Polymer Property : CTE, linear = 35.6 µin/in-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	64.1 µm/m-°C @Temperature -40.0 - 149 °C	35.6 µin/in-°F @Temperature -40.0 - 300 °F	ASTM E831
Quadrant EPP PPO Polyphenylene oxide, unfilled, extruded (ASTM Product Data Sheet) Data provided by Quadrant Engineering Plastic Products.
CTE, linear	64.0 Âµm/m-Â°C @Temperature -30.0 - 100 Â°C	35.6 Âµin/in-Â°F @Temperature -22.0 - 212 Â°F	ASTM D696
LyondellBasell Hifaxâ„¢ HSBMG265 Thermoplastic Polyolefin Elastomer Description: Hifaxâ„¢ HSBMG265 medium high melt flow, 1,400 MPa flexural modulus, paintable, mineral-filled thermoplastic elastomeric olefin (TEO) resin has an excellent combination of rigidity, ..
CTE, linear	64.0 µm/m-°C	35.6 µin/in-°F	ASTM D696
Unitika U-8400H U series resins are polymer alloys that are improved in resistance to oils and chemicals, the shortcoming of amorphous resins. They are transparent and have a greater moisture blocking property than..
CTE, linear	64.0 µm/m-°C @Temperature 20.0 °C	35.6 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Bond 2147 Thixotropic Epoxy/Polyamide Adhesive TRA-BOND 2147 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting..
CTE, linear	64.0 µm/m-°C @Temperature 20.0 °C	35.6 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Bond FS163 Medium Viscosity Epoxy/Polyamide Adhesive TRA-BOND FS163 is a medium viscosity polyamide/epoxy adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are r..
CTE, linear	64.0 µm/m-°C @Temperature 20.0 °C	35.6 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Bond FS227 Thixotropic Epoxy/Polyamide Adhesive TRA-BOND FS227 is a thixotropic (thick paste) polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wettin..
CTE, linear	64.0 µm/m-°C @Temperature 20.0 °C	35.6 µin/in-°F @Temperature 68.0 °F
Tra-Con Tra-Bond 2143D Medium Viscosity Polyamide Epoxy Adhesive TRA-BOND 2143D is a medium viscosity adhesive recommended for industrial bonding and sealing applications where toughness, impact resistance, and superior mechanical properties are required. This tw..
CTE, linear	64.0 µm/m-°C @Temperature 20.0 °C	35.6 µin/in-°F @Temperature 68.0 °F
Cotronics Duralco™ 4460 Electrically Resistant, Low Viscosity Epoxy Adhesive, Coating, and Sealant Excellent adhesion to metals, plastics, ceramics and glass. High bond strength, low moisture absorption, high thermal stability, low shrinkage and excellent chemical, electrical, and radiation resi..
CTE, linear	64.0 µm/m-°C @Temperature 20.0 °C	35.6 µin/in-°F @Temperature 68.0 °F
Cotronics Duralco™ 4461 Electrically Resistant, Low Viscosity Epoxy Adhesive, Coating, and Sealant
CTE, linear	64.0 µm/m-°C @Temperature 20.0 °C	35.6 µin/in-°F @Temperature 68.0 °F
Cotronics Duralco™ 4525 Electrically Resistant, Room Temperature Curing Epoxy High bond strength, high thermal stability, low moisture absorption, low shrinkage and excellent chemical, electrical, and radiation resistance.Chemical Resistance: resistant to hydrochloric, phosph..
CTE, linear	64.0 µm/m-°C @Temperature 20.0 °C	35.6 µin/in-°F @Temperature 68.0 °F
Cotronics 4700 Ultra Temp Adhesive and Casting Epoxy, General Purpose
CTE, linear	64.1 µm/m-°C	35.6 µin/in-°F
BCC Products MB 4000 RED Urethane Foundry Plank MB4000 Red is an extremely tough, high impact Urethane Plank, that can replace aluminum and other metals for many foundry applications. Features: excellent machinability, low dust emission, mostly ..
CTE, linear	64.1 µm/m-°C	35.6 µin/in-°F
Atom Adhesives AA-BOND FS227 Epoxy Adhesive AA-BOND FS227 is a thixotropic polymer epoxy/polyamide system developed for industrial adhesive and sealing applications where the combination of high fill, easy handling, good wetting, toughness, a..
CTE, linear	64.0 µm/m-°C @Temperature 40.0 - 130 °C	35.6 µin/in-°F @Temperature 104 - 266 °F	TMA; ASTM E831
Plenco 2311 Phenolic, Granular, Transfer Molded PLENCO 02311 is a versatile general purpose organic filled phenolic molding compound offering excellent mold processability and optimized cure cycles. PLENCO 02311 is also granulated to provide impr..