Polymer Property : Cure Time = 4320 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP1215 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP1215 Clear is a two part unfilled epoxy structural adhesive designed for bonding applications requiring high strength and good impact resistance. It cures completely at room temperature..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
NextGen Adhesives G907-27 Structural Adhesive Description: NGAC G907-27 is a medium viscosity polyamide adhesive system utilized extensively in industrial and structural applications.Advantages and Applications: The NGAC G907-27 provides excell..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F	Complete Cure Cycle
Northstar Polymers MYP-V40A Polyurethane Filler Gel This polyurethane casting material is developed for applications that require inexpensive liquid resin filler such as encapsulation of a large electric components or puncture-free tire for low-speed..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP1294 Mineral Filled, Flame Retardant Epoxy Syntactic Foam Resinlab™ EP1294 is a two part mineral filled, flame retardant epoxy syntactic foam. It utilizes glass microspheres to reduce cured density and improve machinability. This product will be self-exti..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP750 Clear Unfilled Epoxy Structural Adhesive Resinlab™ EP750 Clear is a two part unfilled epoxy structural adhesive which ingredients are listed in the Code of Federal Regulations Title 21 175.105 (Adhesives) and 175.300 (Resinous and polymer..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21ANHT Two Component, Room Temperature Curing Epoxy Adhesive Product Description: Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that combines high thermal conductivity and electrical insulation ..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21AOLV-1 Two Part, Room Temperature Curing Epoxy System Product Description: Master Bond Polymer Adhesive EP21AOLV-1 is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant and coating. This versatile system will adhere t..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21NDLO Low Outgassing, Room Temperature Curing Two Component Epoxy Master Bond EP21ND-LO is a two component, room temperature curing epoxy system for bonding, sealing and coating featuring outstanding physical properties. EP21ND-LO has a convenient one to one mix r..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21SC-1 Two Component Epoxy Resin System Product Description: Master Bond Polymer System EP21SC-1 is a two component epoxy system featuring abrasion resistance. This high performance compound utilizes silicon carbide as a filler material a..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21TDCHT-LO Room Temperature Curing, Toughened Two Component Epoxy Master Bond Polymer Adhesive EP21TDCHT-LO is a two component epoxy adhesive formulated to cure at room temperature or more rapidly at elevated temperatures, with a very forgiving and convenient one ..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP33CLV Epoxy Resists Chemicals and High Temperatures Description: Master Bond EP33CLV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and excel..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP37-3FLFAN Electrically Isolating, Flexible Epoxy Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating that is formulated to cure at room temperature or more rapidl..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP42HT-2Med Epoxy Meets USP Class VI Requirements Description: Master Bond Polymer System EP42HT-2Med is a room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring high temperature resistance along wit..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP42HT-2ND-2Med Heat Resistant, Medical Grade Non-Drip Epoxy Master Bond Polymer System EP42HT-2ND2MED (Black) is a room temperature curable two component epoxy adhesive and sealant featuring high temperature resistance along with outstanding chemical resista..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond MasterSil 153Med Silicone Paste for Medical Applications Description: Master Bond MasterSil 153Med is a two component silicone compound with a paste consistency for high performance bonding and sealing. It can be used for medical device applications as it..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP21TPFL-1AO Two Part, Flexible, Lower Viscosity Epoxy Polysulfide System Product Description: Master Bond EP21TPFL-1AO is a two component, low viscosity epoxy polysulfide for high performance bonding, sealing, coating and casting offering thermal conductivity, electrical..
Cure Time	2880 - 4320 min @Temperature 23.0 °C	48.0 - 72.0 hour @Temperature 73.4 °F
Master Bond EP30M3LV Electrically Insulative, Low Viscosity Two Component Epoxy Master Bond Polymer System EP30M3LV is a lower viscosity, two component epoxy system for high performance bonding, sealing and encapsulation. It is formulated to cure at ambient temperatures or mor..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond EP33ND Epoxy Paste Resists Harsh Chemicals Description: Master Bond EP33ND is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond Supreme 33 High Temperature Resistant, Structural Adhesive Description: Master Bond Polymer System Supreme 33 is a unique, room temperature curing, toughened epoxy adhesive/sealant, offering high temperature resistance. This innovative system offers high bo..
Cure Time	2880 - 4320 min @Temperature 23.9 °C	48.0 - 72.0 hour @Temperature 75.0 °F
Master Bond Supreme 33CLV Two Component, Room Temperature Curing Toughened Epoxy Master Bond Polymer System Supreme 33CLV is a special, room temperature curing, toughened epoxy adhesive/sealant, featuring exceptionally high temperature resistance. This innovative system has outs..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP11HTFS Gray Filled Epoxy Adhesive Resinlab™ EP11HTFS Gray is a two part filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-rigid material. It has good wetting to most surfa..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP1296 Highly Filled, Moderately Thixotropic Black Casting Resin Resinlab™ EP1296 is a highly filled, moderately thixotropic black casting resin designed for applications requiring good thermal conductivity, low shrinkage and a low CTE. It was especially formula..
Cure Time	1440 - 4320 min @Temperature 25.0 °C	24.0 - 72.0 hour @Temperature 77.0 °F
Resinlab® EP1056LC Urethane Modified Epoxy Adhesive Resinlab™ EP1056LC is a two part urethane modified epoxy adhesive designed to give good adhesion to metals and hard to bond surfaces such as PVC. It is thixotropic to provide good gap filling abili..