Polymer Property : Back Pressure = 290 psi Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PP HBK15030 Polypropylene, Multifiller High Gloss Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PP HIP16020FCF Polypropylene, Fast Cycle Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC T16020 Polypropylene Copolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH TS15020 D Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPHC GF3020 PB7 Polypropylene, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH BF4075 VT1 Polypropylene Homopolymer, Reinforced, Heat Resistant Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH BK901213 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF4030 PD2 Polypropylene Homopolymer, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF5010 VT2 Polypropylene Homopolymer, Glass Fibre-Reinforced, Heat Resistant Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH GF5030 PD2 Polypropylene Homopolymer, Glass Fibre-Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH K20020 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH S4030 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH T20020 UV Polypropylene Homopolymer, Mineral Reinforced, UV-Stabilized Information provided by Polykemi AB
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 1107 Phenolic Formaldehyde Resin, Low Shrinkage, Resistant to High Temperatures (disconti Phenolic molding compound, inorganically filled, glass fiber reinforced, high heat resistance, low heat expansion coefficient, highest resistance to pressure, high dimensional stability.Application ..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 1141 Phenolic Formaldehyde Resin, High Surface Quality, Resistant to High Temperatures, Dishwasher Proof Phenolic molding compound, inorganically/organically filled, glass fiber reinforced, increased heat resistance, hot steam and hot water resistant (not suitable for use of higher voltage).Application..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 2535 Phenolic Formaldehyde Resin, High Surface Quality, Dishwasher Proof (discontinued ** Phenolic molding compound, inorganically/organically filled, average heat resistant, steam resistant, dish washer proof, high surface quality.Application areas: Fittings for ovens and dishwashers, t..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 4109 Phenolic Formaldehyde Resin, Improved Electrical Properties, Ammonia Free, Resistant to High Temperatures, Low Shrinkage, High Arc Resistance, UL Listed, Acetic Acid Free Phenolic molding compound, inorganically filled, glass fiber reinforced, ammonia and acetic acid free, electrically high grade, high temperature stability, low shrinkage, high mechanical strength, U..
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ 151733 Phenolic Formaldehyde Resin (discontinued **) Phenolic molding compound, mainly organically filled, standard molding compound for normal stress.Application areas: Contact strips.Information provided by Bak AGBak AG became a part of Hexion in 20..
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi	Mold Pressure
Beijing Chemical Industry KAIFA® GL5100 ABS Extrusion Grade Non-toxic, Superior impact strength at low temp., High gloss, Uniform sheet thickness for vacuum moldingInformation provided by Beijing Chemical Industry Research Institute (Group)
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPC GF5020 PB Polypropylene Copolymer, Glass Fiber Reinforced, Chemically Coupled Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH T8020 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH TS15010 H VTUV1 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH TS4020 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH TS5040DS Polypropylene Homopolymer, Mineral Reinforced, Detergent Resistant Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPH TS8038 Polypropylene Homopolymer, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPHC K8040G E10 Polypropylene, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPHC K9020 Polypropylene, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	1.00 - 2.00 MPa	145 - 290 psi
Polykemi AB POLYfill PPHC T11030 Polypropylene, Mineral Reinforced Information provided by Polykemi AB
Back Pressure	0.500 - 2.00 MPa	72.5 - 290 psi	Injection molding
Hexion Bakelite™ PF 4155 Phenolic Formaldehyde Resin, Resistant to High Temperatures, Improved Electrical Properties, Low Shrinkage, High Mechanical Strength Phenolic molding compound, inorganically filled, glass fiber reinforced, good media and temperature resistance. Conditioned Cu-adhesion.Application areas: Commutators (fuel pumps, actuators, starte..