Polymer Property : Glass Transition Temp, Tg = 90.0 °C Product List

Thermal Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Thermal Properties	Metric	English	Comments
Glass Transition Temp, Tg	90.0 °C	194 °F	Average value: 90.0 °C Grade Count:3
Overview of materials for Polyphenylene Sulfide (PPS); Molded This property data is a summary of similar materials in the MatWeb database for the category "Polyphenylene Sulfide (PPS); Molded". Each property range of values reported is minimum and maximum valu..
Glass Transition Temp, Tg	90.0 Â°C	194 Â°F
Lucite International Elvacite Â® 2552 Acrylic Resin ElvaciteÂ® 2552 is a solid bead thermoplastic methacrylate copolymer intended for use in solvent based coating systems where high gloss and apparent depth of finish are important. This specially d..
Glass Transition Temp, Tg	90.0 Â°C	194 Â°F	ISO 11357-2
Solvay Specialty Polymers RytonÂ® QC160N Polyphenylene Sulfide (PPS) RytonÂ® QC160N (granular powder) unfilled polyphenylene sulfide exhibits excellent thermal stability and chemical resistance and is suitable for thermoplastic extrusion processes.Features: Good Ch..
Glass Transition Temp, Tg	90.0 °C	194 °F	DSC
Wolf Kunststoff ZEDEX® ZX-530EL3 066 Polymer Alloy, Carbon Fiber Reinforced Main Characteristics: Low thermal expansion; High rigidity; High yield stress; High wear resistance; Low friction; Stress ResistantApplications: Chemical Engineering; Laboratory Technology; Automitv..
Glass Transition Temp, Tg	90.0 °C	194 °F	Ultimate Tg
Tra-Con Tra-Bond 216L01 Clear Low Viscosity Epoxy Adhesive TRA-BOND 216L01 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flowability and wetting characteristics, and adheres strongly to g..
Glass Transition Temp, Tg	90.0 °C	194 °F
Unitika elitel UE3690 Polyester, Pellet High Tg, PET adhesiveness, High heat resistance, BinderUNITIKA l resins are thermoplastic saturated copolymeric polyester resins. l resins are expanding their applications from products such as ad..
Glass Transition Temp, Tg	90.0 °C	194 °F
Loctite® Durabond® E-120HP Epoxy Adhesive Epoxy AdhesivesLoctite offers a complete line of one-part and two-part epoxy and urethane adhesives for structural bonding, potting and encapsulating. The Loctite® Durabond® line contains 14 appli..
Glass Transition Temp, Tg	>= 90.0 °C	>= 194 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl..
Glass Transition Temp, Tg	>= 90.0 °C	>= 194 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..
Glass Transition Temp, Tg	>= 90.0 °C	>= 194 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® H54 High Temperature Epoxy Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optica..
Glass Transition Temp, Tg	>= 90.0 °C	>= 194 °F	Post-Cure Dynamic Scan 20200°C; Ramp -40200°C @ 20°C/Min
Epoxy Technology EPO-TEK® OG142-112 UV Cure Optical Epoxy Material Description: Single component, medium viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. Replacement version of EPO-TE..
Glass Transition Temp, Tg	>= 90.0 °C	>= 194 °F	Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Epoxy Technology EPO-TEK® T7139 Glob Top Epoxy Product Description: EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly.Advantages & Application N..