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Polymer Property : CTE, linear = 30.6 µin/in-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1502-7866/GN4 PPSU, unreinforced
Applications: Automotive industry, medical- and precision engineering, aircraft industry.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistanceHigh chemical res..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Vertical Direction; ASTM D696
Mitsui Arlenâ„¢ C215 15% Glass Fiber-Reinforced Modified Nylon 6T (COND)
ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss..
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
DIN 53752
Lehmann & Voss LUVOCOM® 1502-7865/BK2 PPSU, unreinforced
Applications: Automotive industry, medical- and precision engineering, aircraft industry.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistanceHigh chemical res..
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
ASTM D696
Samyang Trirex® 3015NF Polycarbonate, Flame Retardancy
PC is characterized by its excellent impact resistance, dimensional stability and excellent thermal resistance.3015NF is a flame retardant grade.Applications: Mobile Phone - battery caseInformation..
CTE, linear 55.0 - 60.0 µm/m-°C
30.6 - 33.3 µin/in-°F
Master Bond UV15LV One Component, UV Curable Epoxy Based System
Product Description: Master Bond UV15LV is a high strength, low viscosity, epoxy based UV curable system for bonding, sealing and coating. It has low viscosity and it is widely used in a variety of ..
CTE, linear 55.0 µm/m-°C

@Temperature 40.0 - 130 °C
30.6 µin/in-°F

@Temperature 104 - 266 °F
TMA; ASTM E831
Plenco 2369 Phenolic, Granular, Compression Molded
PLENCO 02369 is a general purpose, organic filled phenolic molding compound, formulated to minimize the generation of free ammonia for applications that are sensitive to such formation. PLENCO 02369..
CTE, linear 55.1 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Westlake Plastics Imidex Thermoplastic Polyimide
Made from Aurum® resin. Applications include electronics, acoustics, composites, wire/cable insulation, adhesive film, and washers/gaskets. It will not melt unto itself, is thermoformable, has hi..
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
Absolute Drying; ASTM-D696
Toyobo GLAMIDE® TY-145TZ Nylon-6
GLAMIDE® is very tough and exhibits high abrasion resistance. It has a high melting point and heat resistance, has well-balanced proportions of mechanical properties, performs self-distinguishing a..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Bond 2112 Rigid Epoxy Staking Compound
TRA-BOND 2112 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Bond 2116 Low Vapor Pressure Epoxy Staking Compound
TRA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronic, aerospace, and industrial applications where..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Bond 2135D High Impact Epoxy Adhesive
TRA-BOND 2135D is a medium viscosity epoxy adhesive recommended for bonding, laminating, sealing, and structural repair applications where easy mixing and good wetting combined with high impact stre..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Bond F113 High Impact Optically Clear Epoxy Adhesive
TRA-BOND F113 is an optically clear, low viscosity, high impact epoxy adhesive developed for bonding and small volume potting of plastic or glass optical fibers, lenses, and prisms, LED displays, an..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Bond FS279 Blush-Free Non-Sag Structural Epoxy Adhesive
TRA-BOND FS-279 is a two-part epoxy adhesive specifically formulated to be non-sagging and have improved adhesion to smooth, non-porous substrates such as glass, ceramic, stainless steel, etc. This ..
CTE, linear 55.0 µm/m-°C

@Temperature -30.0 - 80.0 °C
30.6 µin/in-°F

@Temperature -22.0 - 176 °F
Borealis Method
Borealis Daplen™ EF267AI Polypropylene TPO Compound
Daplen™ EF267AI is a 20 % mineral filled polypropylene compound intended for injection molding. This material has an excellent balance between impact strength and stiffness and is easy to process...
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Bond 2104 Rigid Epoxy Staking Compound
TRA-BOND 2104 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Tra-Con Tra-Bond 2110 High Impact Epoxy Staking Compound
TRA-BOND 2110 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and manufacturing applications where long pot-life, good wetting, n..
CTE, linear 55.0 µm/m-°C

@Temperature 23.0 - 80.0 °C
30.6 µin/in-°F

@Temperature 73.4 - 176 °F
DIN 53752
CP-Polymer-Technik Wellamid® 6000 MR 409 HWCP Mineral Nylon 6, Heat Stabilized, Dry
Information provided by CP-Polymer-Technik GmbH & Co. KG
CTE, linear 55.0 µm/m-°C

@Temperature 23.0 - 260 °C
30.6 µin/in-°F

@Temperature 73.4 - 500 °F
ASTM D696
Daelim H&L Plavis-N CM Unfilled Aromatic Polyimide Bearing
Compression Molded. Plavis-N: Best physical properties, maximum electrical and thermal insulation, low out-gassing, superior radiation resistance.General Plavis information for all grades:PLAVIS po..
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
Below Tg
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy
Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
Armstrong A-2/E Epoxy Adhesive
This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac..
CTE, linear 55.0 µm/m-°C

@Temperature -30.0 - 30.0 °C
30.6 µin/in-°F

@Temperature -22.0 - 86.0 °F
ASTM D696
Beijing Chemical Industry KAIFA® 301-G10F PBT Resin
10% glass fiber reinforced, flame retardant, good flow, low bleedingInformation provided by Beijing Chemical Industry Research Institute (Group)
CTE, linear 55.1 µm/m-°C
30.6 µin/in-°F
Atom Adhesives AA-BOND FDA15 Epoxy Adhesive
AA-BOND FDA15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administr..
CTE, linear 55.1 µm/m-°C
30.6 µin/in-°F
Atom Adhesives AA-BOND 2116 Epoxy Adhesive
AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where..
CTE, linear 55.0 µm/m-°C

@Temperature 20.0 °C
30.6 µin/in-°F

@Temperature 68.0 °F
ASTM D696
Chang Chun Plastic PBT4115 Fire Retardant & 15% Glass Fiber Enforced Grade PBT
Information provided by Dowell Trading Company Ltd.
CTE, linear 55.0 - 65.0 µm/m-°C
30.6 - 36.1 µin/in-°F
Polykemi
Polykemi AB POLYfill PP HJ752 UV2 Polypropylene/Elastomer, Mineral Reinforced
Information provided by Polykemi AB
CTE, linear 55.0 µm/m-°C

@Temperature -30.0 - 80.0 °C
30.6 µin/in-°F

@Temperature -22.0 - 176 °F
ASTM E228
Solvay Engineered Polymers DEXFLEX® 930 TPO  (discontinued **)
Description: DEXFLEX® 930 is a thermoplastic olefinic elastomer (TPO) designed for large automotive exterior applications that require high flow for excellent processability, ductile impact propert..
CTE, linear 55.0 - 65.0 µm/m-°C

@Temperature 20.0 °C
30.6 - 36.1 µin/in-°F

@Temperature 68.0 °F
Abatron AboCast/AboCure 8109-7
Processing: 100/80 pbw; Potlife: 6-7 days/20°C (68°F), 12-24 h/40°C (105°F), 0.75-7 h /60°C (140°F); mix at 50-80°C (120-175°F); cures in: 1 h/100°C (212°F) + 4 h/150°C (300°F) postcure...
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
ASTM E831
Addiplast Addinyl PMD 20170 Nylon 66
GalvanizingInformation provided by Addiplast.
CTE, linear 55.0 µm/m-°C
30.6 µin/in-°F
ASTM D696
Proto3000 PPSF Fused Deposition Modeling Polymer
Description: PPSF/PPSU (polyphenylsulfone) material has the greatest heat and chemical resistance of all Fortus materials - ideal for aerospace, automotive and medical applications. PPSF parts manuf..
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