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- Polymer Property : Thermal Conductivity = 0.360 W/m-K
Polymer Property : Thermal Conductivity = 0.360 W/m-K Product List
Thermal PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | |
| Premix Premi-Glas® 2206-15 CR-SX Fiberglass Reinforced Thermoset SMC Premi-Glas® 2206-15 CR-SX is a fiberglass reinforced thermoset sheet molding compound for electrical, flame retardant and HVAC applications.Key features and benefits are:Non-Halogen FR technology f.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | |
| Premix Premi-Glas® 2206-22 CR-SX Fiberglass Reinforced Thermoset SMC Premi-Glas® 2206-22 CR-SX is a fiberglass reinforced thermoset sheet molding compound for electrical, flame retardant and HVAC applications.Key features and benefits are:Non-Halogen FR technology f.. |
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| Thermal Conductivity | 0.360 - 0.360 W/m-K | 2.50 - 2.50 BTU-in/hr-ft²-°F | Average value: 0.360 W/m-K Grade Count:4 |
| Overview of materials for Polyamide-Imide, Glass Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyamide-Imide, Glass Filled". Each property range of values reported is minimum and maximum values of .. |
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| Thermal Conductivity | 0.360 - 0.504 W/m-K | 2.50 - 3.50 BTU-in/hr-ft²-°F | ASTM C-177 |
| Technetics Group Texolon™ 9406 PTFE
(Unverified Data**) General purpose 25% glass filled PTFE for applications less demandingPTFE CharacteristicsChemical ResistanceThermal StabilityCryogenic PropertiesLow Coefficient of FrictionLow Surface EnergyLow Diel.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612 |
| Lehmann & Voss LUVOCOM® 20-0665 Polyphthalamide, with carbon fiber, PTFE, lubricant modified Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Low influence from moisture an.. |
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| Thermal Conductivity | 0.360 - 0.504 W/m-K | 2.50 - 3.50 BTU-in/hr-ft²-°F | ASTM C177 |
| Garlock 9405 PTFE Rubber Sheet, 25% Glass Filled Premium Grade 25% Glass-filled Skived PTFE SheetInformation provided by Garlock Rubber Technologies |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | ASTM C177 |
| Solvay Specialty Polymers AvaSpire® AV-651 CF30 Polyaryletherketone (PAEK), 30% Carbon Fiber AvaSpire® AV-651 CF30 is a 30% carbon fiber reinforced version of AvaSpire® AV-651. This formulation offers some advantages relative to 30% carbon fiber reinforced PEEK which include better di.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | ASTM C177 |
| Solvay Specialty Polymers KetaSpire® KT-820 SL45 Polyetheretherketone (PEEK) KetaSpire® KT-820 SL45 is a PEEK based compound specifically designed to provide exceptionally low wear rates and good mechanical properties in applications where an external lubricant is provide.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | ASTM C177 |
| Solvay Specialty Polymers Torlon® 5030 Polyamide-imide (PAI), 30% Glass Fiber Torlon® 5030 is a 30% glass-fiber reinforced grade of polyamide-imide (PAI) resin. It offers high strength and modulus and exceptional creep resistance. It has thermal expansion characteristics s.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | |
| Sharadaa Ceramics REFINSUL 11 Insulating Castables Medium/High Purity Description: We offer our clients Insulating Castables that are available in medium as well as high purity. Widely used in various industries, these are renowned for their strength and heat resistan.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | ASTM C518 |
| Sumitomo Bakelite North America XB-22 Fiberglass Reinforced Phenolic Novolac XB-22 is a fiberglass reinforced phenolic novolac molding compound, with excellent dimensional stability and good strength at elevated temperatures. This material is formulated for low thermal condu.. |
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| Thermal Conductivity | 0.360 W/m-K @Temperature 100 °C |
2.50 BTU-in/hr-ft²-°F @Temperature 212 °F |
ASTM E1461 |
| Plenco 2300 Phenolic, Granular, Compression Molded PLENCO 02300 is a general purpose organic filled molding compound formulated to offer excellent processability while maintaining mechanical strength values. UL recognized under component file E40654.. |
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| Thermal Conductivity | 0.360 W/m-K @Temperature 100 °C |
2.50 BTU-in/hr-ft²-°F @Temperature 212 °F |
ASTM E1461 |
