Polymer Property : Thermal Conductivity = 1.76 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.254 W/m-K @Temperature 100 °C	1.76 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1225
Arlon CuClad 250 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 250 uses a higher fiberglass/PTFE ratio to provide mechanical properties approaching those of conventional substrates. Better dimensional stability and lower thermal expansion in all directi..
Thermal Conductivity	0.254 W/m-K @Temperature 100 °C	1.76 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1225
Arlon DiClad 522/527 PTFE/Woven Fiberglass Laminates DiClad 522 and DiClad 527 use a higher fiberglass/PTFE ratio to provide mechanical properties approaching conventional substrates.Extremely Low Loss TangentExcellent Dimensional StabilityProduct Per..