Thermal Properties | Metric | English | Comments |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1502-7866/GN4 PPSU, unreinforced Applications: Automotive industry, medical- and precision engineering, aircraft industry.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistanceHigh chemical res.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
Vertical Direction; ASTM D696 |
Mitsui Arlen™ C215 15% Glass Fiber-Reinforced Modified Nylon 6T (COND) ARLEN™ is a heat resistant, modified polyamide 6T developed by Mitsui Chemicals, Inc. With a high melting point (320°C) and a rigidity level comparable to super engineering plastics, it poss.. |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | DIN 53752 |
Lehmann & Voss LUVOCOM® 1502-7865/BK2 PPSU, unreinforced Applications: Automotive industry, medical- and precision engineering, aircraft industry.Especially suitable for medical parts, superheated steam sterilizable, hydrolysis resistanceHigh chemical res.. |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM D696 |
Samyang Trirex® 3015NF Polycarbonate, Flame Retardancy PC is characterized by its excellent impact resistance, dimensional stability and excellent thermal resistance.3015NF is a flame retardant grade.Applications: Mobile Phone - battery caseInformation.. |
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CTE, linear | 55.0 - 60.0 µm/m-°C | 30.6 - 33.3 µin/in-°F | |
Master Bond UV15LV One Component, UV Curable Epoxy Based System Product Description: Master Bond UV15LV is a high strength, low viscosity, epoxy based UV curable system for bonding, sealing and coating. It has low viscosity and it is widely used in a variety of .. |
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CTE, linear | 55.0 µm/m-°C @Temperature 40.0 - 130 °C |
30.6 µin/in-°F @Temperature 104 - 266 °F |
TMA; ASTM E831 |
Plenco 2369 Phenolic, Granular, Compression Molded PLENCO 02369 is a general purpose, organic filled phenolic molding compound, formulated to minimize the generation of free ammonia for applications that are sensitive to such formation. PLENCO 02369.. |
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CTE, linear | 55.1 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Westlake Plastics Imidex Thermoplastic Polyimide Made from Aurum® resin. Applications include electronics, acoustics, composites, wire/cable insulation, adhesive film, and washers/gaskets. It will not melt unto itself, is thermoformable, has hi.. |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | Absolute Drying; ASTM-D696 |
Toyobo GLAMIDE® TY-145TZ Nylon-6 GLAMIDE® is very tough and exhibits high abrasion resistance. It has a high melting point and heat resistance, has well-balanced proportions of mechanical properties, performs self-distinguishing a.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond 2112 Rigid Epoxy Staking Compound TRA-BOND 2112 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond 2116 Low Vapor Pressure Epoxy Staking Compound TRA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronic, aerospace, and industrial applications where.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond 2135D High Impact Epoxy Adhesive TRA-BOND 2135D is a medium viscosity epoxy adhesive recommended for bonding, laminating, sealing, and structural repair applications where easy mixing and good wetting combined with high impact stre.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond F113 High Impact Optically Clear Epoxy Adhesive TRA-BOND F113 is an optically clear, low viscosity, high impact epoxy adhesive developed for bonding and small volume potting of plastic or glass optical fibers, lenses, and prisms, LED displays, an.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond FS279 Blush-Free Non-Sag Structural Epoxy Adhesive TRA-BOND FS-279 is a two-part epoxy adhesive specifically formulated to be non-sagging and have improved adhesion to smooth, non-porous substrates such as glass, ceramic, stainless steel, etc. This .. |
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CTE, linear | 55.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
30.6 µin/in-°F @Temperature -22.0 - 176 °F |
Borealis Method |
