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Polymer Property : UL RTI, Mechanical without Impact = 302 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
UL RTI, Mechanical without Impact 150 °C
302 °F
UL 746B
SABIC Innovative Plastics Lexan® XHT2141 PC Copolymer (Europe-Africa-Middle East)
XHT2141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors.
UL RTI, Mechanical without Impact 150 °C
302 °F
UL 746B
SABIC Innovative Plastics Lexan® XHT3141 PC Copolymer
XHT3141 is a high flow, high heat polycarbonate copolymer. It is available in a range of opaque and limited transparent colors.
UL RTI, Mechanical without Impact 150 °C
302 °F
Resinoid 1340 Phenolic Molding, Glass Reinforced
Data provided by the manufacturer.The Resinoid 1300 and 7000 glass fiber reinforced series compounds feature mechanical strength, dimensional stability, electrical insulation, and heat resistance
UL RTI, Mechanical without Impact 150 °C
302 °F
Covestro Petlon® 4630 Semi-Crystalline PET, 30% Glass Fiber  (discontinued **)
Characteristics: Flame Retardant: Electrical Properties, High Heat and Chemical ResistanceApplications: Connectors, Relays, Switches, Automotive (Under Hood), AppliancesProcessing: Injection Molding..
UL RTI, Mechanical without Impact 150 °C
302 °F
UL 746
Solvay Specialty Polymers Mindel® B-430 Polysulfone, Modified (PSU, Modified)  (discontinued **)
Mindel B-430 is a 30% glass reinforced thermoplastic with excellent dimensional stability, exceptional resistance to warp, good chemical resistance, and high stiffness. It was developed specifically..
UL RTI, Mechanical without Impact 150 °C
302 °F
Average value: 150 °C Grade Count:8
Overview of materials for Phenolic, Novolac, Impact Grade, Filled
This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Impact Grade, Filled". Each property range of values reported is minimum and maximum ..
UL RTI, Mechanical without Impact 150 °C
302 °F
Average value: 150 °C Grade Count:6
Overview of materials for Phenolic, Novolac, Woodflour Filled
This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Woodflour Filled". Each property range of values reported is minimum and maximum valu..
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.50 mm
302 °F

@Thickness 0.0591 in
(ALL)
Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed  (disc
Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area..
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.50 mm
302 °F

@Thickness 0.0591 in
ALL
Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed
Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U..
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.47 mm
302 °F

@Thickness 0.0579 in
Plenco 7000 Black General Purpose Woodflour Filled Phenolic Molding Compound  (discontinued **)
Plaslok 7000 is the replacement material for the former Union Carbide BMM-7000. It is a two-stage, woodflour-filled phenolic molding compound having versatile molding and preheating characteristics..
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.57 mm
302 °F

@Thickness 0.0618 in
Plenco 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound  (discontinued **)
Plaslok 501 is a two-stage, mineral and flock-filled phenolic molding compound designed for use in heat resistant and electrical applications. It is designed for elevated temperature exposure for e..
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.47 mm
302 °F

@Thickness 0.0579 in
Plenco 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound  (discontinued **)<
Plaslok 504 is a two-stage, mineral and cellulose-filled phenolic molding compound having better impact and heat resistance than general purpose molding compounds. Since it also has good electrical..
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.47 mm
302 °F

@Thickness 0.0579 in
Plenco 504 Black (INJ) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound  (discontinued **)<
Plaslok 504 is a two-stage, mineral and cellulose-filled phenolic molding compound having better impact and heat resistance than general purpose molding compounds. Since it also has good electrical..
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.57 mm
302 °F

@Thickness 0.0618 in
Plenco 5314 Black (COM) Impact Grade Phenolic Molding Compound  (discontinued **)
Plaslok 5314 is the replacement material for the former Union Carbide BMMA-5314. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of..
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.47 mm
302 °F

@Thickness 0.0579 in
Plenco 5314 Black (INJ) Impact Grade Phenolic Molding Compound  (discontinued **)
Plaslok 5314 is the replacement material for the former Union Carbide BMMA-5314. It is a two-stage, impact grade phenolic molding compound suitable for compression, transfer or injection molding of..
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.60 mm
302 °F

