Polymer Property : CTE, linear = 29.4 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	53.0 - 53.0 µm/m-°C @Temperature 40.0 - 130 °C	29.4 - 29.4 µin/in-°F @Temperature 104 - 266 °F	Average value: 53.0 µm/m-°C Grade Count:1
Overview of materials for Phenolic, Resole, Mineral Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Resole, Mineral Filled". Each property range of values reported is minimum and maximum values ..
CTE, linear	53.0 µm/m-°C @Temperature 40.0 - 130 °C	29.4 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 00732 Melamine-Phenolic, Granular, Transfer Molded PLENCO 00732 is a melamine-phenolic copolymer molding compound, exhibiting excellent electrical and flame resistant properties. Type ASTM 5948 CMG, and UL recognized under component file E40654. 007..
CTE, linear	53.0 µm/m-°C @Temperature 40.0 - 130 °C	29.4 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 1508 Polyester, Briquette, Transfer Molded PLENCO 01508 is a mineral filled pelletized polyester molding compound, which offers excellent heat resistance and electrical properties. UL recognized under component file E40654. 01508 is availabl..
CTE, linear	53.0 µm/m-°C @Temperature 40.0 - 130 °C	29.4 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 4485 Phenolic, Granular, Compression Molded PLENCO 04485 is a mineral filled phenolic molding compound offering excellent heat resistance, electrical resistance, and dimensional stability. UL recognized under component file E40654. 04485 is a..
CTE, linear	53.0 µm/m-°C @Temperature 40.0 - 130 °C	29.4 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 6582 Phenolic, Briquette, Injection Molded PLENCO 06582 is a rubber modified phenolic molding compound, offering excellent heat resistant properties, along with improved mechanical strength at elevated temperatures. UL recognized under compo..
CTE, linear	53.0 µm/m-°C @Temperature 40.0 - 130 °C	29.4 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 7200 Phenolic, Granular, Injection Molded PLENCO 07200 is an organic fiber reinforced phenolic molding compound, offering improved mechanical strength, good powder properties and excellent cosmetic properties. UL recognized under component ..
CTE, linear	53.0 µm/m-°C	29.4 µin/in-°F	ISO 11359-2
Unitika M1030DH PA6, Dry Nano composite nylonInformation provided by Unitika Ltd.
CTE, linear	53.0 µm/m-°C @Temperature 20.0 °C	29.4 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Bond 716C01 Medium Viscosity Epoxy Adhesive TRA-BOND 716C01 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications. This two-part amber adhesive is easily mixed, used and cured at room temperature..
CTE, linear	53.0 µm/m-°C @Temperature 20.0 °C	29.4 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Bond FDA12 Food and Drug Application Epoxy Adhesive TRA-BOND FDA12 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admin..
CTE, linear	53.0 µm/m-°C @Temperature 20.0 °C	29.4 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Bond FDA16 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-16 EPOXY ADHESIVE is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests,..
CTE, linear	53.0 µm/m-°C @Temperature 20.0 °C	29.4 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Bond FDA2T Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and receive..
CTE, linear	53.0 µm/m-°C @Temperature 20.0 °C	29.4 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Bond FDA2YL02 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2 YL02 is a medium viscosity epoxy resin system specifically developed for adhesive and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug..
CTE, linear	53.0 µm/m-°C @Temperature 20.0 °C	29.4 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Bond FDA8 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-8 EPOXY ADHESIVE is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food an..
CTE, linear	53.0 µm/m-°C	29.4 µin/in-°F	ISO 11359-2
Unitika M1030DH PA6, Conditioned Nano composite nylonInformation provided by Unitika Ltd.
CTE, linear	53.0 µm/m-°C @Temperature 20.0 °C	29.4 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Bond FDA12WH01 Food and Drug Application Epoxy Adhesive TRA-BOND FDA12 WH01 is a medium viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug ..
CTE, linear	53.0 µm/m-°C	29.4 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® 360T High Temperature Epoxy Material Description: A two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. It is a thixotropic..
CTE, linear	53.0 µm/m-°C	29.4 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe..
CTE, linear	53.0 µm/m-°C	29.4 µin/in-°F	Below Tg
Epoxy Technology EPO-TEK® H20-HC Electrically Conductive Epoxy Product Description: EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is al..
CTE, linear	53.0 µm/m-°C @Temperature 20.0 °C	29.4 µin/in-°F @Temperature 68.0 °F
Armstrong A-701 Epoxy Adhesive A one-component, light gray, thixotropic, non-sag epoxy adhesive. A-701 uses an inert oxide filler that provides excellent electrical insulation properties. Features high temperature, 400°F, bond..
CTE, linear	53.0 µm/m-°C @Temperature 20.0 °C	29.4 µin/in-°F @Temperature 68.0 °F
Armstrong A-706 Epoxy Adhesive A one-component, gray, aluminum-filled, thixotropic, non-sag epoxy adhesive. A-706 has an in-service temperature range to 400°F, but requires 350°F minimum cure temperature. Features excellent m..
CTE, linear	52.9 µm/m-°C	29.4 µin/in-°F
Atom Adhesives AA-BOND FDA2 Epoxy Adhesive AA-BOND FDA2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and recei..
CTE, linear	52.9 µm/m-°C	29.4 µin/in-°F
Atom Adhesives AA-BOND FDA2T Epoxy Adhesive AA-BOND FDA2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received ..
CTE, linear	53.0 µm/m-°C @Temperature 20.0 °C	29.4 µin/in-°F @Temperature 68.0 °F	DIN 53752
GEHR Plastics PPS Polyphenylene Sulfide The linear polyphenylensulfide belongs to the semi-crystalline materials and offers a very high mechanical capacity, thermal and chemical resistance distinguished at the same time, high dimensional ..
CTE, linear	53.0 µm/m-°C @Temperature -30.0 - 80.0 °C	29.4 µin/in-°F @Temperature -22.0 - 176 °F	ASTM E228
Solvay Engineered Polymers DEXFLEX® 925 TPO (discontinued **) Description: DEXFLEX® 925 is a thermoplastic olefinic elastomer (TPO) designed for automotive exterior applications that require a combination of stiffness, low-temperature impact resistance, and e..
CTE, linear	53.0 µm/m-°C	29.4 µin/in-°F	ASTM E831-93
Saint-Gobain Meldin® 2001 Bearing General Notes on Meldin 2000 Series Bearing Products:For High-Temperature, Close-Tolerance Applications. Able to withstand temperatures of 600°F with excursions to 900°F, the Medlin 2000 Series ca..
CTE, linear	53.0 µm/m-°C @Temperature -30.0 - 100 °C	29.4 µin/in-°F @Temperature -22.0 - 212 °F	ASTM D696
LyondellBasell Hifax™ HSBMF248 Thermoplastic Polyolefin Elastomer Description: Hifax™ HSBMF248 high melt flow, 1,400 MPa flexural modulus, paintable, mineral-filled thermoplastic elastomeric olefin (TEO) resin has an excellent combination of flow, rigidity, low t..