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Polymer Property : Thermal Conductivity = 1.20 W/m-K Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 1.20 W/m-K

@Pressure 2.07 MPa
8.33 BTU-in/hr-ft²-°F

@Pressure 300 psi
ASTM D5470
Parker Chomerics CHO-SEAL 1298 EMI Shielding Material
Corrosion Resistant EMI Shielding Gasket. Through the use of new proprietary particle painting and elastomer compounding technology, CHO-SEAL® 1298 shielding elastomer offers a six-fold increase in..
Thermal Conductivity 1.20 W/m-K

@Pressure 2.07 MPa
8.33 BTU-in/hr-ft²-°F

@Pressure 300 psi
ASTM D5470
Parker Chomerics CHO-SEAL 1350 Conductive Elastomer
Standard material for high volume injection and compression molding and small extrusions; high performance in non-corrosive environments; used in grounding applications with little or no vibration.R..
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
ASTM D5470
Parker Chomerics THERM-A-FORM T642 Cure-in-Place Potting and Underfill Material
Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co..
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
ASTM D5470
Parker Chomerics THERM-A-FORM T644 Cure-in-Place Potting and Underfill Material
Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co..
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
ASTM E 1530
SABIC Innovative Plastics LNP KONDUIT RTF2B PA 66 (Europe-Africa-Middle East)
LNP* Konduit* RTF2B is a compound based on Nylon 66 resin containing Glass Fiber, Proprietary Thermal Filler. Added features of this material include: Thermally Conductive.
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
JIS-R-2618; ASTM D2326
Fujipoly Industries Sarcon® GR-c Gap Filler Pad
Sarcon GR-c is a highly conformable, thermally conductive (no electric conductive) and electromagnetic wave absorption material in areas where space between surfaces is uneven and surface textures v..
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
60°C for 1,000 hrs with 90% RH; JIS-R-2618
Fujipoly Industries Sarcon® GR-c Gap Filler Pad
Sarcon GR-c is a highly conformable, thermally conductive (no electric conductive) and electromagnetic wave absorption material in areas where space between surfaces is uneven and surface textures v..
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
70°C for 1,000 hrs; JIS-R-2618
Fujipoly Industries Sarcon® GR-c Gap Filler Pad
Sarcon GR-c is a highly conformable, thermally conductive (no electric conductive) and electromagnetic wave absorption material in areas where space between surfaces is uneven and surface textures v..
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
JIS-R-2618; ASTM D2326
Fujipoly Industries Sarcon® GR-HFk Gap Filler Pad
Sarcon GR-k is a general type of thermal conductive gel material (no electicity conductive) in a versatile sheet form that easily fits and adheres to most all shapes and sizes of components, and mak..
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
JIS-R-2618; ASTM D2326
Fujipoly Industries Sarcon® GR-Hk Gap Filler Pad
Sarcon GR-k is a general type of thermal conductive gel material (no electicity conductive) in a versatile sheet form that easily fits and adheres to most all shapes and sizes of components, and mak..
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
HOT-DISK; 60x60x3 mm
Lehmann & Voss LUVOCOM® 1-7893/GY Polyamide 66, with carbon fiber, heat stabilized
Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Reduced moment of inertia comp..
Thermal Conductivity 1.20 W/m-K

@Temperature 90.0 °C
8.33 BTU-in/hr-ft²-°F

@Temperature 194 °F
Schott DURAN® Borosilicate Glass
Borosilicate glass 3.3 acc. To ISO 3585, chemically and thermally highly resistant, general-purpose glass for apparatus for the chemical industry, for pipelines, and glasswareInformation provided by..
Thermal Conductivity 1.20 W/m-K

@Temperature 90.0 °C
8.33 BTU-in/hr-ft²-°F

@Temperature 194 °F
Schott DURATAN® Borosilicate Glass
Prestressed borosilicate glass 3.3, chemically and thermally highly resistant, Flameproof lighting The heavy metal content for the elements lead, cadmium, mercury, and hexavalent chromium is below ..
Thermal Conductivity 1.20 W/m-K

