Processing Properties | Metric | English | Comments |
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Pot Life | 300 min | 300 min | |
Parker Chomerics CHO-SHIELD® 4966 Conductive Silicone Coating Conductive Silicone Coating. This is a conductive silver-filled silicone coating. This three-component system is capable of providing 60 dB of shielding effectiveness above 30 MHz. The coating utili.. |
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Pot Life | 300 min @Temperature 23.0 °C |
300 min @Temperature 73.4 °F |
2X Starting Viscosity |
Parker Chomerics THERM-A-FORM T647 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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Pot Life | >= 300 min | >= 300 min | |
Resin Technology Group DPE080697-1 Two component Potting Compound Resin Technology Group DPE080697-1 Two component Potting CompoundClear, 2 part, UV/Heat/Room temperature cure epoxy potting compound. |
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Pot Life | >= 300 min | >= 300 min | |
Resin Technology Group DPE080697-1 Two component Potting Compound Resin Technology Group DPE080697-1 Two component Potting CompoundClear, 2 part, UV/Heat/Room temperature cure epoxy potting compound. |
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Pot Life | >= 300 min | >= 300 min | |
Abatron 2230 A/B Filled Potting Compound
(discontinued **) Universal casting, potting, and encapsulating for magnets and electric black and colors. 4/1 variable ratio.Information provided by Abatron. |
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Pot Life | 300 min @Temperature 23.0 °C |
300 min @Temperature 73.4 °F |
2X Starting Viscosity |
Parker Chomerics THERM-A-FORM T646 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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Pot Life | 300 min | 300 min | |
Henkel Hysol EA 9380.05 Paste Adhesive System High degree of cure after a low temperature cure time that offers strength, toughness and high temperature resistance of heat curing film adhesives with greater flexibility and ease of use. Can be a.. |
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Pot Life | 300 min | 300 min | |
Tra-Con Tra-Bond F211 General Purpose Fiber Optic Epoxy Adhesive TRA-BOND F211 is a general purpose fiber optic epoxy adhesive recommended for bonding and small volume potting applications where superior wetting and physical properties are needed at both high and.. |
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Pot Life | 300 min | 300 min | |
Tra-Con Tra-Bond FS443 Color Keyed Thixotropic Epoxy Adhesive TRA-BOND FS443 is a fast cure, high viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating s.. |
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Pot Life | 300 min | 300 min | 25 grams |
Tra-Con Tra-Duct 2960 Snap Cure Electrically Conductive Silver-Filled Epoxy TRA-DUCT 2960 is a one or two-part, specially refined and processed silver filled adhesive for high speed manufacturing. Recommended for the microelectronic, automotive computer and telecommunicatio.. |
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Pot Life | 300 min | 300 min | |
Tra-Con Tra-Bond 2211 High Temperature Epoxy Adhesive TRA-BOND 2211 is a low viscosity epoxy adhesive system recommended for industrial bonding applications where superior wetting and good mechanical and electrical insulation performance features are r.. |
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Pot Life | 300 min | 300 min | |
Epoxy Technology EPO-TEK® OE121 Black Epoxy Adhesive Material Description: A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. .. |
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Pot Life | 300 - 360 min | 300 - 360 min | |
Abatron AboCast 8502-5/AboCure 8502-5 Colorless, Low-Exotherm Epoxy Casting Compound AboCast 8502-5/AboCure 8502-5 is a rigid, colorless, low-exotherm epoxy casting compound for spherical masses up to 500 grams. It is a 2-component structural and dielectric liquid system with extrem.. |
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Pot Life | 300 - 480 min @Temperature 25.0 °C |
300 - 480 min @Temperature 77.0 °F |
1-2 lbs |
Abatron AboCast/AboCure 4-4/50-17 Casting Epoxy for Tooling Standard casting compound for molds or patterns of any size, that can be machined with common metal working tools, engraving and reproduction molds.Main Advantages: Easy ratiosLongest pot lifeLarges.. |
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Pot Life | 300 - 480 min | 300 - 480 min | |
Abatron BronzeWeld-PH™ Bronze-Filled, Structural Adhesive Putty; High Temperature Paste BronzeWeld-PH™ is BronzeWeld-P™ for up to 320° F (160° C) under stress. Used when it must resist up to 320° F in operation. Superior resistance to strong solvents and other chemicals. Technical.. |
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Pot Life | 300 - 480 min | 300 - 480 min | |
Abatron Ferrobond-LH™ Steel-Filled, Structural Adhesive Putty; High Temperature Liquid Ferrobond-LH™ is Ferrobond-L™ for up to 320° F (160° C) under stress; Superior resistance to strong solvents and other chemicals. Technical Characteristics: A: 23 lbs/gal; B: 9.8 lbs/gal; mixin.. |
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Pot Life | 300 - 480 min | 300 - 480 min | |
Abatron Ferrobond-PH™ Steel-Filled, Structural Adhesive Putty; High Temperature Paste Ferrobond-PH™ is Ferrobond-P™ for up to 320° F (160° C) under stress. Superior resistance to strong solvents and other chemicals. For resistance up to 160° C in operation. Technical Characteris.. |
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Pot Life | 300 - 480 min | 300 - 480 min | |
Abatron Metalfix-PH™ Aluminum-Filled, Structural Adhesive Putty; High Temperature Paste Metalfix-PH™ is MetalFix-P™ for up to 320° F (160° C) under stress. Used when it must resist up to 320° F in operation. Superior resistance to strong solvents and other chemicals. Technical Cha.. |
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Pot Life | 300 min | 300 min | 100 g |
Abatron AboCast 7802-1/AboCure 50-3 (40 pbw) Epoxy AboCast 7802-1 is a clear resin with low viscosity (600-800 cps.) and a weight of 9.1 lbs/gallon. AboCure 50-3 is a clear, slow converter for lower rigidity. It has an HDT of 60°C, variable ratio, .. |
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Pot Life | 300 - 480 min | 300 - 480 min | |
Abatron Metalfix-LH™ Aluminum-Filled, Structural Adhesive Putty; High Temperature Liquid Metalfix-LH™ is MetalFix-L™ for up to 320° F (160° C) under stress. Superior resistance to strong solvents and other chemicals. Technical Characteristics: A: 14.8 lbs/gal; B: 9.8 lbs/gal; mixin.. |
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Pot Life | 300 - 480 min | 300 - 480 min | |
Abatron SS-Bond-PH™ Stainless-Steel-Filled, Structural Adhesive Putty; High Temperature Paste SS-Bond-PH™ is SS-Bond-P™ for up to 320° F (160° C) under stress. Superior resistance to strong solvents and other chemicals. Technical Characteristics: A: 26 lbs/gal; B: 9.8 lbs/gal; mixing ra.. |
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Pot Life | >= 300 min | >= 300 min | |
Epoxyset Epoxibond EB-177 Unfilled Epoxy Adhesive A two-component, unfilled, high temperature epoxy adhesive used for bonding and small potting applications in the medical, electronics, and aerospace industries.Information provided by Epoxyset Inc... |