Polymer Property : Thermal Conductivity = 2.03 BTU-in/hr-ftÂ²-Â°F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.293 W/m-K	2.03 BTU-in/hr-ftÂ²-Â°F
Momentive Performance Materials RTV8111 Silicone Rubber Compounds for Potting, Encapsulating and Sealing RTV8111, RTV8112 and RTV8262 silicone rubber compounds are two-part silicone elastomers supplied in ready-to-use matched kits containing a base compound and curing agent.Mechanical and electrical pr..
Thermal Conductivity	0.293 W/m-K	2.03 BTU-in/hr-ftÂ²-Â°F
Momentive Performance Materials RTV8112 Silicone Rubber Compounds for Potting, Encapsulating and Sealing RTV8111, RTV8112 and RTV8262 silicone rubber compounds are two-part silicone elastomers supplied in ready-to-use matched kits containing a base compound and curing agent.Mechanical and electrical pr..
Thermal Conductivity	0.293 W/m-K	2.03 BTU-in/hr-ftÂ²-Â°F	ASTM F433
Sumitomo Bakelite North America 73-70-70 C-P /73-70-70 VO-P Short-Glass Reinforced Diallyl Phthalate Ortho Resin Isomer (DAP). Used for critical, high-performance military and commercial electrical components where long-term reliability is demanded.Meets the requirements of ASTM D5948 Type SDG-F.I..
Thermal Conductivity	0.293 W/m-K	2.03 BTU-in/hr-ft²-°F
Cytec EN-2541 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s..
Thermal Conductivity	0.293 W/m-K	2.03 BTU-in/hr-ft²-°F
3M Scotch-Weld™ 183 B/A Green Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive 1838 B/A is a controlled flow product. This epoxy adhesives are two-part, room temperature curing structural adhesives with high shear strengths and excellent envir..