Polymer Property : UL RTI, Mechanical with Impact = 302 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	UL746B
Covestro Apec® DP9-9373 High-Heat Polycarbonate, General Purpose, UV-Stabilized (discontinued **) Information provided by Bayer Corporation, Plastics DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer AG and has officially adopted its new name – Covestro. This produ..
UL RTI, Mechanical with Impact	150 °C	302 °F	UL 746
Solvay Specialty Polymers Mindel® B-430 Polysulfone, Modified (PSU, Modified) (discontinued **) Mindel B-430 is a 30% glass reinforced thermoplastic with excellent dimensional stability, exceptional resistance to warp, good chemical resistance, and high stiffness. It was developed specifically..
UL RTI, Mechanical with Impact	150 °C	302 °F	Average value: 150 °C Grade Count:6
Overview of materials for Phenolic, Novolac, Woodflour Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Woodflour Filled". Each property range of values reported is minimum and maximum valu..
UL RTI, Mechanical with Impact	150 °C	302 °F	Average value: 150 °C Grade Count:4
Overview of materials for Phenolic, Novolac, Mineral/Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Mineral/Fiber Filled". Each property range of values reported is minimum and maximum ..
UL RTI, Mechanical with Impact	150 °C	302 °F	Average value: 150 °C Grade Count:5
Overview of materials for Phenolic, Novolac, Glass Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Glass Filled". Each property range of values reported is minimum and maximum values o..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(ALL)
Hexion Bakelite™ PF 31 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress, UL listed molding compound 1.5 mm/V-1 (All), 3 mm/V-0 (All), standardized molding compound.Applicat..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(BK, BN)
Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, ..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(ALL)
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed (disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(BN, BK)
Hexion Bakelite™ X22 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, mainly organically filled, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Pot handles, operating controls, electrical isolators, housing parts.Informati..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.63 mm	302 °F @Thickness 0.0642 in
Plenco 202 Black General Purpose Woodflour Filled Phenolic Molding Compound (discontinued **) Plaslok 202 is a two-stage, woodflour-filled phenolic molding compound formulated to provide improved impact and fatigue strength, good dimensional stability and excellent molded finish for automoti..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 204 Black General Purpose Woodflour/Mineral Filled Phenolic Molding Compound (discontinued **) Plaslok 204 is a two-stage, woodflour and mineral-filled phenolic molding compound formulated to accommodate a wide range of molding situations. In addition, it is recommended for use in thin wall ..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 5440 Black General Purpose Phenolic Molding Compound (discontinued **) Plaslok 5440 is the replacement material for the former Union Carbide BMRS-5440. It is a two-stage, phenolic molding compound that has been successfully formulated to accommodate a very wide range ..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok 501 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in heat resistant and electrical applications. It is designed for elevated temperature exposure for e..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plenco 504 Black (INJ) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound (discontinued **)< Plaslok 504 is a two-stage, mineral and cellulose-filled phenolic molding compound having better impact and heat resistance than general purpose molding compounds. Since it also has good electrical..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plenco 506 Black Heat Resistant Mineral Filled Phenolic Molding Compound (discontinued **) Plaslok 506 is a two-stage, mineral-filled phenolic molding compound. It is formulated for automotive ashtrays and for appliance applications such as utensil handles receiving repeated exposure to ..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.60 mm	302 °F @Thickness 0.0630 in
Plenco 309 Black (INJ) Mineral/Fiber Filled Phenolic Molding Compound (discontinued **) Plaslok 309 is a two-stage, mineral and fiber-filled phenolic molding compound having excellent impact strength; and as such, is considered a good candidate for replacing chopped-fiber filled compou..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.63 mm	302 °F @Thickness 0.0642 in
Plaslok 202 Black General Purpose Woodflour Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 202 is a two-stage, woodflour-filled ..
UL RTI, Mechanical with Impact	150 °C	302 °F	1.60 mm
Plaslok 309 Black (COM) Mineral/Fiber Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 309 is a two-stage, mineral and fiber..
UL RTI, Mechanical with Impact	150 °C	302 °F
Resinoid 1312 Phenolic Molding, Glass Reinforced Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Mechanical with Impact	150 °C	302 °F
Resinoid 2016 Phenolic Molding, Fabric Reinforced Data provided by the manufacturer.The Resinoid 2000 organic fiber reinforced series compounds feature mechanical strength, dimensional stability, and shock resistance
UL RTI, Mechanical with Impact	150 °C @Thickness 0.750 mm	302 °F @Thickness 0.0295 in	BK
Hexion Bakelite™ PF 2874 Phenolic Formaldehyde Resin, Low Shrinkage, Improved Electrical Properties, UL Listed, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, increased mechanical strength, increased temperature stability, low water absorption, good dimensional stability, UL listed m..
UL RTI, Mechanical with Impact	150 °C @Thickness 0.750 mm	302 °F @Thickness 0.0295 in	BK
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 5000 Black General Purpose Woodflour Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 5000 is the replacement material for ..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound (discontinued **)&l Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 504 is a two-stage, mineral and cellu..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.47 mm	302 °F @Thickness 0.0579 in
Plaslok 504 Black (INJ) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound (discontinued **)&l Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 504 is a two-stage, mineral and cellu..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plaslok 5303 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 5303 is a two-stage, mineral and floc..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plaslok 302 Black Impact Grade Woodflour/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 302 is a two-stage, woodflour and flo..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.57 mm	302 °F @Thickness 0.0618 in
Plaslok 306 Black General Purpose Mineral/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use. Plaslok 306 is a two-stage, mineral and flock..
UL RTI, Mechanical with Impact	150 °C @Thickness 1.50 mm	302 °F @Thickness 0.0591 in	(BK)
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
UL RTI, Mechanical with Impact	150 °C	302 °F	1.57 mm
Plaslok 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound (discontinued **) Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 501 is a two-stage, mineral and flock..