Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 23.0 µm/m-°C @Temperature 0.000 - 150 °C |
12.8 µin/in-°F @Temperature 32.0 - 302 °F |
Y-Direction; IPC-TM-650 2.1.41 |
Rogers Corporation Syron™ 7000 Thermoplastic Circuit Material SYRON™ 7000 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. SYRON 7000 is thermally stable, with a .. |
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CTE, linear | 23.0 µm/m-°C @Temperature 0.000 - 140 °C |
12.8 µin/in-°F @Temperature 32.0 - 284 °F |
Z-Direction; ASTM D3386 |
Rogers Corporation TMM® TMM3 Ceramic Thermoset Polymer Composite TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope.. |
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CTE, linear | 23.0 µm/m-°C @Temperature 0.000 - 150 °C |
12.8 µin/in-°F @Temperature 32.0 - 302 °F |
Y-Direction; IPC-TM-650 2.1.41 |
Rogers Corporation XT/duroid™ 8000 Thermoplastic Laminate, Circuit Material XT/duroid™ 8000 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 8000 circuit materials ar.. |
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CTE, linear | 23.0 µm/m-°C @Temperature <=100 °C |
12.8 µin/in-°F @Temperature <=212 °F |
ISO E 830 |
Wolf Kunststoff ZEDEX® ZX-410V7T A4T Polymer Alloy, Fiber Reinforced, Friction Modified Main Characteristics: Fiber-reinforced; Friction-modified; Very high stiffness (higher than that of fiber-reinforced PEEK); Very low thermal expansion coefficient; Low friction; High wear resistance.. |
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CTE, linear | 23.0 µm/m-°C @Temperature -30.0 - 0.000 °C |
12.8 µin/in-°F @Temperature -22.0 - 32.0 °F |
Alpha 1 |
Tra-Con Tra-Bond 546S04 Thixotropic UV/Blue Light Cure Adhesive TRA-BOND 546S04 is a thixotropic UV/blue light curable adhesive with a secondary heat cure. TRA-BOND 546S04 is ideal for general optics bonding, mounting of lenses, and glob top applications. The .. |
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CTE, linear | 23.0 µm/m-°C @Temperature 0.000 - 100 °C |
12.8 µin/in-°F @Temperature 32.0 - 212 °F |
x direction; IPC TM-650 2.4.24 |
Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 233 uses a medium fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation factor without sacrificing mechanical properties.Cross Plied Woven Fiberglass, alternatin.. |
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CTE, linear | 23.0 µm/m-°C @Temperature 25.0 - 150 °C |
12.8 µin/in-°F @Temperature 77.0 - 302 °F |
ASTM TMA |
PBI Performance Products Celazole® PBI U-60 Unfilled Polybenzimidazole Resin U-60 grade Celazole® polybenzimidazole (PBI) resin is a organic polymer which does not burn in air and has high temperature resistance, along with excellent stability to chemicals and hydrolysis. .. |