Polymer Property : Processing Temperature = 193 °C Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Processing Temperature	170 - 193 °C	338 - 379 °F	Average value: 180 °C Grade Count:7
Overview of materials for Epoxy, Molded, Mineral Filled This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Molded, Mineral Filled". Each property range of values reported is minimum and maximum values of ..
Processing Temperature	150 - 193 °C	302 - 379 °F	Average value: 166 °C Grade Count:5
Overview of materials for Epoxy, Encapsulating, Glass or Mineral Filled This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Encapsulating, Glass or Mineral Filled". Each property range of values reported is minimum and ma..
Processing Temperature	171 - 193 °C	340 - 379 °F	Molding temperature
Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound for the encapsulation of semiconductor devices and fiber optics. Excellent moldability (good release, ..
Processing Temperature	171 - 193 °C	340 - 379 °F	Molding temperature
Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A flame retardant, novolac-hardened epoxy molding compound recommended for semiconductor packages that are not stress sensitive.
Processing Temperature	171 - 193 °C	340 - 379 °F	Molding temperature
Cookson Group Plaskon® 3100LS Mineral Filled Conventional Encapsulant (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A semiconductor grade encapsulant suitable for a wide range of applications ranging from small SOICs to moderate lead count DIPs...
Processing Temperature	171 - 193 °C	340 - 379 °F	Molding temperature
Cookson Group Plaskon® 3200LS Mineral Filled Novolac Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Exhibits exceptional reliability under very stringent testing. This material is designed to minimize stress on the encapsulated ..
Processing Temperature	80.0 - 193 °C	176 - 379 °F	Average value: 134 °C Grade Count:4
Overview of materials for Acrylic, Cast This property data is a summary of similar materials in the MatWeb database for the category "Acrylic, Cast". Each property range of values reported is minimum and maximum values of appropriate MatW..
Processing Temperature	135 - 193 °C	275 - 379 °F	Average value: 172 °C Grade Count:18
Overview of materials for Epoxy Molding Compound This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Molding Compound". Each property range of values reported is minimum and maximum values of appropr..
Processing Temperature	171 - 193 °C	340 - 379 °F	Molding temperature
Cookson Group Plaskon® 3300S Mineral Filled Novolac Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, flame retardant, novolac hardened epoxy molding compound designed to provide hermeticity protection exceeding that ..