@Thickness 0.0630 in
Plenco 309 Black (INJ) Mineral/Fiber Filled Phenolic Molding Compound  (discontinued **)
Plaslok 309 is a two-stage, mineral and fiber-filled phenolic molding compound having excellent impact strength; and as such, is considered a good candidate for replacing chopped-fiber filled compou..
UL RTI, Mechanical without Impact 150 °C
302 °F
Haysite Ultratrac® H950 Glass Reinforced Polyester Sheet, Electrical Grade (GPO3)
This new generation of high performance material meets or exceeds all requirements for NEMA GPO-2 or GPO-3. ULTRATRAC ® H950 is recognized by U.L. as a 94V-0 material and offers greater arc and t..
UL RTI, Mechanical without Impact 150 °C
302 °F
Arlon 44981R015 0.015" (0.381 mm) Uncured Silicone Rubber with Fiberglass Substrate
Design/Construction: Interleave 1: Polyethylene Side 1: Uncured Silicone Rubber Substrate: Style 1165 FiberglassSide 2: Uncured Silicone Rubber Interleave 2: Polyethylene UL Recognition File: E54153..
UL RTI, Mechanical without Impact 150 °C
302 °F
Resinoid 2010 Phenolic Molding, Fabric Reinforced
Data provided by the manufacturer.The Resinoid 2000 organic fiber reinforced series compounds feature mechanical strength, dimensional stability, and shock resistance
UL RTI, Mechanical without Impact 150 °C
302 °F
Resinoid 2016 Phenolic Molding, Fabric Reinforced
Data provided by the manufacturer.The Resinoid 2000 organic fiber reinforced series compounds feature mechanical strength, dimensional stability, and shock resistance
UL RTI, Mechanical without Impact 150 °C
302 °F
UL 746B
SABIC Innovative Plastics Valox® V9561 PET (Europe-Africa-Middle East)
Flame retardant PET, 30% Glass fiber filled. Offering a good balance in CTI , GWIT , High Heat and mechanical performances.
UL RTI, Mechanical without Impact 150 °C

@Thickness 0.750 mm
302 °F

@Thickness 0.0295 in
BK
Hexion Bakelite™ PF 4111 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free, Copper Adhesive
Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, high mechanical strength, copper-adhesive,..
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.57 mm
302 °F

@Thickness 0.0618 in
Plenco 302 Black Impact Grade Woodflour/Flock Filled Phenolic Molding Compound  (discontinued **)
Plaslok 302 is a two-stage, woodflour and flock-filled phenolic molding compound. It has low specific gravity, broad molding latitude and an excellent balance of electrical and physical properties...
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.47 mm
302 °F

@Thickness 0.0579 in
Plaslok 504 Black (COM) Heat Resistant Mineral/Cellulose Filled Phenolic Molding Compound  (discontinued **)&l
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 504 is a two-stage, mineral and cellu..
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.57 mm
302 °F

@Thickness 0.0618 in
Plaslok 302 Black Impact Grade Woodflour/Flock Filled Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 302 is a two-stage, woodflour and flo..
UL RTI, Mechanical without Impact 150 °C

@Thickness 1.50 mm
302 °F

@Thickness 0.0591 in
(BK)
Hexion Bakelite™ PF 2836 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed &nbs
Phenolic molding compound, inorganically/organically filled, increased heat resistance, increased tracking resistance, low shrinkage and post shrinkage, improved electrical properties, UL listed mol..
UL RTI, Mechanical without Impact 150 °C
302 °F
1.57 mm
Plaslok 501 Black Electrical Grade Mineral/Flock Filled Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 501 is a two-stage, mineral and flock..
UL RTI, Mechanical without Impact 150 °C
302 °F
1.57 mm
Plaslok 7021 Black Impact Grade Phenolic Molding Compound  (discontinued **)
Plaslok Corporation was purchased by Plastics Engineering Company (maker of Plenco brand materials) in March 2000. The Plaslok name is no longer in use.Plaslok 7021 is the replacement material for ..
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