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Polymer Property : Cure Time = 0.500 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 65.0 °C |
0.500 hour @Temperature 149 °F |
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| Resin Technology Group TIGA 202-EX High Performance, Fast Cure Adhesive Mix ratio 2 to 1 by volume.TIGA 202-EX is a two-part epoxy adhesive offering outstanding shear tensile and peel adhesion. TIGA 202-EX offers a 20 minute pot life and good hardness development within.. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond HH040 Anaerobic Retainer Permabond® HH040 is a single component liquid that cures only when in contact with metal parts and oxygen is excluded. The liquid adhesive fills the “air space” between parts and upon cure unitiz.. |
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| Cure Time | 30.0 min @Temperature 250 °C |
0.500 hour @Temperature 482 °F |
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| Resin Technology Group TIGA 901 Room Temperature Curing Silver Conductive Epoxy 100 parts resin to 6 parts hardener. Cure 24 hours at 25°C, 1-4 hours at 65°C, 30-60 minutes at 125°C, or 30 minutes at 150°C.TIGA 901 is an electrically conductive, silver filled epoxy adhesiv.. |
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| Cure Time | 30.0 min @Temperature 100 °C |
0.500 hour @Temperature 212 °F |
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| Resin Technology Group UV MX-2240 Multi-Functional Hybrid, UV-Curing, Micro-Electronic System Mix ratio 2 to 1 by volume.UV-MX 2240 is a low-viscosity, water-white photo/ chemical cross-linking encapsulant/sealant designed for micro-electronic applications. This two-part, Hybrid UV-epoxy bas.. |
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| Cure Time | 30.0 min @Temperature 130 °C |
0.500 hour @Temperature 266 °F |
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| Lord Adhesives Thermosetâ„¢ MD-110 Conductive Adhesive LORD Thermosetâ„¢ MD-110 silver-filled conductive adhesive offers excellent electrical conductivity and room temperature stability. It is designed for use with automated dispensing, stamping and.. |
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| Cure Time | 30.0 min @Temperature 25.0 °C |
0.500 hour @Temperature 77.0 °F |
Initial |
| Lord Adhesives Thermoset™ UR-322 Two Component Urethane Potting Compound Lord UR-322 is a two component, room temperature curing urethane potting compound. The cured elastomer is soft, flexible and has a very low modulus at temperatures down to -80°C. Cured UR-322 als.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
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| Gwent Electronic Materials C2051014P10 Silver/Silver Chloride Paste Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 70/30. Applications in medical diagnostics, environmentalScreen Printing Equipment: semi-automatic, manualScreen Types: polye.. |
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| Cure Time | 30.0 min @Temperature 60.0 °C |
0.500 hour @Temperature 140 °F |
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| Gwent Electronic Materials C2080409D2 Silver/Silver Chloride Paste Silver/Silver Chloride Paste has a ratio of Silver to Silver Chloride of 85/15. The paste is in a ready to use form at a viscosity suitable for automatic or semi-automatic screen printing. The paste.. |
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| Cure Time | 30.0 min @Temperature 137.8 °C |
0.500 hour @Temperature 280.0 °F |
|
| Zyvex Performance Materials Arovex™ 250 Carbon Nanotube Strengthened Prepreg Arovex® 250 Prepreg is a 180°F (82°C) to 280°F (138°C) curing carbon nanotube strengthened epoxy prepreg suitable for numerous composites applications. Normal curing takes place at 250°F (121°.. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
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| Tra-Con Tra-Duct 921U02 Long Pot Life Silver-Filled Epoxy TRA-DUCT 921U02 long room temperature pot life, silver-filled epoxy. Information provided by Tra-Con Inc. |
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| Cure Time | 30.0 min @Temperature 100 °C |
0.500 hour @Temperature 212 °F |
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| Trelleborg Emerson & Cuming Eccobond® 64C Two-Component Nickel Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 64C Eccobond® Two-Component Nickel Filled Electrically Conductive Epoxy AdhesiveTwo component, nickel filled, electrically conductive epoxy adhesive. Room temperature cure. Good ba.. |
