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Polymer Property : Gel Time = 5.00 min Product List

Processing Properties

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Processing Properties Metric English Comments
Gel Time 5.00 min

@Temperature 135 °C
5.00 min

@Temperature 275 °F
Hot Plate
Lord Adhesives Thermosetâ„¢ MD-130 Electrically Insulating Die-Attach Adhesive
Lord MD-130 is a microelectronic grade, die-attach adhesive system for use in applications where electrical conductivity is not required. This system offers long, room temperature stability, fast cu..
Gel Time 5.00 min

@Temperature 135 °C
5.00 min

@Temperature 275 °F
3.39% Gel content
Lushan Solar EVA Film Lamination, Ultra Fast Cure
EVA film for encapsulating solar module Lushan series with ultra fast cure characteristic is used as encapsulate materials for photovoltaic industry. With Innovative technology, Lushan ultra fast cu..
Gel Time 5.00 min

@Temperature 138 °C
5.00 min

@Temperature 280 °F
46.51% Gel content
Lushan Solar EVA Film Lamination, Ultra Fast Cure
EVA film for encapsulating solar module Lushan series with ultra fast cure characteristic is used as encapsulate materials for photovoltaic industry. With Innovative technology, Lushan ultra fast cu..
Gel Time 5.00 min

@Temperature 140 °C
5.00 min

@Temperature 284 °F
53.77% Gel content
Lushan Solar EVA Film Lamination, Ultra Fast Cure
EVA film for encapsulating solar module Lushan series with ultra fast cure characteristic is used as encapsulate materials for photovoltaic industry. With Innovative technology, Lushan ultra fast cu..
Gel Time 5.00 min

@Temperature 143 °C
5.00 min

@Temperature 289 °F
71.9% Gel content
Lushan Solar EVA Film Lamination, Ultra Fast Cure
EVA film for encapsulating solar module Lushan series with ultra fast cure characteristic is used as encapsulate materials for photovoltaic industry. With Innovative technology, Lushan ultra fast cu..
Gel Time 5.00 min

@Temperature 145 °C
5.00 min

@Temperature 293 °F
70.85% Gel content
Lushan Solar EVA Film Lamination, Ultra Fast Cure
EVA film for encapsulating solar module Lushan series with ultra fast cure characteristic is used as encapsulate materials for photovoltaic industry. With Innovative technology, Lushan ultra fast cu..
Gel Time 5.00 min

@Temperature 148 °C
5.00 min

@Temperature 298 °F
81.33% Gel content
Lushan Solar EVA Film Lamination, Ultra Fast Cure
EVA film for encapsulating solar module Lushan series with ultra fast cure characteristic is used as encapsulate materials for photovoltaic industry. With Innovative technology, Lushan ultra fast cu..
Gel Time 5.00 min

@Temperature 150 °C
5.00 min

@Temperature 302 °F
84.59% Gel content
Lushan Solar EVA Film Lamination, Ultra Fast Cure
EVA film for encapsulating solar module Lushan series with ultra fast cure characteristic is used as encapsulate materials for photovoltaic industry. With Innovative technology, Lushan ultra fast cu..
Gel Time 5.00 min

@Temperature 153 °C
5.00 min

@Temperature 307 °F
85.91% Gel content
Lushan Solar EVA Film Lamination, Ultra Fast Cure
EVA film for encapsulating solar module Lushan series with ultra fast cure characteristic is used as encapsulate materials for photovoltaic industry. With Innovative technology, Lushan ultra fast cu..
Gel Time 5.00 min

@Temperature 155 °C
5.00 min

@Temperature 311 °F
88.68% Gel content
Lushan Solar EVA Film Lamination, Ultra Fast Cure
EVA film for encapsulating solar module Lushan series with ultra fast cure characteristic is used as encapsulate materials for photovoltaic industry. With Innovative technology, Lushan ultra fast cu..
Gel Time 5.00 min

@Temperature 240 °C
5.00 min

@Temperature 464 °F
Hexcel® HexFlow® RTM 6 180°C Epoxy System for Resin Transfer Molding Monocomponent System
HexFlow® RTM 6 is a monocomponent resin already degassed, specifically developed to fulfill the requirements of the aerospace and space industries in advanced resin transfer moulding (RTM) process...
Gel Time 5.00 min

@Temperature 200 °C
5.00 min

@Temperature 392 °F
Hexcel® HexFlow® RTM651 One-part Modified BMI Resin
HexFlow® RTM651 is a one-component modified bismaleimide for resin transfer molding (RTM). Upon heating to 212-248°F, the resin will become a low viscosity homogeneous liquid that has a long pot-l..
Gel Time 5.00 min

@Temperature 137.8 °C
5.00 min

@Temperature 280.0 °F
Zyvex Performance Materials Arovex™ 250 Carbon Nanotube Strengthened Prepreg
Arovex® 250 Prepreg is a 180°F (82°C) to 280°F (138°C) curing carbon nanotube strengthened epoxy prepreg suitable for numerous composites applications. Normal curing takes place at 250°F (121°..
Gel Time 5.00 min

@Temperature 137.8 °C
5.00 min

@Temperature 280.0 °F
Zyvex Performance Materials Arovex™ HT 250 Nano-Engineered Composite Prepreg System
Arovex® HT 250 Prepreg is a 180°F (82°C) to 280°F (138°C) curing carbon nanotube strengthened epoxy prepreg suitable for numerous composites applications. Normal curing takes place at 250°F (1..
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