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- Polymer Property : Cure Time = 240 min
Polymer Property : Cure Time = 240 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 120 - 240 min @Temperature 45.0 °C |
2.00 - 4.00 hour @Temperature 113 °F |
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| Resinlab® EP1285HD-16 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
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| NextGen Adhesives M907-11 Medical Grade Epoxy Adhesive Description: NGAC M907-11 is a medium viscosity adhesive system that is specifically formulated for medical device assembly applications.Advantages and Applications: Uses include laminating, bonding.. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
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| NextGen Adhesives P907-10 Optical Assembly Adhesive Description: NGAC P907-10 is a low viscosity and optically clear adhesive system that is specifically formulated for bonding and potting applications involving optical components and assemblies.Adva.. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
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| NextGen Adhesives P907-26 Optical Assembly Adhesive Description: NGAC P907-26 is a low viscosity and room temperature curing adhesive specifically formulated for optical applications where clarity is critical.Advantages and Applications: Uses include.. |
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| Cure Time | 180 - 240 min @Temperature 93.3 °C |
3.00 - 4.00 hour @Temperature 200 °F |
De-mold Time |
| Northstar Polymers MPP-A30A Polyether Prepolymer This room-temperature-curable polyether system is one of a family of polymer systems developed by Northstar Polymers for specific demanding work environments. Urethane elastomers molded with this s.. |
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| Cure Time | 120 - 240 min @Temperature 82.2 °C |
2.00 - 4.00 hour @Temperature 180 °F |
Complete Cure Cycle |
| Northstar Polymers MPP-D65A Polyether Base Polyurethane Resin MPP-D65A is a polyether base 2-component polyurethane resin casting system for molding and potting applications. It has a long pot-life and gradual curing pattern to provide easier handling for mol.. |
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| Cure Time | 180 - 240 min @Temperature 25.0 °C |
3.00 - 4.00 hour @Temperature 77.0 °F |
handling time |
| Permabond ET5401 Epoxy Resin PERMABOND® ET5401 is a two-part, 2:1 mixable, semi-flexible toughened no slump epoxy adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plastics and compo.. |
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| Cure Time | 180 - 240 min @Temperature 66.0 °C |
3.00 - 4.00 hour @Temperature 151 °F |
Full |
| Lord Adhesives Thermosetâ„¢ UR-329 Two Component Urethane Potting Compound Lord UR-329 is a flexible, two-component, room temperature curing, urethane, encapsulating compound. UR-329 maintains low hardness and modulus over a wide temperature range, which imparts minimal st.. |
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| Cure Time | 180 - 240 min @Temperature 65.6 °C |
3.00 - 4.00 hour @Temperature 150 °F |
|
| Master Bond EP21TDC-4 Two Component, Highly Flexible Epoxy System Master Bond Polymer System EP21TDC-4 is a two component, flexible epoxy resin system for high performance bonding, sealing and coating. It is formulated to cure at ambient temperatures or more quick.. |
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| Cure Time | 180 - 240 min @Temperature 121 - 149 °C |
3.00 - 4.00 hour @Temperature 250 - 300 °F |
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| Master Bond EP46HT-2Med Two Component Heat Resistant Biocompatible Epoxy System Master Bond Polymer System EP46HT-2MED is a two component medical grade epoxy system for high performance structural bonding and casting suitable for applications where resistance to temperatures fr.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 216L01 Clear Low Viscosity Epoxy Adhesive TRA-BOND 216L01 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flowability and wetting characteristics, and adheres strongly to g.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Duct 916H04 Room Temperature Cure, Conductive Silver Epoxy Adhesive TRA-DUCT 916H04 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical pr.. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 15 LV Clear Variable Hardness Low Viscosity Catalyst Emerson & Cuming 15 LV Clear Eccobond® Variable Hardness Low Viscosity CatalystLow viscosity. Easy-to-use, simple mix ratios. Hardness of cured castings can be controlled by the amount of hardener .. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 23 LV General Purpose Catalyst Emerson & Cuming 23 LV Eccobond® General Purpose CatalystExcellent low temperature performance properties, excellent thermal shock/cycle and impact resistance. Good hardener for cryogenic applicati.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 2105 Clear Rigid, Medium Viscosity Epoxy Adhesive TRA-BOND 2105 is a clear, medium viscosity epoxy adhesive which contains no solvents or other additives which can be harmful to the environment or to its users. It has excellent adhesion to glass, c.. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 2158 Heat Conductive Electrically Insulating Compound TRA-BOND 2158 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond 813J01 Silicone Encapsulant TRA-BOND 813J01 is a silicone adhesive system formulated to provide excellent thermal conductivity. This unique product bonds well to difficult substrates. Typical applications include encapsulation.. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
|
| Trelleborg Emerson & Cuming Eccobond® 15 Clear Variable Hardness Catalyst Emerson & Cuming 15 Clear Eccobond® Variable Hardness CatalystEasy-to-use, simple mix ratios. Hardness of cured castings can be controlled by the amount of hardener used. Long working life. Yields .. |
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| Cure Time | 60.0 - 240 min @Temperature 150 °C |
1.00 - 4.00 hour @Temperature 302 °F |
|
| Trelleborg Emerson & Cuming Eccobond® B 97 Heat Cure Catalyst Emerson & Cuming B 97 Eccobond® Heat Cure CatalystVery high temperature resistance, not as brittle as 17 M 1. Cures from 80°C to 200°C. Excellent chemical resistance. May also be used as an accel.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Atom Adhesives AA-BOND FDA2 Epoxy Adhesive AA-BOND FDA2 is a medium viscosity epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and recei.. |
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| Cure Time | 60.0 - 240 min @Temperature 160 - 180 °C |
1.00 - 4.00 hour @Temperature 320 - 356 °F |
optional |
| Abatron AboCast 8103-13 One-Component Epoxy AboCast 8103-13 is the low-viscosity one-component clear epoxy system with deep impregnation that offers high performance at relatively high temperatures. It is best for thin-wall casting. Suggested.. |
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| Cure Time | 60.0 - 240 min @Temperature 120 - 160 °C |
1.00 - 4.00 hour @Temperature 248 - 320 °F |
optional |
| Abatron AboCast 8103-20 High-Performance Dielectric Epoxy AboCast 8103-20 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system is unique .. |
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| Cure Time | 60.0 - 240 min @Temperature 160 - 180 °C |
1.00 - 4.00 hour @Temperature 320 - 356 °F |
optional |
| Abatron AboCast 8504-1 One-Component Epoxy AboCast 8504-1 is a clear, all-purpose one-component epoxy system, with an optimum balance of properties for most casting, adhesive, impregnation, and coating applications. |
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| Cure Time | 120 - 240 min @Temperature 65.0 °C |
2.00 - 4.00 hour @Temperature 149 °F |
|
| Atom Adhesives AA-SUPERTHERM 05 Epoxy Adhesive AA-SUPERTHERM 05 is a thixotropic (smooth paste) Pure Diamond ultra-high thermally conductive epoxy two-part adhesive that develops strong, durable, high-impact bonds at room temperature which impro.. |
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| Cure Time | 60.0 - 240 min @Temperature 120 - 160 °C |
1.00 - 4.00 hour @Temperature 248 - 320 °F |
optional |
| Abatron AboCast 8103-22 High-Performance Dielectric Epoxy AboCast 8103-22 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system is used in.. |
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