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Polymer Property : CTE, linear = 150 µm/m-°C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | ISO 11359 |
| Polikim High Density Polyethylene (HDPE) High density polyethylene is preferred when resistance to chemicals and weather is the priority. As it can be supplied in large dimensions and can be welded, its use in construction of tanks and was.. |
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| CTE, linear | 150 µm/m-°C | 83.4 µin/in-°F | Z; IPC-TM-650.2.4.41 |
| Park Electrochemical Nelco® NX9240 PTFE Laminate, Woven-Glass Reinforced The N9000 PTFE laminate system is designed for critical microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the N9000 PTFE laminat.. |
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| CTE, linear | 150 µm/m-°C | 83.4 µin/in-°F | Z; IPC-TM-650.2.4.41 |
| Park Electrochemical Nelco® NX9245 PTFE Laminate, Woven-Glass Reinforced The N9000 PTFE laminate system is designed for critical microwave components, antennas, power amplifiers and subassemblies. Superior mechanical and electrical performance make the N9000 PTFE laminat.. |
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| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | ASTM E831 |
| Parker Chomerics THERM-A-FORM 1641 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | ASTM E831 |
| Parker Chomerics THERM-A-GAP™ GEL 8010 High Performance Fully Cured Dispensable Gel Description: Parker Chomerics fully cured dispensable GELs eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) compl.. |
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| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | |
| Resinlab® UR3001HP Black Urethane Encapsulant Resinlab™ UR3001HP Black is a black, two component, room temperature curing urethane encapsulating system. It is designed to cure completely at room temperature. UR3001HP Black provides excellent e.. |
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| CTE, linear | 150 - 180 µm/m-°C @Temperature 20.0 °C |
83.3 - 100 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Solvay Specialty Polymers Solef® 21508 PVDF Copolymer
(discontinued **) Key features of this grade: High Elongation, Wire & Cable, Plenum, Formulated. Recommended processing is extrusion. Available as powder & granules.General information about SOLEF® PVDF: SOLEF® P.. |
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| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | Average value: 150 µm/m-°C Grade Count:3 |
| Overview of materials for Nylon 11, Powder This property data is a summary of similar materials in the MatWeb database for the category "Nylon 11, Powder". Each property range of values reported is minimum and maximum values of appropriate M.. |
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| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| LyondellBasell Petrothene® KR92828 High Density Polyethylene ApplicationsPETROTHENE KR 92828 is a high molecular weight, high density polyethylene-based compound designed for use in jacketing, conduit or wire insulation. KR 92828 contains a carbon black cont.. |
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| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
DIN 53752 |
| GEHR Plastics PE-ELS® Polyethylene HDPE A variant of PE-HD with improved electrical conductivity.Polyethylene has a good chemical resistance against almost all acids and bases, detergents and hot water. PE has good insulation properties a.. |
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| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | DIN 52328 |
| Isoflon PP Polypropylene Products with excellent friction, anti-stick, abrasion and chemical inertia characteristicsVery good impact resistanceNo moisture regainProduct for the food industryInformation provided by Isoflon. |
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| CTE, linear | 150 µm/m-°C @Temperature -30.0 - 30.0 °C |
83.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM E831 |
| A. Schulman POLYPUR™ FPU 1117 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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| CTE, linear | 150 µm/m-°C @Temperature 0.000 - 70.0 °C |
83.3 µin/in-°F @Temperature 32.0 - 158 °F |
DIN 53752 |
| Borealis RA130E-2491 Polypropylene Random Copolymer RA130E-2491 is a high molecular weight, low melt flow rate polypropylene random copolymer (PP-R) compound and is blue colored. Applications: domestic water, heating, relining, plumbing, and industr.. |
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| CTE, linear | 150 µm/m-°C @Temperature 0.000 - 70.0 °C |
83.3 µin/in-°F @Temperature 32.0 - 158 °F |
DIN 53752 |
| Borealis RA130E-6015 Polypropylene Random Copolymer RA130E-6015 is a high molecular weight, low melt flow rate polypropylene random copolymer (PP-R) compound and is green colored. Applications: domestic water, heating, relining, plumbing, and indust.. |
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| CTE, linear | 150 µm/m-°C @Temperature -30.0 - 30.0 °C |
83.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM E831 |
| A. Schulman POLYPUR™ FPU 1117 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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| CTE, linear | 150 µm/m-°C @Temperature -30.0 - 30.0 °C |
83.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM E831 |
| A. Schulman POLYPUR™ FPU 1117 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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| CTE, linear | 150 µm/m-°C @Temperature -30.0 - 30.0 °C |
83.3 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM E831 |
| A. Schulman POLYPUR™ FPU 1117 Thermoplastic Polyurethane Compound Information provided by A. Schulman. |
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| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | Above Tg |
| Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se.. |
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| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | Above Tg |
| Tra-Con Tra-Bond 293-1M General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1M general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper and brass. The 293-se.. |
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| CTE, linear | 150 µm/m-°C | 83.3 µin/in-°F | Above Tg |
| Tra-Con Tra-Bond Ablebond 933-1.5 Moisture Resistant Encapsulant TRA-BOND 933-1.5 electrically insulating epoxy encapsulant is formulated to provide a smooth crown over the device of wire bonds. This encapsulant provides protection from thermal and mechanical sho.. |
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| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
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| Trelleborg Emerson & Cuming Stycast® 5954 Two-Component Silicone High Service Temp Encapsulant Features and Typical ApplicationsAbility to withstand high temperatures, thermal shock, and chemical exposure. These products are designed for heat generating electronic devices which operate in har.. |
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| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
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| Cytec EN-2523 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s.. |
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| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
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| Cytec EN-2534 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s.. |
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| CTE, linear | 150 µm/m-°C @Temperature 20.0 °C |
83.3 µin/in-°F @Temperature 68.0 °F |
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| Arkema Group Rilsan® Fine Powders Polyamide 11 Rilsan® fine powder coatings offer weatherability, long-lasting adhesion, chalk resistance, chemical resistance to aliphatic hydrocarbons, bases, salt solutions, oils, greases and other petroleum p.. |
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