Polymer Property : Cure Time = 4.00 hour Product List

Processing Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Processing Properties	Metric	English	Comments
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
NextGen Adhesives G907-31 Epoxy Adhesive Description: NGAC G907-31 is a medium viscosity epoxy adhesive system utilized extensively in industrial and structural applications.Advantages and Applications: The NGAC G907-31 provides excellent ..
Cure Time	120 - 240 min @Temperature 43.3 °C	2.00 - 4.00 hour @Temperature 110 °F	De-mold Time
Northstar Polymers MPP-M09D "Slow Cure" Semi-Rigid Foam Formulation This foam polyurethane formulation is designed yield structural foam by either hand-mixing or machine casting method. The pot-life of this material is set longer than ordinary rigid foam formulatio..
Cure Time	120 - 240 min @Temperature 65.0 °C	2.00 - 4.00 hour @Temperature 149 °F
NextGen Adhesives EC907-34 Epoxy Adhesive Description: NGAC EC907-34 is a two part, electrically conductive silver filled epoxy adhesive which can be cured at room temperature. It was designed for applications requiring excellent mechanical..
Cure Time	180 - 240 min @Temperature 25.0 °C	3.00 - 4.00 hour @Temperature 77.0 °F	De-mold Time
Northstar Polymers MPP-A65A High Performance Polyether This high performance polyether system is one of a family of polymer systems developed by Northstar Polymers for specific demanding work environments. Urethane elastomers molded with this system ex..
Cure Time	180 - 240 min @Temperature 121 - 149 °C	3.00 - 4.00 hour @Temperature 250 - 300 °F
Master Bond EP45HTND-2 Chemically Resistant, Non-Drip Epoxy Description: Master Bond EP45HTND-2 is a two component epoxy system for high performance bonding, sealing and coating. It is used for applications requiring solid temperature resistance and capable ..
Cure Time	180 - 240 min @Temperature 121 - 149 °C	3.00 - 4.00 hour @Temperature 250 - 300 °F
Master Bond Ep46HT-2 Two Component, Heat Resistant Epoxy System Master Bond Polymer System EP46HT-2 is a two component epoxy system for bonding, sealing and casting applications where resistance to temperatures from -100°F to +500°F is required. It is 100% rea..
Cure Time	180 - 240 min @Temperature 65.6 °C	3.00 - 4.00 hour @Temperature 150 °F
Master Bond EP76M-1R Nickel Conductive Epoxy Adhesive Description: Master Bond Polymer System EP76M-1R is a two component, nickel filled, electrically conductive adhesive for high performance bonding formulated to cure at room temperature or more rapid..
Cure Time	120 - 240 min @Temperature 65.0 °C	2.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 216D02 Thixotropic No-Sag Epoxy Adhesive TRA-BOND 216D02 is a thixotropic, two part epoxy adhesive formulated specifically for applications where a nonsagging adhesive is required. TRA-BOND 216D02 works in concert with TRA-CAST 3135 to per..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 216L01 Clear Low Viscosity Epoxy Adhesive TRA-BOND 216L01 is a clear, low viscosity epoxy adhesive system that contains no solvents, cures at room temperature, has excellent flowability and wetting characteristics, and adheres strongly to g..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond FDA22 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond FDA23 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-23 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond FDA2T Food and Drug Application Epoxy Adhesive TRA-BOND FDA-2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and receive..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Cast F353 Optically Opaque Casting System TRA-CAST F353 is an optically opaque, low viscosity, two-part epoxy system recommended for molding, potting, embedding, encapsulating, sealing and casting applications involving fiber optic, optical..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Duct 916H04 Room Temperature Cure, Conductive Silver Epoxy Adhesive TRA-DUCT 916H04 is an electrically conducting silver-filled epoxy compound recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical pr..
Cure Time	180 - 240 min @Temperature 93.3 °C	3.00 - 4.00 hour @Temperature 200 °F
Master Bond EP34AO Epoxy Compound Withstands High Temperatures Description: Master Bond Polymer System EP34AO is a room temperature curing, two component epoxy compound for high temperature bonding and sealing applications especially where thermal conductivity ..
Cure Time	180 - 240 min @Temperature 65.6 - 93.3 °C	3.00 - 4.00 hour @Temperature 150 - 200 °F
Master Bond EP42HT-2FG Two Component Epoxy Adhesive for Food Applications Master Bond Polymer System EP42HT-2FG is a room temperature setting, two component epoxy adhesive, sealant and coating specially formulated for food applications. It has been independently tested an..
Cure Time	120 - 240 min @Temperature 65.0 °C	2.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 2158 Heat Conductive Electrically Insulating Compound TRA-BOND 2158 is a flexible, thermal conductive epoxy system. It is used for staking transistors, diodes, resistors, integrated circuits and other heat-sensitive components to printed circuit boards..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 516H03 Blush-Free Epoxy Adhesive TRA-BOND 516H03 is a modified version of F114 yielding a higher viscosity and lower coefficient of thermal expansion. Information provided by Tra-Con Inc.
Cure Time	120 - 240 min @Temperature 120 - 160 °C	2.00 - 4.00 hour @Temperature 248 - 320 °F	optional
Abatron AboCast 8103-26 High-Performance Dielectric Epoxy AboCast 8103-26 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h..
Cure Time	120 - 240 min @Temperature 120 - 160 °C	2.00 - 4.00 hour @Temperature 248 - 320 °F	optional
Abatron AboCast 8103-28 High-Performance Dielectric Epoxy AboCast 8103-28 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Atom Adhesives AA-BOND FDA2T Epoxy Adhesive AA-BOND FDA2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and received ..
Cure Time	60.0 - 240 min @Temperature 160 - 180 °C	1.00 - 4.00 hour @Temperature 320 - 356 °F	optional
Abatron AboCast 8103-14 One-Component Epoxy AboCast 8103-14 is the lowest-viscosity one-component epoxy system with heavy-duty structural and dielectric properties. It is clear and has maximum wetting and penetration. Suggested Uses: Casting..
Cure Time	60.0 - 240 min @Temperature 120 - 160 °C	1.00 - 4.00 hour @Temperature 248 - 320 °F	optional
Abatron AboCast 8103-23 High-Performance Dielectric Epoxy AboCast 8103-23 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has a comb..
Cure Time	120 - 240 min @Temperature 120 - 160 °C	2.00 - 4.00 hour @Temperature 248 - 320 °F	optional
Abatron AboCast 8103-30 High-Performance Dielectric Epoxy AboCast 8103-30 is a dielectric in/outdoor epoxy system with superior arc-track resistance, high voltage and heat resistance, low ash and ion content, and it is chlorine-free. This system has high h..
Cure Time	60.0 - 240 min @Temperature 65.0 °C	1.00 - 4.00 hour @Temperature 149 °F
Tra-Con Tra-Bond 516H01 Low Viscosity Room Temperature Cure Adhesive TRA-BOND 516H01 is a room temperature curing, low viscosity adhesive formulated for terminating ALL TYPES of fiber optic connectors, including Pre-Mixed and Frozen applications. It has also been use..
Cure Time	180 - 240 min @Temperature 25.0 °C	3.00 - 4.00 hour @Temperature 77.0 °F	Gel time
Chesterton 860 Moldable Polymer Gasketing Description: Chesterton® 860 Moldable Polymer Gasketing is a solid flexible gasketing material which fills in surface irregularities, stop leaks and never sticks to surfaces after curing. It is the..