- HOME
- POLYMER SEARCH
- Polymer Property : Mold Temperature = 190 °C
Polymer Property : Mold Temperature = 190 °C Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LARPEEK 10 K/40 40% Carbon Fiber Reinforced Polyetheretherketone (PEEK)
(Unverified Data**) Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ EP 8414 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
(dis Epoxy molding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical even at higher temperatures, very slight post shrinkage, increased media resistance, UL l.. |
|||
| Mold Temperature | 170 - 190 °C | 338 - 374 °F | Injection molding |
| Hexion Bakelite™ EP 8414 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
(dis Epoxy molding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical even at higher temperatures, very slight post shrinkage, increased media resistance, UL l.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 84 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets, High Mechanical Strength
& Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Contact support power switch, moldin.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures
(disconti Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application .. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 2400 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof, UL Listed
(disc Phenolic molding compound, inorganically/organically filled, average heat resistance, increased dimensional stability, dish washer proof, UL listed molding compound 1.5 mm/V-0 (ALL).Application area.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 2736 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage, UL Listed
&nbs Phenolic molding compound, inorganically/organically filled, increased tracking resistance, UL listed molding compound 0.46 mm/V-0 (BK, Suffix "H"), 0.81 mm/V-0 (NC, GN, BK), 1.5 mm/V-0 (ALL).Applic.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 2774 Phenolic Formaldehyde Resin, Dishwasher Proof, Improved Electrical Properties, Low Shrinkage, UL Listed Phenolic molding compound, inorganically filled, glass fiber reinforced, increased dimensional stability, averaged notched impact strength, average heat resistance, improved electrical properties, U.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 6506 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures, UL Listed
&nbs Phenolic molding compound, inorganically filled, glass fiber reinforced, high dimensional stability at raised temperature, good media resistance, heat-resistant, UL listed molding compound 1.5 mm/V-.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 6507 Phenolic Formaldehyde Resin, Elasticized, Low Shrinkage, Resistant to High Temperatures, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, elastomer modified, galvanizable, heat resistant, good media resistance, high dimensional stability at raised temperature, hi.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 7400 Phenolic Formaldehyde Resin, High Mechanical Strength
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fiber flakes, high notched impact strength.Application areas: Moldings for higher mechanical strain, e.g. power plugs high volta.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 7592 Phenolic Formaldehyde Resin, Galvanized, Conductive
(discontinued **) Phenolic molding compound, inorganically/organically filled. Shrinkage fies compatible to values of UP 3310 and PF 2560. Electroplateable.Application areas: Chromium plated oven strips.Information.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 12404 Phenolic Formaldehyde Resin, High Surface Quality, Low Shrinkage
(discontinued **)& Phenolic molding compound, inorganically/organically filled, good dimensional stability, low shrinkage.Application areas: Housing parts for gas meter.Information provided by Bak AGBak AG became a pa.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 14694 Phenolic Formaldehyde Resin, High Surface Quality
(discontinued **) Phenolic molding compound, mainly organically filled, very soft flow for large molds.Application areas: Housing parts, heat shields, cookware fittings.Information provided by Bak AGBak AG became a p.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ X24 Phenolic Formaldehyde Resin
(discontinued **) Phenolic molding compound, mainly organically filled.Application areas: Operating controls, housing parts, lamp holders.Information provided by Bak AGBak AG became a part of Hexion in 2005. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ X65 Phenolic Formaldehyde Resin, UL Listed
(discontinued **) Phenolic molding compound, inorganically/organically filled, good heat-resistance and dimensional stability, UL listed molding compound 3.0 mm/V-0 (BN, BK).Application areas: Oven strips.Information.. |
|||
| Mold Temperature | 150 - 190 °C | 302 - 374 °F | |
| LATI Latiohm 85-06 PD01 G/15 PES, 15% Glass Fiber Reinforced Semiconductive/dissipative product based on Polyether Sulfone (PES). Glass fibers.Availability: Africa & Middle East; Asia Pacific; Europe; Latin America; North AmericaInformation provided by Lati I.. |
|||
| Mold Temperature | 150 - 190 °C | 302 - 374 °F | Injection molding |
| BASF Ultrason® E 2010 C6 30% Carbon Filled Carbon fibers and Ultrason® two partners with good properties. The combination of carbon fibers with the amorphous high-temperature plastic Ultrason® guarantees mechanical properties for temperatu.. |
|||
| Mold Temperature | 150 - 190 °C | 302 - 374 °F | Injection molding |
| BASF Ultrason® KR 4113 PESU with 10/10% Carbon Fibers/Graphite and 10% PTFE Description: Compound based on PES with 30 % filler. The filler system, a mixture of carbon fibers, graphite and PTFE powder, considerably improves Ultrason’s tribological properties. In addition, .. |
|||
| Mold Temperature | 180 - 190 °C | 356 - 374 °F | |
| LATI LARPEEK 50 G/50 50% Glass Reinforced Polyetheretherketone (PEEK)
(discontinued **) Larpeek polyetheretherketone (PEEK) is a high performance thermoplastic offering cost effective performance in difficult environments across all industries. PEEK is temperature resistant (up to 250°.. |
|||
| Mold Temperature | 93.0 - 190 °C | 199 - 374 °F | Average value: 155 °C Grade Count:23 |
| Overview of materials for Polyethersulfone (PES), 20% Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyethersulfone (PES), 20% Glass Fiber Filled". Each property range of values reported is minimum and m.. |
|||
| Mold Temperature | 135 - 190 °C | 275 - 374 °F | Average value: 157 °C Grade Count:17 |
| Overview of materials for Polyethersulfone (PES), 30% Glass Fiber Filled This property data is a summary of similar materials in the MatWeb database for the category "Polyethersulfone (PES), 30% Glass Fiber Filled". Specific grades with glass content between 25% and 34% .. |
|||
| Mold Temperature | 143 - 190 °C | 289 - 374 °F | Average value: 172 °C Grade Count:9 |
| Overview of materials for Epoxy, Molded, Glass Fiber Filler This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Molded, Glass Fiber Filler". Each property range of values reported is minimum and maximum values.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 4010 Phenolic Formaldehyde Resin, Improved Electrical Properties, Low Shrinkage
(disconti Glass fiber reinforced and inorganically filled molding compound. High heat resistance, reduced molding shrinkage, good chemical resistance and mechanical properties.Application areas: Switch housi.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 7595 Phenolic Formaldehyde Resin, Low Coefficient of Friction, Galvanized, Conductive
(di Phenolic molding compound, inorganically/organically filled, modified with graphite, good heat conductivity, good sliding properties, conductive in electrical properties.Application areas: Bearers f.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 8052 Phenolic Formaldehyde Resin, Resistant to High Temperatures
(discontinued **) Phenolic molding compound, glass fiber reinforced and inorganically filled. Excellent heat resistance with respect to surface finish and mechanical properties.Application areas: Pan handles, heat r.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Injection molding |
| Hexion Bakelite™ PF 83 Phenolic Formaldehyde Resin, Special Preparation Cylindrical Pellets
(discontinued **) Phenolic molding compound, organically filled, reinforced with cotton fibers, increased notched impact strength, standardized molding compound.Application areas: Switch covers, rolls, handle casings.. |
|||
| Mold Temperature | 160 - 190 °C | 320 - 374 °F | Compression molding |
| Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte.. |
|||
Copyright © lookpolymers.com All Rights Reserved