Polymer Property : CTE, linear = 14.4 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	26.0 µm/m-°C @Temperature 25.0 - 150 °C	14.4 µin/in-°F @Temperature 77.0 - 302 °F	ASTM TMA
PBI Performance Products Celazole® TL-60 Self Lubricating Melt Processable Polybenzimidazole Celazole® polybenzimidazole (PBI) resin is a unique and highly stable linear hetrocyclic polymer. PBI is characterized by high strength; excellent thermal stability, and broad chemical resistance. ..
CTE, linear	26.0 µm/m-°C @Temperature 25.0 - 150 °C	14.4 µin/in-°F @Temperature 77.0 - 302 °F	ASTM TMA
PBI Performance Products Celazole® TF-60 C Carbon Fiber Reinforced Melt Processable Polybenzimidazole Celazole® polybenzimidazole (PBI) resin is a unique and highly stable linear hetrocyclic polymer. PBI is characterized by high strength; excellent thermal stability, and broad chemical resistance. ..
CTE, linear	26.0 µm/m-°C @Temperature 20.0 °C	14.4 µin/in-°F @Temperature 68.0 °F	ASTM D696
Covestro Petlon® PC/PET 36A 620UV Yellow Semi-Crystalline PET, 10% Glass Fiber (discontinued **) Characteristics: Good Thermal and Dimensional Stability, Good Chemical ResistanceApplications: Automotive Panels, Electronic Housings, Pump HousingsProcessing: Injection Molding (Melt Temperature: 5..
CTE, linear	26.0 Âµm/m-Â°C @Temperature 20.0 Â°C	14.4 Âµin/in-Â°F @Temperature 68.0 Â°F
Indium Corp. IndalloyÂ® 10 Pb-In Solder Alloy Indalloy's #7, #10, #150, #204, #205 and #206 comprise a group of lead-indium solders designed to cover the temperature range of 165Â°C-275Â°C. All have the minimum gold-leaching characteristics..
CTE, linear	26.0 Âµm/m-Â°C @Temperature 20.0 Â°C	14.4 Âµin/in-Â°F @Temperature 68.0 Â°F
Indium Corp. IndalloyÂ® 206 Pb-In Solder Alloy Indalloy's #7, #10, #150, #204, #205 and #206 comprise a group of lead-indium solders designed to cover the temperature range of 165Â°C-275Â°C. All have the minimum gold-leaching characteristics..
CTE, linear	26.0 µm/m-°C @Temperature 20.0 °C	14.4 µin/in-°F @Temperature 68.0 °F
Williams Advanced Alloys WS292 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys
CTE, linear	26.0 µm/m-°C @Temperature 20.0 °C	14.4 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Bond 2156 Heat Conductive Electrically Insulating Compound TRA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compon..
CTE, linear	26.0 µm/m-°C @Temperature 20.0 °C	14.4 µin/in-°F @Temperature 68.0 °F	ASTM D696
Covestro Baydur® STR/C-405 IMR Polyurethane Composite SRIM Foam, 45% Glass Filled, MDI-based 2-Component Liquid System Contains continuous strand fiberglass mat.0.118 in. thickness.Information provided by Bayer Corporation, Polyurethanes DivisionAs of 1 September 2015, Bayer MaterialScience was separated from Bayer ..
CTE, linear	26.0 µm/m-°C	14.4 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® H20E-8 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscos..
CTE, linear	26.0 µm/m-°C	14.4 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® H31LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electron..
CTE, linear	26.0 µm/m-°C	14.4 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a ..
CTE, linear	26.0 µm/m-°C @Temperature 20.0 °C	14.4 µin/in-°F @Temperature 68.0 °F
AIM 80In/Pb15/Ag5 Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.
CTE, linear	26.0 µm/m-°C @Temperature 20.0 °C	14.4 µin/in-°F @Temperature 68.0 °F	ISO 11359
CENTROPLAST CENTROMID 6 GF 30 Polyamide 6 30% glass fiber The 30% glass fibre matrix adds very high strength and rigidity to this material. It has increased dimensional accuracy when hot. Can be used for rollers, belt pulleys and racks.Information provid..
CTE, linear	26.0 µm/m-°C @Temperature 50.0 - 120 °C	14.4 µin/in-°F @Temperature 122 - 248 °F	IPC TM-650 2.4.24
Arlon GenClad™ 280 Low Loss Thermoset Bond-Ply Low loss Ceramic-Filled Thermoset/Thermoplastic Hybrid SystemRivals PTFE laminate electrical performance in a Halogen-Free systemLight weight material relative to standard laminate materialsOptimal ..
CTE, linear	25.9 µm/m-°C	14.4 µin/in-°F
Atom Adhesives AA-BOND 2156 Epoxy Adhesive AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compone..
CTE, linear	25.9 µm/m-°C	14.4 µin/in-°F
Atom Adhesives AA-SUPERTHERM 05 Epoxy Adhesive AA-SUPERTHERM 05 is a thixotropic (smooth paste) Pure Diamond ultra-high thermally conductive epoxy two-part adhesive that develops strong, durable, high-impact bonds at room temperature which impro..
CTE, linear	26.0 - 34.0 µm/m-°C @Temperature 75.0 - 175 °C	14.4 - 18.9 µin/in-°F @Temperature 167 - 347 °F	Average value: 27.9 µm/m-°C Grade Count:1
Overview of materials for Polyethersulfone, Carbon Fiber Reinforced This property data is a summary of similar materials in the MatWeb database for the category "Polyethersulfone, Carbon Fiber Reinforced". Each property range of values reported is minimum and maximu..
CTE, linear	25.9 µm/m-°C @Temperature 20.0 °C	14.4 µin/in-°F @Temperature 68.0 °F	ASTM D696
PolyOne Edgetek® ES-20GF/000 Polyethersulfone, Glass Filled (discontinued **) Description/Features:Glass Fiber ReinforcedInformation provided by PolyOne Corporation.
CTE, linear	26.0 µm/m-°C	14.4 µin/in-°F	ISO 11359-2
Polyplastic Armlen® PP GF 30-1EX Polypropylene Copolymer, 30% Glass Fiber Information provided by PolyPlastic Group.
CTE, linear	26.0 - 70.0 µm/m-°C	14.4 - 38.9 µin/in-°F	Average value: 39.7 µm/m-°C Grade Count:26
Overview of materials for Polypropylene with 30% Glass Fiber Filler This property data is a summary of similar materials in the MatWeb database for the category "Polypropylene with 30% Glass Fiber Filler". Specific grades with glass content between 25% and 34% are i..