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Polymer Property : Thermal Conductivity = 3.47 BTU-in/hr-ft²-°F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 0.500 W/m-K

@Temperature 80.0 °C
3.47 BTU-in/hr-ft²-°F

@Temperature 176 °F
Z Direction; ASTM C518
Rogers Corporation RO3003 Ceramic-Filled PTFE Composite, High Frequency Circuit Material
Features and Benefits:
Thermal Conductivity 0.500 W/m-K

@Temperature 80.0 °C
3.47 BTU-in/hr-ft²-°F

@Temperature 176 °F
ASTM C518
Rogers Corporation RO4535 Ceramic-Filled, Glass-Reinforced Hydrocarbon Laminate
The RO4500™ Series Cost Performance Antenna Grade Laminates are ceramic-filled, glass-reinforced hydrocarbon based materials that provides the controlled dielectric constant, low loss performance a..
Thermal Conductivity 0.500 - 0.700 W/m-K
3.47 - 4.86 BTU-in/hr-ft²-°F
ASTM E1461
Raschig Group 3536 Epoxy
Glass-fiber reinforced epoxy molding compound. Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures. This product meets the allowed..
Thermal Conductivity 0.500 - 0.600 W/m-K
3.47 - 4.16 BTU-in/hr-ft²-°F
DIN 52 612
Raschig Group MELOPLAS® 181 MF
Cellulose-reinforced, phenol-modified MF molding compound (MPF) in white and colored shades. High surface hardness, good electrical properties, good mechanical strength, high UV and heat resistanc..
Thermal Conductivity 0.500 W/m-K
3.47 BTU-in/hr-ft²-°F
Resinlab® EP1295 Black Medium Viscosity, Halogen Free, Flame Retardant Epoxy Casting Resin
Resinlab™ EP1295 Black is a medium viscosity, halogen free, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (..
Thermal Conductivity 0.500 W/m-K
3.47 BTU-in/hr-ft²-°F
Resinlab® EP1340 Medium Viscosity, Flame Retardant Epoxy Casting Resin System
Resinlab™ EP1340 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034) for U..
Thermal Conductivity 0.500 W/m-K
3.47 BTU-in/hr-ft²-°F
Resinlab® EP1390 Medium Viscosity, Self Extinguishing Flame Retardant Epoxy Casting Resin System
Resinlab™ EP1390 is a RoHS compliant, medium viscosity, self extinguishing flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Labor..
Thermal Conductivity 0.500 - 0.700 W/m-K
3.47 - 4.86 BTU-in/hr-ft²-°F
ASTM E1461
Raschig Group 3572 Epoxy
Glass-fiber reinforced epoxy molding compound. Good mechanical strength and electrical strength, enhanced elasticity for ensuring good sealing under extreme heat and/or humidity, good chemical resis..
Thermal Conductivity 0.500 - 0.580 W/m-K

@Temperature 100 - 100 °C
3.47 - 4.03 BTU-in/hr-ft²-°F

@Temperature 212 - 212 °F
Average value: 0.540 W/m-K Grade Count:3
Overview of materials for Phenolic, Novolac, Glass Filled
This property data is a summary of similar materials in the MatWeb database for the category "Phenolic, Novolac, Glass Filled". Each property range of values reported is minimum and maximum values o..
Thermal Conductivity 0.500 W/m-K
3.47 BTU-in/hr-ft²-°F
HOT-DISK || 60x60x3 mm
Lehmann & Voss LUVOCOM® 1106-7843 Polyether imide, with glass fiber, PTFE, lubricant modified, easy flowing
Applications: Improved friction and wear behaviour. Emergency running property.Strong, stiff parts.Dynamic stressed parts at high movement velocity.Information provided by Lehmann & Voss & Co.KG
Thermal Conductivity 0.500 W/m-K
3.47 BTU-in/hr-ft²-°F
DIN 52612
Lehmann & Voss LUVOCOM® 3/CF/30 Polyamide 6, with carbon fiber
Applications: Automotive industry, textile machinery, apparatus- and precision engineering.High-strength and stiff parts; low coefficient of expansion.dynamic stressElectrically conductive, suitable..
Thermal Conductivity 0.500 W/m-K
3.47 BTU-in/hr-ft²-°F
DIN 52612
Lehmann & Voss LUVOCOM® 3/CF/30/EG Polyamide 6, with carbon fiber, extrusion grade
Applications: Automotive industry, textile machinery, apparatus- and precision engineering.High-strength and stiff parts; low coefficient of expansion.dynamic stressElectrically conductive, suitable..
Thermal Conductivity 0.500 W/m-K
3.47 BTU-in/hr-ft²-°F
DIN 52612
Lehmann & Voss LUVOCOM® 6/CF/30 Polyamide 12, with carbon fiber
Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.Strong, stiff parts.Especially suitable at dynamic stress situations.Electrically conductive, s..
Thermal Conductivity 0.500 W/m-K
3.47 BTU-in/hr-ft²-°F
DIN 52612
Lehmann & Voss LUVOCOM® 8-7190 High impact polyamide, with carbon fiber, toughness-modified
Applications: Automotive industry, textile- and office machinery, apparatus- and precision engineering.High-strength and high-stiff parts; low coefficient of expansion.Especially suitable at dynamic..
Thermal Conductivity 0.500 - 7.00 W/m-K
3.47 - 48.6 BTU-in/hr-ft²-°F
Goodfellow Potassium Aluminosilicate (Muscovite Mica)
Mica is a naturally occurring mineral and as such its exact composition varies between grades, as will its properties. Ruby Mica is the highest grade of Muscovite Mica. The name comes from the Latin..
Thermal Conductivity 0.500 W/m-K

