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Polymer Property : CTE, linear = 8.33 µin/in-°F Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 15.0 µm/m-°C | 8.33 µin/in-°F | X-Direction; TMA; 10°C/min; ASTM D3386; IPC-TM-650 2.4.41 |
| Rogers Corporation RT/duroid® 6202 High Frequency Laminate Features:Low loss for excellent high frequency performanceTight dielectric constant and thickness controlExcellent electrical and mechanical propertiesExtremely low thermal coefficient of dielectric.. |
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| CTE, linear | 15.0 - 20.0 µm/m-°C @Temperature 50.0 - 150 °C |
8.33 - 11.1 µin/in-°F @Temperature 122 - 302 °F |
ISO 11359-2 |
| Raschig Group 3505 Epoxy Glass-fiber reinforced epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. This product meets the allowed.. |
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| CTE, linear | 15.0 - 20.0 µm/m-°C @Temperature 50.0 - 150 °C |
8.33 - 11.1 µin/in-°F @Temperature 122 - 302 °F |
ISO 11359-2 |
| Raschig Group 3535 Epoxy Glass fiber-reinforced epoxy molding compound. Good mechanical strength, very good electrical isolation properties adn dimensional stability even at high temperatures. Form: Low dust granulate pack.. |
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| CTE, linear | 15.0 - 35.0 µm/m-°C @Temperature 50.0 - 100 °C |
8.33 - 19.4 µin/in-°F @Temperature 122 - 212 °F |
ISO 11359-2 |
| Raschig Group MELOPLAS® 181.5 MF Cellulose-reinforced, phenol-modified MF molding compound (MPF) in white and colored shades. Very good electrical properties, high surface hardness, good mechanical strength, high UV and heat resis.. |
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| CTE, linear | 15.0 - 35.0 µm/m-°C @Temperature 50.0 - 100 °C |
8.33 - 19.4 µin/in-°F @Temperature 122 - 212 °F |
ISO 11359-2 |
| Raschig Group MELOPLAS® 182 MF Wood flour-reinforced and inorganically filled, phenol-modified MF molding compound (MPF) in dark colors. Improved dimensional stability and electrical properties as compared with MP 180, high surf.. |
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| CTE, linear | 15.0 - 19.0 µm/m-°C | 8.33 - 10.6 µin/in-°F | Average value: 17.0 µm/m-°C Grade Count:4 |
| Overview of materials for Polyaryletherketone (PAEK), Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyaryletherketone (PAEK), Glass Fiber Filled". Each property range of values reported is minimum and m.. |
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| CTE, linear | 15.0 - 24.0 µm/m-°C | 8.33 - 13.3 µin/in-°F | Average value: 22.9 µm/m-°C Grade Count:10 |
| Overview of materials for Diallyl Phthalate (DAP) Molding Compound, Long Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Diallyl Phthalate (DAP) Molding Compound, Long Glass Fiber Filled". Each property range of values report.. |
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| CTE, linear | 15.0 µm/m-°C | 8.33 µin/in-°F | ISO 11359-2 |
| Solvay Specialty Polymers Ixef® 1022 Polyarylamide (PARA)
(Unverified Data**) Ixef 1022 is a 50% glass-fiber reinforced, general purpose polyarylamide compound which exhibits very high strength and rigidity, outstanding surface gloss, and excellent creep resistance. Ixef 1022.. |
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| CTE, linear | 15.0 µm/m-°C @Temperature 23.0 °C |
8.33 µin/in-°F @Temperature 73.4 °F |
MD; ASTM D696 |
| Mitsui AURUM® JGN6230 Thermoplastic Polyimide Resin, Amorphous
(discontinued **) AURUM® is an easy melt, processable and recyclable thermoplastic polyimide resin that provides continuous service temperatures to 465° F in its amorphous state and up to 550° F when annealed to i.. |
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| CTE, linear | 15.0 - 40.0 µm/m-°C | 8.33 - 22.2 µin/in-°F | Average value: 29.4 µm/m-°C Grade Count:11 |
| Overview of materials for Phenolic, Novolac, Fabric Filled This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Fabric Filled". Each property range of values reported is minimum and maximum values .. |
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| CTE, linear | 15.0 µm/m-°C @Thickness 1.57 mm, Temperature 20.0 °C |
8.33 µin/in-°F @Thickness 0.0620 in, Temperature 68.0 °F |
x-axis |
| Industrial Laminates/Norplex NP841 Glass Fabric
(discontinued **) Description: Woven glass fabric with phenolic resin. Contains Kocite® for controlled conductivity. Acts as static electricity drain to protect electrical and electronic equipment.Thickness Tested: .. |
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| CTE, linear | 15.0 - 71.0 µm/m-°C | 8.33 - 39.4 µin/in-°F | Average value: 35.3 µm/m-°C Grade Count:29 |
| Overview of materials for Nylon 66, Glass Fiber Filled, Flame Retardant This property data is a summary of similar materials in the MatWeb database for the category "Nylon 66, Glass Fiber Filled, Flame Retardant". Each property range of values reported is minimum and ma.. |
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| CTE, linear | 15.0 µm/m-°C @Temperature 20.0 °C |
8.33 µin/in-°F @Temperature 68.0 °F |
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| Indium Corp. Indalloy® 281 Bi-Sn Solder Alloy Good low melting point solder for electronics assembly of for applications where Cd and Pb are to be avoided, and for thermo-electric applications. Shear rate sensitive.Information provided by the m.. |