@Temperature 90.0 °C
8.33 BTU-in/hr-ft²-°F

@Temperature 194 °F
Schott DUROBAX® amber Neutral Glass Tubing
Neutral glass tubing, chemically highly resistant, with light protection Containers, test tubes, pipettes, chemical and technical apparatus The heavy metal content for the elements lead, cadmium, ..
Thermal Conductivity 1.20 W/m-K

@Temperature 90.0 °C
8.33 BTU-in/hr-ft²-°F

@Temperature 194 °F
Schott Glass 8245 Borosilicate Glass
Borosilicate glass for sealing to Kovar metal and molybdenum, minimum X-ray absorption, low self radiation, good insulator X-ray tubes, video-frequency tubes, photomultiplier tubes The heavy metal..
Thermal Conductivity 1.20 W/m-K

@Temperature 90.0 °C
8.33 BTU-in/hr-ft²-°F

@Temperature 194 °F
Schott Glass 8250 Borosilicate Glass
Borosilicate glass for sealing to Kovar metal and molybdenum, electrically highly insulating, low refractive index, good insulator X-ray tubes, transmitting tubes, image amplifier tubes, He-Ne-lase..
Thermal Conductivity 1.20 W/m-K

@Temperature 90.0 °C
8.33 BTU-in/hr-ft²-°F

@Temperature 194 °F
Schott Glass 8270 Borosilicate Glass
Borosilicate glass for sealing to Kovar metal and molybdenum, electrically highly insulating, defined UV absorption, stabilized against solarization Backlights The heavy metal content for the elem..
Thermal Conductivity 1.20 W/m-K

@Temperature 90.0 °C
8.33 BTU-in/hr-ft²-°F

@Temperature 194 °F
Schott Glass 8487 Borosilicate Glass
Borosilicate glass for sealing to tungsten Backlights, flash lamps, lamp bulbs, exhaust and flare bulbs The heavy metal content for the elements lead, cadmium, mercury, and hexavalent chromium is ..
Thermal Conductivity 1.20 W/m-K

@Temperature 90.0 °C
8.33 BTU-in/hr-ft²-°F

@Temperature 194 °F
Schott Glass 8688 Borosilicate Glass
Borosilicate glass, highly UV-blocked, stabilized against solarization, sealing glass to Tungsten Backlights The heavy metal content of the elements lead, cadmium, mercury, and hexavalent chromium..
Thermal Conductivity 1.20 W/m-K
8.30 BTU-in/hr-ft²-°F
Cotronics Resbond™ 7030 High Temperature Ceramic Adhesive, High Strength
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
Epoxy Technology EPO-TEK® EM127 Electrically Conductive Epoxy
Product Description: EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.Advantages & Application Notes: ..
Thermal Conductivity >= 1.20 W/m-K
>= 8.33 BTU-in/hr-ft²-°F
Arlon 0.008" (0.2032 mm) Thermabond® E-35 Uncured Silicone (99730N008)
0.008 in., ±0.001 (0.2 mm, ±0.03) uncured silicone on 0.003 in. (0.08 mm) nominal PTFE coated fiberglass; 0.001 in. (0.03 mm) FEP interleave; overall thickness 0.008 in ±0.001(0.2 mm ± 0.03). T..
Thermal Conductivity 1.20 W/m-K
8.33 BTU-in/hr-ft²-°F
Aremco Aremco-Bond™ 598 Conductive Epoxy Adhesive  (discontinued **)
Electrically and thermally conductive, nickel-filled, single part system. Low viscosity, inorganic coating for applications to 1000 ºF (540 °C).
Thermal Conductivity 1.20 W/m-K

@Temperature 90.0 °C
8.33 BTU-in/hr-ft²-°F

@Temperature 194 °F
Schott CONTURAX® Borosilicate Glass
Borosilicate glass tubing and rod, varying types of inner and outer shapes Lighting, giftware, and decoration The heavy metal content for the elements lead, cadmium, mercury, and hexavalent chromi..
Thermal Conductivity 1.20 W/m-K

@Temperature 90.0 °C
8.33 BTU-in/hr-ft²-°F

@Temperature 194 °F
Schott DUROBAX® clear Neutral Glass Tubing
Neutral glass tubing, chemically highly resistant Syringes, cartridges, chemical and technical apparatus The heavy metal content for the elements lead, cadmium, mercury, and hexavalent chromium is..
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