@Temperature 121 °C
3.47 BTU-in/hr-ft²-°F

@Temperature 250 °F
Tra-Con Tra-Bond 77-1S One Component SMD Adhesive
TRA-BOND 77-1S one component, solvent-free, insulating epoxy adhesive is designed specifically for attaching surface mounted devices (SMDs) to printed circuit boards prior to wave solder. TRA-BOND 7..
Thermal Conductivity 0.500 W/m-K

@Temperature 121 °C
3.47 BTU-in/hr-ft²-°F

@Temperature 250 °F
Tra-Con Tra-Bond 77-2LTC Low Temperature Cure SMD Adhesive
TRA-BOND 77-2LTC one component, solvent-free, insulative epoxy adhesive is designed to cure at temperatures as low as 80°C. This adhesive is specifically designed for attaching surface mounted devi..
Thermal Conductivity 0.500 W/m-K
3.47 BTU-in/hr-ft²-°F
Tra-Con Tra-Cast 3103 General Purpose Epoxy Casting Compound
TRA-CAST 3103 is a low viscosity two-part formulation recommended for general purpose electrical potting and encapsulating application where the combination of good mechanical thermal and electrical..
Thermal Conductivity 0.500 W/m-K

@Temperature 100 °C
3.47 BTU-in/hr-ft²-°F

@Temperature 212 °F
ASTM E1461
Plenco 4309 Phenolic, Nodular, Injection Molded
PLENCO 04309 is a heat resistant, glass reinforced phenolic molding compound offering improved mechanical strength and electrical strength properties. UL recognized under component file E40654. 0430..
Thermal Conductivity 0.500 W/m-K

@Temperature 100 °C
3.47 BTU-in/hr-ft²-°F

@Temperature 212 °F
ASTM E1461
Plenco 4311 Phenolic, Granular, Compression Molded
PLENCO 04311 is a heat resistant, mineral filled phenolic molding compound offering excellent processability, mechanical strength, and improved cold powder pourability characteristics. UL recognized..
Thermal Conductivity 0.500 W/m-K
3.47 BTU-in/hr-ft²-°F
MIL STD 883D
CoorsTek Epoxy Seal 216 (ES-216) B-staged epoxy lids
ES-216 is available for applications where high strength and moisture resistance are required. It displays fillet formation characteristics and, after cure, is highly temperature and moisture resist..
Thermal Conductivity 0.500 W/m-K
3.47 BTU-in/hr-ft²-°F
through plane; ASTM E1461
DSM Stanyl® TC154 PA46 FR(17)
Thermal conductive material, Flame Retardant, Heat Stabilized
Thermal Conductivity 0.500 W/m-K
3.47 BTU-in/hr-ft²-°F
ASTM E1461
Arlon AD300C Commercial Microwave and RF Laminate Material
Excellent Thermal Coefficient of Dielectric Constant (TCEr = -25 ppm/°C)Excellent PIM performanceHigh Thermal Conductivity ideal for Higher Power DesignsReduced Coefficient of Thermal Expansion in ..
Thermal Conductivity 0.500 W/m-K
3.47 BTU-in/hr-ft²-°F
ASTM C177
Solvay Specialty Polymers Ixef® 2010/X914 Polyarylamide, 40% Filler, DAM  (discontinued **)
The IXEF compounds are a family of semi-crystalline polyarylamide thermoplastics reinforced with glass fibers and/or mineral fillers for injection molding.Data provided by the manufacturer, Solvay A..
Thermal Conductivity 0.500 W/m-K
3.47 BTU-in/hr-ft²-°F
Resinlab® EP1190 Flame Retardant Epoxy Casting Resin
Resinlab™ EP1190 is a medium viscosity, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (File# E186034, Proje..
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