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Polymer Property : Cure Time = 60.0 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 - 180 min @Temperature 23.0 °C |
1.00 - 3.00 hour @Temperature 73.4 °F |
M10 steel, working strength |
| Permabond HM163 Anaerobic Retainer Permabond® HM163 is a medium viscosity, thixotropic anaerobic retaining compound that cures when confined between metal parts to form a tough bond. It has been specifically formulated to provide a .. |
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| Cure Time | 60.0 min @Temperature 95.0 °C |
1.00 hour @Temperature 203 °F |
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| Parker Chomerics CHO-BOND 360-20 Conductive Epoxy Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E.. |
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| Cure Time | 60.0 min @Temperature 150 °C |
1.00 hour @Temperature 302 °F |
Post Cure |
| Shin-Etsu Silicones LIMSâ„¢ KE1950-10A/B Elastomer KE-1950-10 is a liquid injection molding silicone. It is supplied as two components which are mixed in a 1:1 ratio to ensure easy and accurate blending. It's viscosity is low enough to allow easy .. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond EP51FL-1 Rapid Curing Cryogenic Two Component Epoxy Master Bond Polymer System EP51FL-1 is a two component highly flexible epoxy resin system for high performance bonding sealing and coating. Although most flexiblilized epoxy formulations are very sl.. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond EP76M-F Electrically Conductive, Two Part Epoxy Description: Master Bond EP76M-F is a two component, nickel filled, electrically conductive epoxy system for high performance bonding, sealing, and coating formulated to cure at room temperature or .. |
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| Cure Time | 60.0 - 120 min @Temperature 93.3 °C |
1.00 - 2.00 hour @Temperature 200 °F |
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| Master Bond Supreme 11ANHT Fast Curing Epoxy Paste System Description: Master Bond Polymer System SUPREME 11ANHT is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevat.. |
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| Cure Time | 60.0 min @Temperature 93.0 °C |
1.00 hour @Temperature 199 °F |
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| Tra-Con Tra-Bond 724-14C Polyurethane Adhesive TRA-BOND 724-14C premixed and frozen, polyurethane adhesive is designed for good adhesion, providing strong, resilient bonds to a wide variety of substrates, including aluminum, solder, nylon, mylar.. |
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| Cure Time | 60.0 - 120 min @Temperature 65.0 °C |
1.00 - 2.00 hour @Temperature 149 °F |
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| Tra-Con Tra-Bond F110 Optically Transparent Low Viscosity Epoxy Adhesive TRA-BOND F110 is a rigid, optically clear adhesive with a very low viscosity. This room temperature curing system is an excellent choice for thin bond-line assembly and repair applications of prisms.. |
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| Cure Time | 60.0 min @Temperature 65.0 °C |
1.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond F118CLR Fiber Optic Epoxy Adhesive TRA-BOND F118CLR is an impact resistant, fiber-optic adhesive designed for use in any optical connector. This two-part epoxy remains at a constant viscosity for a minimum of 30 minutes. This allows .. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
|
| Tra-Con Tra-Bond FDA22 Food and Drug Application Epoxy Adhesive TRA-BOND FDA-22 is a high viscosity epoxy resin system specifically developed for bonding and coating applications in accordance with Title 21, U.S. Code of Federal Regulations, Food and Drug Admini.. |
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| Cure Time | 60.0 min @Temperature 65.0 °C |
1.00 hour @Temperature 149 °F |
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| Tra-Con Tra-Bond 2106T Fast Cure Thixotropic Epoxy Adhesive TRA-BOND 2106T is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. This versatile two-part epoxy system contai.. |
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| Cure Time | 60.0 min @Temperature 150 °C |
1.00 hour @Temperature 302 °F |
|
| Tra-Con Tra-Bond 968-5 High Dielectric Constant Epoxy Adhesive TRA-BOND 968-5 is a high dielectric constant epoxy adhesive. This one component, electrically insulating epoxy adhesive is designed for chip bonding.Information provided by Tra-Con Inc. |
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| Cure Time | 60.0 min @Temperature 75.0 °C |
1.00 hour @Temperature 167 °F |