| Plenco 7500 Phenolic, Granular, Transfer Molded PLENCO 07500 is an organic reinforced phenolic molding compound, offering improved mechanical strength and excellent cosmetic characteristics. Type ASTM 5948 CFG and UL recognized under component fi.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | |
| CMT Materials HYTAC® B Solid Polymer Tooling Material Sometimes, finer plug assist details are required which are not obtainable or maintainable with syntactic foam plugs. For these high detail applications, where high toughness and easy machinability .. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612 |
| BASF Ultramid® B3EG6 30% Glass Filled PA6 (Dry) Ultramid B3EG6 is a 30% glass fiber reinforced injection molding PA6 grade. It conforms to FDA requirements of 21 CFR 177.1500. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612 |
| BASF Ultramid® B3EG6 BK00564 30% Glass Filled PA6 (Conditioned) Ultramid B3EG6 BK00564 is a 30% glass fiber reinforced, pigmented black injection molding PA6 grade. It conforms to FDA requirements of 21 CFR 177.1500. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612-1 |
| BASF Ultramid® B3EG6 LS BK 23189 30% Glass Filled PA6 (Dry) Information provided by BASF |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612-1 |
| BASF Ultramid® B3EG7 35% Glass Filled PA6 (Conditioned) Description: 35% Glass fiber reinforced injection molding grade for industrial articles and electrical insulating parts.Information provided by BASF |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612-1 |
| BASF Ultramid® B3EG7 35% Glass Filled PA6 (Dry) Description: 35% Glass fiber reinforced injection molding grade for industrial articles and electrical insulating parts.Information provided by BASF |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612-1 |
| BASF Ultramid® B3EG7 BK 00564 35% Glass Filled PA6 (Dry) Description: 35% Glass fiber reinforced injection molding grade for industrial articles and electrical insulating parts.Information provided by BASF |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612 |
| BASF Ultramid® B3G8 BK00564 40% Glass Filled PA6 (Dry) Ultramid B3G8 BK00564 is a 40% glass filled, pigmented black, injection molding PA6 grade. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612 |
| BASF Ultramid® B3WG7 BK 00564 35% Glass Filled PA6 (Conditioned) Description: 35% glass-fiber reinforced and heat aging resistant injection-molding grade, e.g. for automotive manifolds and pedals.Information provided by BASF |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612 |
| BASF Ultramid® B3ZG8 BK 20560 40% Glass Filled PA6-1 (Dry) Description: Impact-modified and 40% glass-fiber reinforced injection-molding grade for technical articles of very high stiffness and toughness, for instance, for vehicle airbag housings and suitcas.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612 |
| BASF Ultramid® B3WG7 BK 00564 30% Glass Filled PA6 (Dry) Description: 35% glass-fiber reinforced and heat aging resistant injection-molding grade, e.g. for automotive manifolds and pedals.Information provided by BASF |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | |
| Quadrant EPP Duratron® PAI T5530 PAI, 30% glass fibers, compression moulded (ISO Data) This 30 % glass fibre reinforced grade offers higher stiffness, strength and creep resistance than the Duratron PAI grades mentioned above. It is well suited for structural applications supporting s.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | ASTM C-518 |
| Sumitomo Bakelite North America FS-10-VO-200-P Short-Glass Reinforced Diallyl Phthalate Short glass fiber reinforced, flame retardant, diallyl meta-phthalate molding compound with excellent heat resistance.Meets the requirements of ASTM D5948 Type SIG-F.Information provided by Vyncolit.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | Product Property; ASTM E 1530 |
| Arlon R36601A010 0.010" (0.254 mm) Uncured Silicone Rubber with Fiberglass Substrate Description: Generation II Thermabond® NP electrically insulating electronic adhesive. Bonds without primer.Design/Construction: Liner 1: Polyethylene Side 1: Uncured Silicone Rubber Substrate: Sty.. |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | ASTM C177 |
| Quantum Acetal-Homopolymer Information provided by Quantum Advanced Engineering Plastics |
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| Thermal Conductivity | 0.360 W/m-K | 2.50 BTU-in/hr-ft²-°F | DIN 52612 |
| BASF Ultramid® B3WG6 30% Glass Filled PA6 (Dry) Ultramid B3WG6 is a 30% glass fiber reinforced, heat stabilized injection molding PA6 grade. |
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