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Polymer Property : Decomposition Temperature = 752 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Decomposition Temperature | >= 400 °C | >= 752 °F | charring begins |
| Kuraray Vectran® HT 1500/300 LCP Fiber  is a high-performance multifilament yarn spun from liquid crystal polymer (LCP).  fiber exhibits exceptional strength and rigidity. Pound for pound  fiber is five times stronger than steel an.. |
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| Decomposition Temperature | 400 - 500 °C | 752 - 932 °F | ASTM E1131 |
| Zeus PTFE Tubing Zeus offers a wide range of standard size products and precision custom PTFE Tubing. PTFE Tubing has become the gold standard in industries requiring the ultimate in lubricity, high temperature use,.. |
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| Decomposition Temperature | >= 400 °C | >= 752 °F | |
| Enviro Tech International EnSolv® n-Propyl Bromide Vapor Degreasing Solvent EnSolv is the perfect direct replacement for TCE, Perchloroethylene, 1,1,1-Trichloroethane and other hazardous vapor degreasing and general use solvents for critical applications such as oxygen serv.. |
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| Decomposition Temperature | 400 °C | 752 °F | Degradation Temperature |
| Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a .. |
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| Decomposition Temperature | >= 400 °C | >= 752 °F | |
| BASF Ultrason® E 2010 C6 30% Carbon Filled Carbon fibers and Ultrason® two partners with good properties. The combination of carbon fibers with the amorphous high-temperature plastic Ultrason® guarantees mechanical properties for temperatu.. |
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| Decomposition Temperature | >= 400 °C | >= 752 °F | |
| BASF Ultrason® E 2010 G4 MR SW 15102 20% Glass Filled PESU Information provided by BASF |
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| Decomposition Temperature | >= 400 °C | >= 752 °F | |
| BASF Ultrason® E 2010 MR SW 10111 PESU Description: Unreinforced, medium viscosity standard injection molding grade, demolding optimized. Abbreviated designation according to ISO 1043-1: PESU.Information provided by BASF |
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| Decomposition Temperature | >= 400 °C | >= 752 °F | |
| BASF Ultrason® E 2020 P SR PESU Description: Polyethersulfone flakes, e.g. for membrane applications, coatings and resin modification, containing min. 50% of OH-endgroups. The product is soluble in N-methyl-pyrrolidone (NMP) and N.. |
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| Decomposition Temperature | >= 400 °C | >= 752 °F | |
| BASF Ultrason® E 3010 MR UN PESU Description: Unreinforced, higher viscosity injection molding and extrusion grade with improved toughness and chemical resistance (stress crack resistance); demolding optimized. Abbreviated designat.. |
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| Decomposition Temperature | >= 400 °C | >= 752 °F | |
| BASF Ultrason® P 3010 MR SW 10101 PPSU Description: Unreinforced, higher viscosity injection molding grade, flame retardant and with improved chemical resistance. This grade is black colored and demolding optimized. Abbreviated designati.. |
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| Decomposition Temperature | >= 400 °C | >= 752 °F | |
| BASF Ultrason® E 2010 HC PESU Information provided by BASF |
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| Decomposition Temperature | >= 400 °C | >= 752 °F | |
| BASF Ultrason® E 2010 MR HP PESU Description: Unreinforced, medium viscosity standard injection molding grade for improved demolding behavior with Mold Release. PES-Blend with improved processibility. (High Productivity) Abbreviate.. |
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| Decomposition Temperature | >= 400 °C | >= 752 °F | |
| BASF Ultrason® E 2010 SW Q31 10088 PESU Information provided by BASF |
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| Decomposition Temperature | >= 400 °C | >= 752 °F | |
| BASF Ultrason® KR 4113 PESU with 10/10% Carbon Fibers/Graphite and 10% PTFE Description: Compound based on PES with 30 % filler. The filler system, a mixture of carbon fibers, graphite and PTFE powder, considerably improves Ultrason’s tribological properties. In addition, .. |
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| Decomposition Temperature | >= 400 °C | >= 752 °F | |
| BASF Ultrason® S 3010 MR UN PSU Description: Unreinforced, higher viscosity injection molding and extrusion grade, tougher, with improved chemical resistance and demolding optimized. Abbreviated designation according to ISO 1043-1.. |
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| Decomposition Temperature | 400 °C | 752 °F | TGA 5% WT; ASTM D3850 |
| Rogers Corporation 2929 Bondply Unreinforced, Hydrocarbon based Thin Film Adhesive System Low dielectric constant and loss tangentIdeal for multi-layer bondingCompatible with traditional processing methodsCompatible with a broad range of material types including PTFE compositesReliable t.. |
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