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- Polymer Property : CTE, linear = 19.4 µin/in-°F
Polymer Property : CTE, linear = 19.4 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 35.0 µm/m-°C @Temperature 23.0 - 100 °C |
19.4 µin/in-°F @Temperature 73.4 - 212 °F |
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| Quadrant EPP Ketron® HPV PEEK + carbon fibres + PTFE + graphite, bearing grade, extruded (ISO Data) The addition of carbon fibres, PTFE and graphite to virgin PEEK results in a Ketron PEEK “bearing grade”. Its excellent tribological properties (low friction, long wear and high pressure-velocity .. |
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| CTE, linear | 35.0 - 53.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
19.4 - 29.4 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics Lexan® LGN1500 PC (Asia Pacific) |
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| CTE, linear | 35.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
19.4 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| LNP ULTEM® JD7902 Polyetherimide
(discontinued **) Forms: PelletsInformation provided by LNP, a GE Plastics Company.This data sheet is labeled Discontinued; however many LNP grades are still active under new names instituted after the SABIC purchase.. |
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| CTE, linear | 35.0 - 50.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
19.4 - 27.8 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics NORYL S100G10 PPE+PS (Asia Pacific) |
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| CTE, linear | 35.0 µm/m-°C | 19.4 µin/in-°F | via TMA |
| Specialty Coating Systems Parylene C Poly (P-Xylylene) Coating Parylene C is a polymer of para-xylylene modified by the substitution of a chlorine atom for one of the aromatic hydrogen atoms. Parylene C has a useful combination of electrical and physical proper.. |
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| CTE, linear | 35.0 µm/m-°C @Temperature 20.0 °C |
19.4 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Toyobo T-400 Nylon, 15% Glass-Reinforced Key Feature: G.F. 15%Information provided by Toyobo Co., Ltd |
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| CTE, linear | 35.0 µm/m-°C @Temperature 20.0 °C |
19.4 µin/in-°F @Temperature 68.0 °F |
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| Tra-Con Tra-Cast F353 Optically Opaque Casting System TRA-CAST F353 is an optically opaque, low viscosity, two-part epoxy system recommended for molding, potting, embedding, encapsulating, sealing and casting applications involving fiber optic, optical.. |
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| CTE, linear | 35.0 µm/m-°C @Temperature 20.0 °C |
19.4 µin/in-°F @Temperature 68.0 °F |
|
| Loctite® 3563 Epoxy Snap Cure Underfill COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp.. |
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| CTE, linear | 35.0 - 40.0 µm/m-°C | 19.4 - 22.2 µin/in-°F | |
| Master Bond Supreme 11AOHTLO Epoxy Passes NASA Low Outgassing Tests Description: Master Bond Supreme 11AOHTLO is a two component epoxy resin system for high performance bonding and sealing. Although, it is formulated to cure at room temperature, the best cure schedu.. |
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| CTE, linear | 35.0 µm/m-°C @Temperature 40.0 - 130 °C |
19.4 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 6500 Phenolic, Briquette, Injection Molded PLENCO 06500 is a glass reinforced phenolic molding compound offering improved strength, dimensional stability, and excellent electrical properties. UL recognized under component file E40654. 06500 .. |
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| CTE, linear | 35.0 µm/m-°C | 19.4 µin/in-°F | ASTM D696 |
| Unitika UG-100-30 Engineering Plastic Excellent creep resistance, dimensional stability at high temperatureInformation provided by Unitika Ltd. |
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| CTE, linear | 35.0 µm/m-°C @Temperature 20.0 °C |
19.4 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Toyobo VYLOPET® EMC618P PBT/PET Alloy, Anti-microbial Applications: Gas equipment partsFeatures: Good anti-microbialWarpagelessFlame resistantInformation provided by Toyobo. |
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| CTE, linear | 35.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
19.4 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
| CP-Polymer-Technik Wellamid® 6000 MZ 301 CP Combination Nylon 6, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
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| CTE, linear | 35.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
19.4 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
| CP-Polymer-Technik Wellamid® 6600 GV 15 HWCP 15% Glass Fiber Nylon 66, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
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| CTE, linear | 35.0 µm/m-°C | 19.4 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® M10-D Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta.. |
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| CTE, linear | 35.0 µm/m-°C @Temperature 20.0 - 60.0 °C |
19.4 µin/in-°F @Temperature 68.0 - 140 °F |
TMS2 Perkin Elmer |
| Arkema Group Orgalloy® RS 6620 Polyamide 6.6 Alloy 20% Glass Fiber reinforced Polyamide Alloy, Rigid grade, Nylon 6.6 basedMolding of Engineering PartsInformation provided by Arkema Group |
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| CTE, linear | 35.0 µm/m-°C | 19.4 µin/in-°F | ASTM E831 |
| Addiplast Addinyl B2 V20 Nylon 6. 20% Glass Filled Glass fiber reinforced, high strengthInformation provided by Addiplast. |
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| CTE, linear | 35.0 µm/m-°C | 19.4 µin/in-°F | y direction |
| Arlon IsoClad 933 Non-Woven Fiberglass Reinforced PTFE Traditional - Highest Performance, PTFE Coated Light Woven Glass Styles, Interdispersed PTFE FilmInformation provided by Arlon Materials for Electronics (MED). |
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| CTE, linear | 35.0 µm/m-°C @Temperature 20.0 °C |
19.4 µin/in-°F @Temperature 68.0 °F |
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| Armstrong A-661 Epoxy Adhesive A truly unique, two-component, room temperature curing thixotropic epoxy adhesive system, which exhibits good bond strength at service temperatures up to 400°F. Ideal for applications where resist.. |
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| CTE, linear | 35.0 µm/m-°C | 19.4 µin/in-°F | ASTM E831 |
| Addiplast Addinyl A2 ZV15 Nylon 66, 15% Glass Filled Glass fiber reinforced, increased thermal aging stabilityInformation provided by Addiplast. |
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| CTE, linear | 35.0 µm/m-°C @Temperature 23.0 - 100 °C |
19.4 µin/in-°F @Temperature 73.4 - 212 °F |
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| Quadrant EPP Duratron® PAI T5530 PAI, 30% glass fibers, compression moulded (ISO Data) This 30 % glass fibre reinforced grade offers higher stiffness, strength and creep resistance than the Duratron PAI grades mentioned above. It is well suited for structural applications supporting s.. |
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| CTE, linear | 35.0 µm/m-°C @Temperature 40.0 - 130 °C |
19.4 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
| Plenco 7552 Phenolic, Nodular, Injection Molded PLENCO 07552 is a glass fiber reinforced novolac phenolic molding compound, exhibiting superior dimensional stability, good impact strength, and good electrical properties. Type ASTM 5948 MFH. UL re.. |
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| CTE, linear | 35.0 µm/m-°C | 19.4 µin/in-°F | ASTM E831 |
| Addiplast Addinyl B2 V15 Nylon 6, 15% Glass Filled Glass fiber reinforced, high strengthInformation provided by Addiplast. |
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| CTE, linear | 35.0 µm/m-°C | 19.4 µin/in-°F | ASTM E831 |
| Addiplast Addinyl B2 ZV15 Nylon 6, 15% Glass Filled Glass fiber reinforced, increased thermal aging stabilityInformation provided by Addiplast. |
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| CTE, linear | 35.0 - 40.0 µm/m-°C | 19.4 - 22.2 µin/in-°F | |
| Master Bond EP42HT-2LO Low Outgassing, Heat Resistant Two Component Epoxy Master Bond Polymer System EP42HT-2LO is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along with outstanding .. |
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