temp, Tg | 190 °C | 374 °F | DMTA |
Hexcel® HexPly® 914 175°C Curing Epoxy Matrix HexPly® 914 is a highly successful modified epoxy matrix which is used extensively in high temperature resistant primary aircraft structures. The controlled melt viscosity and excellent matrix rheo.. |
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Glass Transition Temp, Tg | 190 °C | 374 °F | DMTA |
Hexcel® HexPly® 924 180°C Curing Epoxy Matrix HexPly® 924 is a controlled flow epoxy matrix developed for the fabrication of high temperature resistant primary structures. When cured, HexPly® 924 becomes a tough composite with high impact res.. |
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Glass Transition Temp, Tg | 190 - 210 °C | 374 - 410 °F | DMA |
Hexcel® HexPly® 108 180°C Curing Epoxy Matrix HexPly® 108 is a high temperature resistant epoxy resin system developed for the fabrication of primary aircraft and space structures. 108 has excellent hot wet properties and exhibits low viscosit.. |
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Glass Transition Temp, Tg | 190 - 220 °C | 374 - 428 °F | DMTA |
Hexcel® HexPly® 922-1 180°C Curing Epoxy Matrix HexPly® 922-1 is a structural epoxy resin for general industrial applications and aerospace applications. HexPly® 922-1 has an exceptionally good hot/wet performance and a very high glass temperat.. |
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Glass Transition Temp, Tg | 190 °C | 374 °F | TMA; IPC TM-650 2.4.24 |
Arlon MULTICLAD™ HF Halogen-Free Low-Loss Laminate and Prepreg System MULTICLAD™ HF represents the next generation low-loss thermoset and prepreg system for high-speed and high-frequency printed circuit boards. This technology combines a low-loss, high reliability t.. |
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Glass Transition Temp, Tg | 190 °C | 374 °F | DSC; IPC-TM-650.2.4.25c |
Park Electrochemical Nelco® N4000-12 High Speed/Low Loss, CAF Resistant Laminate and Prepreg The Nelco® N4000-12 series is an enhanced epoxy resin system designed for use in high speed, low loss applications requiring thermal stability, excellent signal speed and CAF resistance.Key Feature.. |
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Glass Transition Temp, Tg | 190 °C | 374 °F | ASTM D3418 |
Quadrant EPP Quadrant PSU Estruded Unfilled Polysulfone (ASTM Product Data Sheet) |
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Glass Transition Temp, Tg | 190 °C | 374 °F | DSC, 20°C/min.; ISO 11357-1/-2 |
Quadrant EPP Quadrant PSU unfilled, extruded (ISO Data) Quadrant 1000 PSU is a slightly yellow, translucent (non-optical quality) amorphous thermoplastic material, offering a combination of excellent mechanical, thermal and electrical properties. It ofte.. |