Polymer Property : Deflection Temperature at 8.0 MPa = 239 °F Product List

Thermal Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Thermal Properties	Metric	English	Comments
Deflection Temperature at 8.0 MPa	115 °C	239 °F	ISO 75-2
Hexion Bakelite™ EP 8414 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage (dis Epoxy molding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical even at higher temperatures, very slight post shrinkage, increased media resistance, UL l..
Deflection Temperature at 8.0 MPa	115 °C	239 °F	ISO 75-2
Hexion Bakelite™ PF 31.5 Phenolic Formaldehyde Resin, Improved Electrical Properties (discontinued **) Phenolic molding compound, mainly organically filled, electrically high grade, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, car electronic..
Deflection Temperature at 8.0 MPa	115 °C	239 °F	ISO 75-2
Hexion Bakelite™ PF 31.9 Phenolic Formaldehyde Resin, Ammonia Free (discontinued **) Phenolic molding compound, mainly organically filled, ammonia free, standardized molding compound.Application areas: Parts for electrical and telecommunications technology, motor vehicle ignition sy..
Deflection Temperature at 8.0 MPa	115 °C	239 °F	ISO 75-2
Hexion Bakelite™ PF 51 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, switch..
Deflection Temperature at 8.0 MPa	115 °C	239 °F	ISO 75-2
Hexion Bakelite™ PF 84 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets, High Mechanical Strength & Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, moldin..
Deflection Temperature at 8.0 MPa	115 °C	239 °F	ISO 75-2
Hexion Bakelite™ PF 85 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, average notched impact strength, UL listed molding compound 1.5 mm/HB (BK, BN).Application areas: Switch covers, rolls, ..
Deflection Temperature at 8.0 MPa	115 °C	239 °F	ISO 75-2
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof (discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
Deflection Temperature at 8.0 MPa	115 °C	239 °F	ISO 75-2
Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed (discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information..
Deflection Temperature at 8.0 MPa	115 °C	239 °F	ISO 75-1/-2
EMS-Grivory Grivory® HTM-4H1 PA6T/6I-MD40 Product description: Grivory HTM-4H1 is a 40 % mineral reinforced engineering thermoplastic material based on a semi-crystalline, partially aromatic copolyamide. Polymer designation acc. to ISO: PA ..
Deflection Temperature at 8.0 MPa	115 °C	239 °F	ISO 75-1/-2
EMS-Grivory Grivory® XE 4107 black 9992 PA612-GF40 Product description: Grilamid XE 4107 black 9992 is a 40% glass fiber reinforced, heat stabilized polyamide 612 injection molding grade. The main features of Grilamid XE 4107 are: low water absorpti..
Deflection Temperature at 8.0 MPa	115 °C	239 °F	ISO 75-1/-2
EMS-Grivory Grivory® XE 4107 nat PA612-GF40 Product description: Grilamid XE 4107 natural is a 40% glass fiber reinforced, heat stabilized polyamide 612 injection molding grade. The main features of Grilamid XE 4107 are: low water absorptiong..
Deflection Temperature at 8.0 MPa	115 °C	239 °F	HDT/C; ISO 75-1/2
Akro-Plastic Akromid® S3 GF 23 1 (2917) PA 6.10 Dry, 23% Glass Filled A characteristic property of AKROMID® S (PA 6.10) is that it has a renewable-resource content of up to 70 % and therefore fulfils the current definition of a bioplastic. The plant-based raw materia..
Deflection Temperature at 8.0 MPa	115 °C	239 °F	ISO 75-2
Hexion Bakelite™ EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage Epoxy molding compound, inorganically filled, glass fiber reinforced, heat resistant, dimensionally stable, good electrical and mechanical properties, very good chemical resistance, low viscosity, U..
Deflection Temperature at 8.0 MPa	115 - 180 °C	239 - 356 °F	Average value: 144 °C Grade Count:5
Overview of materials for Epoxy Molding Compound This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr..