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Polymer Property : CTE, linear = 28.0 µm/m-°C Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 28.0 µm/m-°C | 15.6 µin/in-°F | DIN 53752 |
| Lehmann & Voss ELECTRAFIL M-2386 Polycarbonate, with carbon fiber and PTFE Applications: Data processing machinery, precision engineering, film and photo industry, sporting and leisure goods, medical enineering.Strong, stiff parts.Electrically conductive, suitable for cont.. |
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| CTE, linear | 28.0 µm/m-°C @Temperature 20.0 °C |
15.6 µin/in-°F @Temperature 68.0 °F |
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| Indium Corp. Indalloy® 2 In-Pb-Ag Solder Alloy Especially useful for soldering against gold, as leaching is minimized. Good thermal fatigue properties. Compatible with Indalloy numbers 204, 205, 206, 7, 10 and 150 in step-soldering applications... |
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| CTE, linear | 28.0 µm/m-°C @Temperature 20.0 °C |
15.6 µin/in-°F @Temperature 68.0 °F |
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| Indium Corp. Indalloy® 227 Sn-In-Ag Solder Alloy Pb free solder can be used as a replacement for 63Sn 37Pb, 62Sn 36Pb 2Ag and 60Sn 40Pb in that it has similar physical and mechanical properties. Not for use over 100°C due to 118°C Sn/In eut.. |
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| CTE, linear | 28.0 µm/m-°C @Temperature 20.0 °C |
15.6 µin/in-°F @Temperature 68.0 °F |
Perpendicular; ASTM E-831 |
| Sumitomo Bakelite North America E 3938A Hardware Grade Epoxy Fiberglass reinforced epoxy molding compound with excellent dimensional stability, good strength and excellent electrical insulation properties.Information provided by Vyncolit, a Sumitomo Bak Group.. |
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| CTE, linear | 28.0 - 45.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.6 - 25.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics NORYL GFN2 PPE+HIPS (Asia Pacific) PPE+PS blend. 20% Glass reinforced. FDA compliance (restrictions apply). Low water absorption. Hydrolytic stability. Dimensional stability. Suitable for fluid engineering applications including pump.. |
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| CTE, linear | 28.0 - 45.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.6 - 25.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics Noryl GFN2L PPE+HIPS (Asia Pacific) This data was supplied by SABIC-IP for the Asia Pacific region. |
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| CTE, linear | 28.0 - 45.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.6 - 25.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics NORYL GFN2L PPE+PS (Asia Pacific) PPE+PS GF20%, hydrolytic stability |
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| CTE, linear | 28.0 µm/m-°C @Temperature 20.0 °C |
15.6 µin/in-°F @Temperature 68.0 °F |
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| Williams Advanced Alloys WS149 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| CTE, linear | 28.0 µm/m-°C @Temperature 20.0 °C |
15.6 µin/in-°F @Temperature 68.0 °F |
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| Williams Advanced Alloys WS174 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| CTE, linear | 28.0 µm/m-°C @Temperature 20.0 °C |
15.6 µin/in-°F @Temperature 68.0 °F |
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| Williams Advanced Alloys WS187 Solder All Williams alloys are available in a variety of shapes and forms, including ribbon, preforms, rod, ring, wire, and custom shapes.Information provided by Williams Advanced Alloys |
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| CTE, linear | 28.0 µm/m-°C | 15.6 µin/in-°F | ASTM D696 |
| Unitika UM-8400-20 Characteristics: High dimensional accuracy (circularity and planarity) Large warping resistance Low linear expansion coefficientInformation provided by Unitika Ltd. |
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| CTE, linear | 28.0 µm/m-°C | 15.6 µin/in-°F | ASTM D696 |
| Diamond Polymers Centrex® 601 Profile Extrusion Grade AES Centrex 601 resin is a very high-impact, low-gloss AES (acrylonitrile-ethylene-propylene-styrene) resin with good resistance to weather aging. It has good melt strength for profile extrusion and can.. |
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| CTE, linear | 28.0 µm/m-°C | 15.6 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® EM127 Electrically Conductive Epoxy Product Description: EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.Advantages & Application Notes: .. |
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| CTE, linear | 28.0 µm/m-°C | 15.6 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A.. |
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| CTE, linear | 28.0 µm/m-°C | 15.6 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® OE120 Two Component Epoxy Material Description: A two component, opaque epoxy, designed for fiber optics packaging applications. It is a black-colored version of EPO-TEK 353ND-T. It has a high Tg for resisting elevated ope.. |
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| CTE, linear | 28.0 µm/m-°C | 15.6 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® OM125 Optical Epoxy Product Description: EPO-TEK® OM125 is two component, high Tg, optical epoxy designed for bonding multi-mode fiber optic connectors. Advantages & Application Notes: Color coded blue for easy operat.. |
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| CTE, linear | 28.0 µm/m-°C | 15.6 µin/in-°F | Below Tg |
| Epoxy Technology EPO-TEK® P1011S Electrically Conductive Modified Polyimide Product Description: EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-a.. |
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| CTE, linear | 28.0 µm/m-°C @Temperature 20.0 °C |
15.6 µin/in-°F @Temperature 68.0 °F |
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| Armstrong A-12 Epoxy Adhesive, at 2:3 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati.. |
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| CTE, linear | 28.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
15.6 µin/in-°F @Temperature 73.4 - 176 °F |
53752-A |
| BASF Elastollan R 1001 10% Glass Filled TPUR Description: Thermoplastic Polyester Polyurethane Elastomers with exceptional properties, very high impact resistance, high modulus with at the same time elasticity, low coefficient of thermal expan.. |
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| CTE, linear | 28.0 µm/m-°C @Temperature 20.0 °C |
15.6 µin/in-°F @Temperature 68.0 °F |
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| AIM 70In/30Pb Solder for Photonic Packaging Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials. |
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| CTE, linear | 28.0 µm/m-°C @Temperature 20.0 °C |
15.6 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| LATI LARTON G/30 30% Glass Fiber Filled Polyphenylene sulfide (PPS)
(discontinued **) Description: Larton thermoplastics are polyphenylene sulfide (PPS) products. They are distinguished by a group of very interesting properties combined with easy moldability. Larton parts feature: ex.. |
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| CTE, linear | 28.0 - 45.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
15.6 - 25.0 µin/in-°F @Temperature -22.0 - 86.0 °F |
TMA |
| SABIC Innovative Plastics NORYL PX2934 PPE+PS (Asia Pacific) PPE+PS GF20% High Heat Non-FR |
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| CTE, linear | 28.0 - 97.0 µm/m-°C | 15.6 - 53.9 µin/in-°F | Average value: 46.2 µm/m-°C Grade Count:35 |
| Overview of materials for Nylon 6, 10% Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Nylon 6, 10% Glass Fiber Filled". Specific grades with glass content between 5% and 14% are included. .. |
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| CTE, linear | 28.0 - 28.0 µm/m-°C @Temperature 140 - 180 °C |
15.6 - 15.6 µin/in-°F @Temperature 284 - 356 °F |
Average value: 28.0 µm/m-°C Grade Count:1 |
| Overview of materials for Polysulfone, 20% Glass Fiber Reinforced This property data is a summary of similar materials in the MatWeb database for the category "Polysulfone, 20% Glass Fiber Reinforced". Specific grades with glass content between 15% and 24% are inc.. |
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