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- Polymer Property : Decomposition Temperature = 842 °F
Polymer Property : Decomposition Temperature = 842 °F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Decomposition Temperature | >= 450 °C | >= 842 °F | 20% weight loss; TGA |
| Kuraray Vectran® HT 1500/300 LCP Fiber  is a high-performance multifilament yarn spun from liquid crystal polymer (LCP).  fiber exhibits exceptional strength and rigidity. Pound for pound  fiber is five times stronger than steel an.. |
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| Decomposition Temperature | >= 450 °C | >= 842 °F | 20% weight loss; TGA |
| Kuraray Vectran® UM 1500/300 LCP Fiber  is a high-performance multifilament yarn spun from liquid crystal polymer (LCP).  fiber exhibits exceptional strength and rigidity. Pound for pound  fiber is five times stronger than steel an.. |
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| Decomposition Temperature | 450 °C | 842 °F | 1% weight loss per hour |
| Dow SiLK™ D Semiconductor Dielectric Resin SiLK™ D resin provides a more controlled coefficient of thermal expansion (CTE) profile at elevated temperatures as compared to earlier versions of SiLK™ resin.Information provided by Dow |
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| Decomposition Temperature | 450 °C | 842 °F | 1% weight loss per hour |
| Dow SiLK™ I 1070 Semiconductor Dielectric Resin SiLK™ I 1070 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1070 is compatible wi.. |
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| Decomposition Temperature | 450 °C | 842 °F | 1% weight loss per hour |
| Dow SiLK™ I 130 Semiconductor Dielectric Resin SiLK™ I 130 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 130 is compatible with.. |
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| Decomposition Temperature | 450 °C | 842 °F | 1% weight loss per hour |
| Dow SiLK™ I 1500 Semiconductor Dielectric Resin SiLK™ I 1500 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 1500 is compatible wi.. |
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| Decomposition Temperature | 450 °C | 842 °F | 1% weight loss per hour |
| Dow SiLK™ I 360 Semiconductor Dielectric Resin SiLK™ I 360 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 360 is compatible with.. |
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| Decomposition Temperature | 450 °C | 842 °F | 1% weight loss per hour |
| Dow SiLK™ I 550 Semiconductor Dielectric Resin SiLK™ I 550 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 550 is compatible with.. |
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| Decomposition Temperature | 450 °C | 842 °F | 1% weight loss per hour |
| Dow SiLK™ I 620 Semiconductor Dielectric Resin SiLK™ I 620 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 620 is compatible with.. |
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| Decomposition Temperature | 450 °C | 842 °F | 1% weight loss per hour |
| Dow SiLK™ I 820 Semiconductor Dielectric Resin SiLK™ I 820 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 820 is compatible with.. |
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| Decomposition Temperature | 450 °C | 842 °F | 1% weight loss per hour |
| Dow SiLK™ I300 280 Semiconductor Dielectric Resin SiLK™ I300 280 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 280 is compatibl.. |
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| Decomposition Temperature | 450 °C | 842 °F | 1% weight loss per hour |
| Dow SiLK™ I300 380 Semiconductor Dielectric Resin SiLK™ I300 380 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 380 is compatibl.. |
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| Decomposition Temperature | 450 °C | 842 °F | 1% weight loss per hour |
| Dow SiLK™ I300 560 Semiconductor Dielectric Resin SiLK™ I300 560 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 560 is compatibl.. |
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| Decomposition Temperature | 450 °C | 842 °F | Degradation Temperature |
| Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J.. |
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| Decomposition Temperature | 450 °C | 842 °F | 1% weight loss per hour |
| Dow SiLK™ I 260 Semiconductor Dielectric Resin SiLK™ I 260 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I 260 is compatible with.. |
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| Decomposition Temperature | 450 °C | 842 °F | 1% weight loss per hour |
| Dow SiLK™ I300 140 Semiconductor Dielectric Resin SiLK™ I300 140 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 140 is compatibl.. |
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