Borealis Daplen™ EF267AI Polypropylene TPO Compound Daplen™ EF267AI is a 20 % mineral filled polypropylene compound intended for injection molding. This material has an excellent balance between impact strength and stiffness and is easy to process... |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond 2104 Rigid Epoxy Staking Compound TRA-BOND 2104 is a thixotropic epoxy system recommended for critical electronic, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-s.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Tra-Con Tra-Bond 2110 High Impact Epoxy Staking Compound TRA-BOND 2110 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and manufacturing applications where long pot-life, good wetting, n.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 23.0 - 80.0 °C |
30.6 µin/in-°F @Temperature 73.4 - 176 °F |
DIN 53752 |
CP-Polymer-Technik Wellamid® 6000 MR 409 HWCP Mineral Nylon 6, Heat Stabilized, Dry Information provided by CP-Polymer-Technik GmbH & Co. KG |
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CTE, linear | 55.0 µm/m-°C @Temperature 23.0 - 260 °C |
30.6 µin/in-°F @Temperature 73.4 - 500 °F |
ASTM D696 |
Daelim H&L Plavis-N CM Unfilled Aromatic Polyimide Bearing Compression Molded. Plavis-N: Best physical properties, maximum electrical and thermal insulation, low out-gassing, superior radiation resistance.General Plavis information for all grades:PLAVIS po.. |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | Below Tg |
Epoxy Technology EPO-TEK® 509FM-1 General Purpose Epoxy Product Description: EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic indust.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
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Armstrong A-2/E Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac.. |
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CTE, linear | 55.0 µm/m-°C @Temperature -30.0 - 30.0 °C |
30.6 µin/in-°F @Temperature -22.0 - 86.0 °F |
ASTM D696 |
Beijing Chemical Industry KAIFA® 301-G10F PBT Resin 10% glass fiber reinforced, flame retardant, good flow, low bleedingInformation provided by Beijing Chemical Industry Research Institute (Group) |
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CTE, linear | 55.1 µm/m-°C | 30.6 µin/in-°F | |
Atom Adhesives AA-BOND FDA15 Epoxy Adhesive AA-BOND FDA15 is a low viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Administr.. |
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CTE, linear | 55.1 µm/m-°C | 30.6 µin/in-°F | |
Atom Adhesives AA-BOND 2116 Epoxy Adhesive AA-BOND 2116 is a thixotropic, low vapor pressure epoxy system that passes the NASA Outgassing Specification. It is recommended for critical electronics, aerospace, and industrial applications where.. |
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CTE, linear | 55.0 µm/m-°C @Temperature 20.0 °C |
30.6 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
Chang Chun Plastic PBT4115 Fire Retardant & 15% Glass Fiber Enforced Grade PBT Information provided by Dowell Trading Company Ltd. |
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CTE, linear | 55.0 - 65.0 µm/m-°C | 30.6 - 36.1 µin/in-°F | Polykemi |
Polykemi AB POLYfill PP HJ752 UV2 Polypropylene/Elastomer, Mineral Reinforced Information provided by Polykemi AB |
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CTE, linear | 55.0 µm/m-°C @Temperature -30.0 - 80.0 °C |
30.6 µin/in-°F @Temperature -22.0 - 176 °F |
ASTM E228 |
Solvay Engineered Polymers DEXFLEX® 930 TPO
(discontinued **) Description: DEXFLEX® 930 is a thermoplastic olefinic elastomer (TPO) designed for large automotive exterior applications that require high flow for excellent processability, ductile impact propert.. |
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CTE, linear | 55.0 - 65.0 µm/m-°C @Temperature 20.0 °C |
30.6 - 36.1 µin/in-°F @Temperature 68.0 °F |
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Abatron AboCast/AboCure 8109-7 Processing: 100/80 pbw; Potlife: 6-7 days/20°C (68°F), 12-24 h/40°C (105°F), 0.75-7 h /60°C (140°F); mix at 50-80°C (120-175°F); cures in: 1 h/100°C (212°F) + 4 h/150°C (300°F) postcure... |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM E831 |
Addiplast Addinyl PMD 20170 Nylon 66 GalvanizingInformation provided by Addiplast. |
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CTE, linear | 55.0 µm/m-°C | 30.6 µin/in-°F | ASTM D696 |
Proto3000 PPSF Fused Deposition Modeling Polymer Description: PPSF/PPSU (polyphenylsulfone) material has the greatest heat and chemical resistance of all Fortus materials - ideal for aerospace, automotive and medical applications. PPSF parts manuf.. |