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| Cure Time | 30.0 min @Temperature 120 °C |
0.500 hour @Temperature 248 °F |
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| Trelleborg Emerson & Cuming Eccobond® A316-48 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming A316-48 Eccobond® One-Component Fast Cure Epoxy AdhesivePourable, fast heat curing, epoxy adhesive and insulation compound. Excellent chemical and heat resistance. Cure Type: Heat .. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® 330 Low Viscosity, Optical Epoxy Product Description: EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications.Advan.. |
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| Cure Time | 30.0 min @Temperature 80.0 °C |
0.500 hour @Temperature 176 °F |
minimum |
| Epoxy Technology EPO-TEK® OE100-T High Temperature Epoxy Material Description: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy ca.. |
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| Cure Time | 30.0 min @Temperature 25.0 °C |
0.500 hour @Temperature 77.0 °F |
Light Load |
| Chesterton ARC MX5 Rapid Curing Fine Particle Wear Compound Description: An advanced ceramic reinforced composite for the emergency repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a th.. |
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| Cure Time | 30.0 - 180 min @Temperature 50.0 - 100 °C |
0.500 - 3.00 hour @Temperature 122 - 212 °F |
Optional |
| Abatron AboCoat 8709-2 A/B Carbon-Filled Electrically Conductive Epoxy Compound AboCoat 8709-2 A/B is a high-solid carbon-epoxy coating with various conductivity ranges widely used in silk-screening. |
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| Cure Time | 30.0 min @Temperature 204 °C |
0.500 hour @Temperature 400 °F |
Ramp to Temp; then hold for 4 hours, Recommended Postcure Cycle |
| Arlon 55531R060 0.061" (1.55 mm) Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured Silicone RubberSide 2: Uncured Silicone Rubber Appearance: Red silicone gum on fiberglass clothThis data Represents typical values for the production material. Th.. |
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| Cure Time | 30.0 min @Temperature 149 °C |
0.500 hour @Temperature 300 °F |
|
| 3M Scotchcast™ 260 Electrical Epoxy Powder Resin 3M Scotchcast Electrical Resin 260 is a widely used, well-known general purpose epoxy powder resin. A one-part, green pigmented, rapid heat-curing product, it is designed to provide a continuous, to.. |
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| Cure Time | 30.0 min @Temperature 175 °C |
0.500 hour @Temperature 347 °F |
|
| Atom Adhesives AA-DUCT 904 Epoxy Adhesive AA-DUCT 904 is a single component, heat curing, conductive epoxy that was designed for ease in handling. This high performance conductive epoxy cures quickly at elevated temperatures making it ideal.. |
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| Cure Time | 30.0 min @Temperature 177 °C |
0.500 hour @Temperature 350 °F |
Recommended Cure Cycle |
| Arlon 55191R060 0.060" (1.52 mm) Uncured Silicone Rubber with Fiberglass Substrate Design/Construction:Side 1: Uncured Silicone RubberSide 2: Uncured Silicone Rubber This data Represents typical values for the production material. The data should not be used to write, or in place .. |
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| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
Tack Free Time |
| Parker Chomerics CHO-FORM 5541 Conductive Form-In-Place Gaskets Description: A range of conductive particle technologies combined with thermoset and RTV silicone systems provide a material selection for most opportunities. Multiple filler grades balance material.. |
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| Cure Time | 30.0 min @Temperature 100 °C |
0.500 hour @Temperature 212 °F |
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| Tra-Con Tra-Bond 970-1N1 General Purpose Epoxy Adhesive TRA-BOND 970-1N1 is a general purpose epoxy that exhibits sag resistance and excellent bond strength to a wide variety of substrates. Information provided by Tra-Con Inc. |
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| Cure Time | 30.0 min @Temperature 23.0 °C |
0.500 hour @Temperature 73.4 °F |
Brass, working strength |
| Permabond A011 Anaerobic Threadlocker Permabond® A011 is an anaerobic adhesive designed for locking and sealing threaded or coaxially fitting metal parts where subsequent dismantling is required. Its controlled strength ensures fatigue.. |
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