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Polymer Property : Decomposition Temperature = 729 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Decomposition Temperature 387 °C
729 °F
Degradation Temperature
Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electron..
Decomposition Temperature 387 °C
729 °F
Initial; IPC TM-650 2.3.41
Arlon 84N Polyimide Laminate and Prepreg
84N is a high performance ceramic-filled polyimide prepreg based on Arlon's 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper lay..
Decomposition Temperature 387 °C
729 °F
Onset; IPC TM-650 2.3.41
Arlon 85N Polyimide Laminate and Prepreg
85N is a polyimide and laminate prepreg system for PWBs requiring resistance to high temperature, both in process and in end-use application. Bromine-free chemistry provides thermal stability for a..
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