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Polymer Property : CTE, linear = 12.2 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| North Wood Plastics PS with 60% Wood Fiber Data provided by North Wood Plastics, Inc. |
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| CTE, linear | 22.0 - 500 µm/m-°C | 12.2 - 278 µin/in-°F | Average value: 83.0 µm/m-°C Grade Count:13 |
| Overview of materials for Polyphthalamide (PPA), 20% Glass Fiber Reinforced This property data is a summary of similar materials in the MatWeb database for the category "Polyphthalamide, 20% Glass Fiber Reinforced". Specific grades with glass content between 15% and 24% are.. |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| Cookson Group Plaskon® 440S Mineral Filled Novolac Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide process latitude. This material is designed to encapsulate a wide range of semiconduc.. |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| Cookson Group Plaskon® 3200LS Mineral Filled Novolac Epoxy Molding Compound
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability under very stringent testing. This material is designed to minimize stress on the encapsulated .. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 50/CF/10/GF/20/BK Polycarbonate, with carbon fiber and glass fiber Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.High-strength and high-stiff parts; low coefficient of expansi.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | |
| Lord Adhesives Circalokâ„¢ 6037 Epoxy Adhesive Circalokâ„¢ 6037 is an epoxy adhesive formulated for use by the semiconductor industry. An easy-to-spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient of ther.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105/GF/30/BK-1 PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-0797 PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.High dimensionally stable precision parts, high continuous use tempera.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-0918/EM/BL PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-7826/BL PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1105-8389/BL PEEK, with glass fiber Applications: Automotive industry, textile machinery, medical- and precision engineering, aircraft industry.Strong, stiff parts.Chemical and hydrolysis resistance parts, non flammable.High dimension.. |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| Indium Corp. Indalloy 108 Tin-Lead Solder Alloy Good pre-tinning alloyInformation Provided by Indium Corporation |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| Indium Corp. Indalloy® 158 Bi-Pb-Sn-Cd Solder Alloy Lowest melting point solder. Good fusible alloy used for lens blocking.Information provided by the manufacturer, Indium Corporation. |
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| CTE, linear | 22.0 - 25.0 µm/m-°C | 12.2 - 13.9 µin/in-°F | |
| Master Bond EP30ANHT Two Part, Electrically Isolating Epoxy Adhesive Description: Master Bond Polymer System EP30ANHT is a two part epoxy system with terrific thermal conductivity, while maintaining electrical insulation. One noteworthy property is its wide service t.. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | ISO 11359-2 |
| Unitika A1022GFL60 PA6, 60% Glass Fiber Reinforced, Dry Information provided by Unitika Ltd. |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| Williams Advanced Alloys WS143 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| Williams Advanced Alloys WS205 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| Tra-Con Tra-Bond 2125 Rigid Syntactic Repair Adhesive TRA-BOND 2125 is a medium viscosity, low density syntactic foam epoxy formulation developed for industrial, electronic and aerospace honeycomb, fillet, edge-fill, contour repair, bonding and casting.. |
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| CTE, linear | 21.9 µm/m-°C | 12.2 µin/in-°F | |
| Hexcel® HexPly® F522 Epoxy Resin HexPly® F522 is an advanced, modified epoxy formulation designed for autoclave curing to offer very high laminate strengths, coupled with increased fracture toughness, excellent hot-wet properties .. |
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| CTE, linear | 22.0 µm/m-°C | 12.2 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| AIM 95Sn/3.5Ag/1.5In Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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| CTE, linear | 22.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
| BASF Petra® 140 45% Glass Filled PET Petra 140 is a 45% glass reinforced injection molding polyethylene terephthalate (PET) offering an increased level of strength, stiffness, high temperature performance and dimensional stability. Ex.. |
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| CTE, linear | 22.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM Test |
| BASF Petra® 140 BK-112 45% Glass Filled PET Petra 140 BK-112 is a 45% glass reinforced, pigmented black, polyethylene terephthalate (PET) injection molding compound offering an increased level of strength, stiffness, high temperature performa.. |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
|
| AIM 70 Fusible Alloy Uses: punch and die in short run sheet metal forming; external and internal support for bending tubing extrusions; holding jet engine blades for machining and broaching; annealing and nitriding seal.. |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Solvay Specialty Polymers Ixef® 2530/X9027 Polyarylamide, 55% Mineral + Glass Fiber, DAM
(discontinued **)< The IXEF compounds are a family of semi-crystalline polyarylamide thermoplastics reinforced with glass fibers and/or mineral fillers for injection molding.Data provided by the manufacturer, Solvay A.. |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
ASTM D-696 |
| Glastic GLASGUARD Scuff and Bulkhead Liners GlasGuard Scuff and Bulkhead Liners serve as a method of protecting trailer walls from damage caused by forklift trucks and careless loading and unloading of freight. Manufactured of 1/4" thick fib.. |
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| CTE, linear | 22.0 - 71.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
12.2 - 39.4 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics NORYL PX2935 PPE+PS (Asia Pacific) PPE/PS, GF20%, non-FR |
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| CTE, linear | 22.0 µm/m-°C @Temperature 20.0 °C |
12.2 µin/in-°F @Temperature 68.0 °F |
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| AIM 97In/3Ag Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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