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| CTE, linear | 15.0 µm/m-°C | 8.33 µin/in-°F | DIN 53752 |
| Lehmann & Voss LUVOCOM® 1/XCF/20 Polyamide 66, with carbon fiber, heat stabilized Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp.. |
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| CTE, linear | 15.0 µm/m-°C @Temperature 20.0 - 100 °C |
8.33 µin/in-°F @Temperature 68.0 - 212 °F |
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| Special Metals BRIGHTRAY® Alloy F Electrical Resistance Alloy A nickel-iron-chromium electrical-resistance alloy for use at temperatures up to 1920°F (1050°C) under continuous operating conditions. Its high iron content and relatively low level of nicke.. |
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| CTE, linear | 15.0 µm/m-°C @Temperature 23.0 - 60.0 °C |
8.33 µin/in-°F @Temperature 73.4 - 140 °F |
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| Sumitomo Bakelite Durez® 29502 B Phenolic, Compression Grade Durez 29502 B brown phenolic is a two stage, glass and mineral filled, special purpose molding material with improved mechanical and heat resistant properties. It is formulated for close tolerance .. |
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| CTE, linear | 15.0 - 30.0 µm/m-°C @Temperature 20.0 - 100 °C |
8.33 - 16.7 µin/in-°F @Temperature 68.0 - 212 °F |
DIN 53752 |
| Schwartz Technical Plastics LAMINEX® 2100 Cotton Fabric, Phenolic Resin Impregnated Application: bearing shells and bearing collarsInformation provided by Schwartz Technical Plastics GmbH |
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| CTE, linear | 15.0 µm/m-°C | 8.33 µin/in-°F | ISO 11359-2 |
| Unitika RUN35-C25 PA6, Dry High modulus and low warpage nylonInformation provided by Unitika Ltd. |
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| CTE, linear | 15.0 µm/m-°C @Temperature 20.0 °C |
8.33 µin/in-°F @Temperature 68.0 °F |
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| California Fine Wire Nickel 220 Super Alloy All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire. |
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| CTE, linear | 15.0 µm/m-°C @Temperature 20.0 °C |
8.33 µin/in-°F @Temperature 68.0 °F |
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| California Fine Wire Nickel 271 Super Alloy All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire. |
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| CTE, linear | 15.0 µm/m-°C @Temperature 20.0 °C |
8.33 µin/in-°F @Temperature 68.0 °F |
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| California Fine Wire Nickel 272 Super Alloy All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire. |
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| CTE, linear | 15.0 µm/m-°C @Temperature 20.0 °C |
8.33 µin/in-°F @Temperature 68.0 °F |
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| California Fine Wire Nickel 5900 Nickel Alloy All values may vary dependent on specific design and usageCapabilities: WireRibbonSquareInsulatedPlatedInformation provided by California Fine Wire. |
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| CTE, linear | 15.0 µm/m-°C | 8.33 µin/in-°F | |
| Atom Adhesives AA-CARB 61 Epoxy Adhesive AA-CARB 61 is an epoxy adhesive and coating formulation based on conductive carbon. AA-CARB 61 is recommended for electronic bonding and sealing applications that require both fine electrical and me.. |
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| CTE, linear | 15.0 µm/m-°C | 8.33 µin/in-°F | |
| Atom Adhesives AA-DUCT 902LP Epoxy Adhesive AA-DUCT 902LP is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value .. |
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| CTE, linear | 15.0 - 25.0 µm/m-°C | 8.33 - 13.9 µin/in-°F | VDE 0304T1 |
| Bulk Molding Compounds tetra-DUR L 4305 Bulk Molding Compound UL-licensed. Anchor wave-isolation.Typical Applications - Requiring mechanical strength, abrasion resistance, dimensional stability, electrical insulation, electrostatic dissipation (explosion prote.. |
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| CTE, linear | 15.0 µm/m-°C | 8.33 µin/in-°F | y direction |
| Arlon AD250 Woven Glass and PTFE Used in the RF and microwave industries, including base station antennas and BSA feed networks.Information provided by Arlon Materials for Electronics (MED). |
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| CTE, linear | 15.0 µm/m-°C @Temperature 20.0 °C |
8.33 µin/in-°F @Temperature 68.0 °F |
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| Cosmic Plastics 6120F Short Glass Fiber Filled Ortho Diallyl Phthalate Molding Compound Data provided by the manufacturer. |
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| CTE, linear | 15.0 - 25.0 µm/m-°C @Temperature 50.0 - 150 °C |
8.33 - 13.9 µin/in-°F @Temperature 122 - 302 °F |
Average value: 19.2 µm/m-°C Grade Count:3 |
| Overview of materials for Epoxy Molding Compound This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr.. |
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| CTE, linear | 15.0 - 17.0 µm/m-°C | 8.33 - 9.44 µin/in-°F | IPC TM-650 2.4.41 |
| Arlon 47N Quick Cure Epoxy Low-Flow Prepreg 47N is a low-flow epoxy prepreg engineered for binding multilayer epoxy rigid-flex or attaching heat sinks to multilayer PCBs. An optional low lamination temperature protects components already mou.. |
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