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| Tra-Con Tra-Bond Ablebond 868-7U Thixotropic Epoxy Adhesive Ablebond 868-7UNF is the unfilled version of 868-7, a nonsagging, flexible epoxy adhesive. Information provided by Tra-Con Inc. |
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| Cure Time | 60.0 min @Temperature 125 °C |
1.00 hour @Temperature 257 °F |
|
| Tra-Con Tra-Duct 2924 Conductive Silver Epoxy Adhesive TRA-DUCT 2924 is a two part electrically conductive composition developed for low shrinkage, low resistivity bonding applications where good electrical and physical properties over a wide temperatur.. |
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| Cure Time | 60.0 min @Temperature 32.0 °C |
1.00 hour @Temperature 89.6 °F |
Tack Free |
| Chesterton ARC S2 Ceramic reinforced erosion resistant coating Description: An advanced ceramic composite for the resurfacing and protection of all metal surfaces. It is normally applied at a thickness of 250 microns (10 mils) per coat. Non-shrinking, 100% soli.. |
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| Cure Time | 60.0 min @Temperature 60.0 °C |
1.00 hour @Temperature 140 °F |
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| Cytec CE-1171 (Conap) Acrylic Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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| Cure Time | 60.0 - 120 min @Temperature 25.0 °C |
1.00 - 2.00 hour @Temperature 77.0 °F |
tack free |
| Cytec Conathane® CE-1175 (Conap) Polyurethane Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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| Cure Time | 60.0 min @Temperature 65.0 °C |
1.00 hour @Temperature 149 °F |
|
| Epoxy Technology EPO-TEK® 305 Spectrally Transparent Epoxy Product Description: EPO-TEK® 305 is a two component, semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, optoelectronics and medical devices. It is an electrically and th.. |
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| Cure Time | 60.0 min @Temperature 120 °C |
1.00 hour @Temperature 248 °F |
Minimum Bond Line |
| Epoxy Technology EPO-TEK® E4110-PFC Electrically Conductive Epoxy Product Description: EPO-TEK®E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotr.. |
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| Cure Time | 60.0 min @Temperature 25.0 °C |
1.00 hour @Temperature 77.0 °F |
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| Atom Adhesives AA-BOND 2156 Epoxy Adhesive AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compone.. |
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| Cure Time | 60.0 - 240 min @Temperature 65.0 °C |
1.00 - 4.00 hour @Temperature 149 °F |
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| Atom Adhesives AA-BOND FDA16 Epoxy Adhesive AA-BOND FDA16 is a medium viscosity epoxy resin system specifically developed for medical device applications. AA-BOND FDA16 has been tested in accordance with USP biological reactivity tests, in vi.. |
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| Cure Time | 60.0 min @Temperature 121 °C |
1.00 hour @Temperature 250 °F |
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| Parker Chomerics CHO-SHIELD® 596 A/B Silver-Epoxy Coating Silver-Epoxy Coating. This is a two-component, silver bearing, highly conductive epoxy paint designed to provide EMI shielding when applied to a dielectric substrate. It is also useful for coating f.. |
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| Cure Time | 60.0 min @Temperature 23.0 °C |
1.00 hour @Temperature 73.4 °F |
Zinc, working strength |
| Permabond HM135 Anaerobic Retainer Permabond® HM135 is a fast curing, medium viscosity anaerobic adhesive for locking and sealing threads and retaining cylindrical components. It gives maximum torque strength on brass or plated bras.. |
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| Cure Time | 60.0 min @Temperature 121 °C |
1.00 hour @Temperature 250 °F |
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| Henkel Hysol EA 9845 SF Composite Surfacing Film Epoxy-based composite surfacing film improves surface quality of honeycomb stiffened composite parts. Reduced weight vs conventional surfacing films. Cures at 250°F/121°C or 350°F/177°C with a v.. |
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| Cure Time | 60.0 min @Temperature 66.0 °C |
1.00 hour @Temperature 151 °F |
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| Henkel Hysol EA 9395 Paste Adhesive System Two-part, nonmetallic-filled version of Hysol EA 9394.Applications: Potting Structural Repair Composite Bonding |
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